JP2016036150A - 信号伝送ケーブル、および通信機器モジュール - Google Patents
信号伝送ケーブル、および通信機器モジュール Download PDFInfo
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- JP2016036150A JP2016036150A JP2015193884A JP2015193884A JP2016036150A JP 2016036150 A JP2016036150 A JP 2016036150A JP 2015193884 A JP2015193884 A JP 2015193884A JP 2015193884 A JP2015193884 A JP 2015193884A JP 2016036150 A JP2016036150 A JP 2016036150A
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- 230000008054 signal transmission Effects 0.000 title claims abstract description 181
- 238000004891 communication Methods 0.000 title claims description 32
- 239000004020 conductor Substances 0.000 claims abstract description 861
- 239000000463 material Substances 0.000 claims abstract description 228
- 239000003990 capacitor Substances 0.000 claims abstract description 128
- 239000010410 layer Substances 0.000 claims description 244
- 239000011229 interlayer Substances 0.000 claims description 90
- 239000000758 substrate Substances 0.000 claims description 37
- 238000003475 lamination Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 72
- 101001109993 Artemia salina 60S acidic ribosomal protein P2 Proteins 0.000 description 35
- 230000008878 coupling Effects 0.000 description 29
- 238000010168 coupling process Methods 0.000 description 29
- 238000005859 coupling reaction Methods 0.000 description 29
- 230000002093 peripheral effect Effects 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000000149 penetrating effect Effects 0.000 description 10
- 238000010030 laminating Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000002238 attenuated effect Effects 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000001413 cellular effect Effects 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 230000010267 cellular communication Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0123—Frequency selective two-port networks comprising distributed impedance elements together with lumped impedance elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Filters And Equalizers (AREA)
- Coils Or Transformers For Communication (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Transceivers (AREA)
- Insulated Conductors (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Abstract
Description
100,100A,100B,100C,100D,100E,100F,100G,100H,100I,100J,100K,100L,100M:素体
101,102,101A,102A,101B,102B,101C,102C,103C,101D,102D,101E,102E,104E,101F,102F,103F,101G,102G,101H,102H,103H,104H,101I,102I,103I,104I,101J,102J,103J,104J,101K,102K,103K,104K,101L,102L,101M,102M,103M,104M:基材層
101M1,101M2,101M3,102M1,101M2,102M3,103M1,103M2,103M3,104M1,104M2,104M3:部分領域
110,110A,120A,110B,120B,110C,120C,110D,110E,120E,110F,120F,110G,110H,110I,110J,110L:レジスト膜
90:ダイプレクサ型の信号伝送ケーブル
111,112:開口部
160:貫通穴
210,220,210A,220A,210B,220B,210C,220C,230C,210D,220D,220E,220E1,220E2、210F,220F,230F:信号線路用の導体パターン
211,222,223,211A,214A,223A,211B,214B,223B,211C,214C,223C,232C,221D,214D,223D,211E211F,214F,224F:伝送用導体部
212,221,212A,221A,212B,221B,212C,221C,231C,212D,221D,212F,221F:キャパシタ用導体部
213,213A,213B,213C,213D,224D,213E,213F,225F:インダクタ用導体部
311,312,322,332:外部接続用導体
331:外部接続用補助導体
401,402,401A,402A,401B,401C,402C,403C,401D,402D,401E,402E,403E,421E,422E,461,462,463,464,465,466,471,472,472’,473,474,475,475’:層間接続導体
501,502:コネクタ
610,610L,620,620L,630,640:信号線路用の導体パターン
611,621,631,641:第1導体部
612,622,632,642:第2導体部
613,623,633,643:第3導体部
614,624,634,644:第4導体部
