PL3772089T3 - Urządzenie do manipulowania podłożem do płytek półprzewodnikowych - Google Patents
Urządzenie do manipulowania podłożem do płytek półprzewodnikowychInfo
- Publication number
- PL3772089T3 PL3772089T3 PL19189179T PL19189179T PL3772089T3 PL 3772089 T3 PL3772089 T3 PL 3772089T3 PL 19189179 T PL19189179 T PL 19189179T PL 19189179 T PL19189179 T PL 19189179T PL 3772089 T3 PL3772089 T3 PL 3772089T3
- Authority
- PL
- Poland
- Prior art keywords
- wafer
- handling device
- substrate handling
- substrate
- handling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19189179.5A EP3772089B1 (en) | 2019-07-30 | 2019-07-30 | Substrate handling device for a wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3772089T3 true PL3772089T3 (pl) | 2021-10-25 |
Family
ID=67544006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL19189179T PL3772089T3 (pl) | 2019-07-30 | 2019-07-30 | Urządzenie do manipulowania podłożem do płytek półprzewodnikowych |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20220262668A1 (pl) |
| EP (1) | EP3772089B1 (pl) |
| JP (1) | JP7268208B2 (pl) |
| KR (1) | KR102497963B1 (pl) |
| CN (1) | CN113795911A (pl) |
| MY (1) | MY197493A (pl) |
| PL (1) | PL3772089T3 (pl) |
| PT (1) | PT3772089T (pl) |
| SG (1) | SG11202111080UA (pl) |
| WO (1) | WO2021019018A1 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542777B (zh) * | 2024-01-09 | 2024-04-09 | 无锡星微科技有限公司杭州分公司 | 高速高精度搬运装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USH1373H (en) * | 1992-04-06 | 1994-11-01 | American Telephone And Telegraph Company | Wafer handling apparatus and method |
| JP3797571B2 (ja) * | 1996-12-03 | 2006-07-19 | Ｓｍｃ株式会社 | ワーク吸着装置 |
| US5937993A (en) * | 1997-01-14 | 1999-08-17 | Tamarac Scientific Co., Inc. | Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure |
| US6517130B1 (en) * | 2000-03-14 | 2003-02-11 | Applied Materials, Inc. | Self positioning vacuum chuck |
| US9691651B2 (en) * | 2005-01-28 | 2017-06-27 | Brooks Automation, Inc. | Substrate handling system for aligning and orienting substrates during a transfer operation |
| KR20100077523A (ko) * | 2008-12-29 | 2010-07-08 | 윤점채 | 웨이퍼 이송 아암 |
| KR20110101808A (ko) * | 2010-03-10 | 2011-09-16 | 주식회사 엘지실트론 | 웨이퍼 이송장치 |
| JP5345167B2 (ja) * | 2011-03-18 | 2013-11-20 | 東京エレクトロン株式会社 | 基板保持装置 |
| US8967935B2 (en) * | 2011-07-06 | 2015-03-03 | Tel Nexx, Inc. | Substrate loader and unloader |
| US9991152B2 (en) * | 2014-03-06 | 2018-06-05 | Cascade Microtech, Inc. | Wafer-handling end effectors with wafer-contacting surfaces and sealing structures |
| JP6349343B2 (ja) * | 2016-05-02 | 2018-06-27 | Ｔｏｗａ株式会社 | 吸着ユニット、板状部材搬送ユニット、樹脂封止装置、板状部材搬送方法および樹脂封止方法 |
| NL2018243B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
| US10663434B2 (en) * | 2017-03-31 | 2020-05-26 | Sonix, Inc. | Wafer chuck |
| JP6442563B1 (ja) * | 2017-05-30 | 2018-12-19 | キヤノン株式会社 | 搬送ハンド、搬送装置、リソグラフィ装置、物品の製造方法及び保持機構 |
-
2019
- 2019-07-30 PL PL19189179T patent/PL3772089T3/pl unknown
- 2019-07-30 EP EP19189179.5A patent/EP3772089B1/en active Active
- 2019-07-30 PT PT191891795T patent/PT3772089T/pt unknown
-
2020
- 2020-07-30 CN CN202080033824.2A patent/CN113795911A/zh active Pending
- 2020-07-30 WO PCT/EP2020/071516 patent/WO2021019018A1/en active Application Filing
- 2020-07-30 US US17/630,642 patent/US20220262668A1/en active Pending
- 2020-07-30 MY MYPI2021006017A patent/MY197493A/en unknown
- 2020-07-30 KR KR1020217041924A patent/KR102497963B1/ko active IP Right Grant
- 2020-07-30 JP JP2021576984A patent/JP7268208B2/ja active Active
- 2020-07-30 SG SG11202111080UA patent/SG11202111080UA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SG11202111080UA (en) | 2021-11-29 |
| MY197493A (en) | 2023-06-19 |
| JP2022542539A (ja) | 2022-10-05 |
| JP7268208B2 (ja) | 2023-05-02 |
| KR20220011171A (ko) | 2022-01-27 |
| US20220262668A1 (en) | 2022-08-18 |
| KR102497963B1 (ko) | 2023-02-08 |
| CN113795911A (zh) | 2021-12-14 |
| EP3772089A1 (en) | 2021-02-03 |
| WO2021019018A1 (en) | 2021-02-04 |
| EP3772089B1 (en) | 2021-05-26 |
| PT3772089T (pt) | 2021-06-28 |
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