JP2016039215A5 - - Google Patents
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- Publication number
- JP2016039215A5 JP2016039215A5 JP2014160719A JP2014160719A JP2016039215A5 JP 2016039215 A5 JP2016039215 A5 JP 2016039215A5 JP 2014160719 A JP2014160719 A JP 2014160719A JP 2014160719 A JP2014160719 A JP 2014160719A JP 2016039215 A5 JP2016039215 A5 JP 2016039215A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- semiconductor
- layer
- semiconductor layer
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 50
- 239000010410 layer Substances 0.000 claims 41
- 239000000758 substrate Substances 0.000 claims 19
- 239000004020 conductor Substances 0.000 claims 16
- 239000011229 interlayer Substances 0.000 claims 10
- 238000005530 etching Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014160719A JP6245107B2 (ja) | 2014-08-06 | 2014-08-06 | 半導体装置及び半導体装置の製造方法 |
| US15/325,954 US9966372B2 (en) | 2014-08-06 | 2015-06-08 | Semiconductor device and method of manufacturing semiconductor device having parallel contact holes between adjacent trenches |
| PCT/JP2015/066523 WO2016021299A1 (ja) | 2014-08-06 | 2015-06-08 | 半導体装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014160719A JP6245107B2 (ja) | 2014-08-06 | 2014-08-06 | 半導体装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016039215A JP2016039215A (ja) | 2016-03-22 |
| JP2016039215A5 true JP2016039215A5 (enExample) | 2016-12-08 |
| JP6245107B2 JP6245107B2 (ja) | 2017-12-13 |
Family
ID=55263577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014160719A Active JP6245107B2 (ja) | 2014-08-06 | 2014-08-06 | 半導体装置及び半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9966372B2 (enExample) |
| JP (1) | JP6245107B2 (enExample) |
| WO (1) | WO2016021299A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6673088B2 (ja) * | 2016-08-05 | 2020-03-25 | トヨタ自動車株式会社 | 半導体装置 |
| WO2018092787A1 (ja) * | 2016-11-17 | 2018-05-24 | 富士電機株式会社 | 半導体装置 |
| US10510832B2 (en) | 2017-07-14 | 2019-12-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP7143575B2 (ja) | 2017-07-18 | 2022-09-29 | 富士電機株式会社 | 半導体装置 |
| JP6958210B2 (ja) * | 2017-10-11 | 2021-11-02 | 株式会社デンソー | 半導体装置 |
| JP7687114B2 (ja) * | 2021-07-29 | 2025-06-03 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4797265B2 (ja) * | 2001-03-21 | 2011-10-19 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2011044494A (ja) | 2009-08-19 | 2011-03-03 | Panasonic Corp | 半導体装置およびその製造方法 |
| JP5566272B2 (ja) * | 2010-11-26 | 2014-08-06 | 三菱電機株式会社 | 半導体装置 |
| US9608071B2 (en) | 2012-02-14 | 2017-03-28 | Toyota Jidosha Kabushiki Kaisha | IGBT and IGBT manufacturing method |
| JP2014013850A (ja) * | 2012-07-05 | 2014-01-23 | Sumitomo Electric Ind Ltd | 炭化珪素基板および半導体装置の製造方法、ならびに炭化珪素基板および半導体装置 |
| JP6112600B2 (ja) | 2012-12-10 | 2017-04-12 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| DE112012007249B4 (de) | 2012-12-20 | 2021-02-04 | Denso Corporation | Halbleitervorrichtung |
-
2014
- 2014-08-06 JP JP2014160719A patent/JP6245107B2/ja active Active
-
2015
- 2015-06-08 US US15/325,954 patent/US9966372B2/en active Active
- 2015-06-08 WO PCT/JP2015/066523 patent/WO2016021299A1/ja not_active Ceased
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