615,625,635,645:第5導体部
616,626:引き回し導体
711,712,721,722,731,731’,732,741,7410,741’:信号線路用の導体パターン
7111,7211,7311,7311’,7411,7411’:第1線状部
7112,7212,7312,7312’ ,7412,7412’:第2線状部
7113,7213,7313,7313’,7413,7413’:第3線状部
7114,7314,7314’,7414,7414’:第4線状部
7415:追加線状部
801M1,803M1,801M2,802M1,802M2:導体パターン
801M11,801M21,802M11,802M21:第1部分導体パターン
801M12,801M22,802M12,802M22:第2部分導体パターン
810M1,810M2:容量結合用導体パターン
860:接続導体
900:通信機器モジュール
901:アンテナ
911:WiFi送受信部
912:セルラー送受信部
913:GPS受信部
921:帯域阻止フィルタ(BEF)
922:帯域通過フィルタ(BPF)
990:フロントエンド基板
991:アンテナ基板
Claims (6)
- 第1外部接続端子と第2外部接続端子とを接続する信号伝送線路と、
該信号伝送線路が導体パターンによって形成された平板状の素体と、
前記信号伝送線路によって前記第1外部接続端子と前記第2外部接続端子との間に接続され、前記素体に内蔵または形成されたインダクタおよびキャパシタを有するフィルタと、
を備え、
前記素体は、複数の基材層を積層した積層体からなり、
前記インダクタは、前記複数の基材層の端部に沿って周回形成された線状導体パターンと前記基材層に形成された前記線状導体パターンどうしを接続する層間接続導体のみからなり、
前記キャパシタは前記線状導体パターンの積層方向に対向する部分からなる、
高周波フィルタ機能付き信号伝送ケーブル。 - 前記線状導体パターンが3層以上からなり、
積層方向に異なる位置で、複数箇所で対向している、
請求項1に記載の高周波フィルタ機能付き信号伝送ケーブル。 - 前記素体は、可撓性である、
請求項1または請求項2に記載の高周波フィルタ機能付き信号伝送ケーブル。 - 前記素体は、前記第1外部電極端子の配置位置と前記第2外部接続端子の配置位置の途中に屈曲部を有する、
請求項1ないし請求項3のいずれかに記載の高周波フィルタ機能付き信号伝送ケーブル。 - 前記第1外部接続端子および第2外部接続端子の少なくとも一方が、外部回路に対して機械的に接触することで電気的に接続するコネクタ部材を備える、
請求項1ないし請求項4のいずれかに記載の高周波フィルタ機能付き信号伝送ケーブル。 - 請求項1ないし請求項5のいずれかに記載の高周波フィルタ機能付き信号伝送ケーブルと、
前記第1外部接続端子に接続するアンテナ基板と、前記第2接続端子に接続するフロントエンド基板とを備える、
通信機器モジュール。
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JP2015193884A JP6115608B2 (ja) | 2013-05-15 | 2015-09-30 | 高周波フィルタ、および通信機器モジュール |
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JP2013128827 | 2013-06-19 | ||
JP2013128827 | 2013-06-19 | ||
JP2015193884A JP6115608B2 (ja) | 2013-05-15 | 2015-09-30 | 高周波フィルタ、および通信機器モジュール |
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US (2) | US9887446B2 (ja) |
JP (2) | JP5817951B2 (ja) |
CN (2) | CN205793599U (ja) |
WO (1) | WO2014185231A1 (ja) |
Cited By (1)
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JP2017195294A (ja) * | 2016-04-21 | 2017-10-26 | 株式会社村田製作所 | 電子部品 |
Families Citing this family (8)
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WO2016167171A1 (ja) | 2015-04-17 | 2016-10-20 | 株式会社村田製作所 | 共振回路、帯域阻止フィルタおよび帯域通過フィルタ |
JP6369634B2 (ja) * | 2015-07-22 | 2018-08-08 | 株式会社村田製作所 | Lcフィルタ |
JP6206625B1 (ja) * | 2015-12-02 | 2017-10-04 | 株式会社村田製作所 | フィルタ回路付き配線基板および電子機器 |
KR102567364B1 (ko) * | 2016-01-27 | 2023-08-16 | 삼성전자주식회사 | 안테나 보조 장치 및 이를 포함하는 전자 장치 |
JP2018182206A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社村田製作所 | コイル部品 |
CN107995770B (zh) * | 2017-11-10 | 2021-04-02 | 惠科股份有限公司 | 一种柔性扁平排线和显示面板 |
US11122677B2 (en) * | 2019-11-15 | 2021-09-14 | Marvell Asia Pte, Ltd. | Printed circuit board structure and method for inductive noise cancellation |
US11736084B2 (en) * | 2021-06-25 | 2023-08-22 | Knowles Cazenovia, Inc. | Tunable electrical component having distributed-element circuit |
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US10249431B2 (en) | 2016-04-21 | 2019-04-02 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
Publication number | Publication date |
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WO2014185231A1 (ja) | 2014-11-20 |
US20180115037A1 (en) | 2018-04-26 |
JP5817951B2 (ja) | 2015-11-18 |
US10056667B2 (en) | 2018-08-21 |
US9887446B2 (en) | 2018-02-06 |
CN205265992U (zh) | 2016-05-25 |
JPWO2014185231A1 (ja) | 2017-02-23 |
CN205793599U (zh) | 2016-12-07 |
JP6115608B2 (ja) | 2017-04-19 |
US20160028358A1 (en) | 2016-01-28 |
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