JP2015537123A5 - - Google Patents

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JP2015537123A5
JP2015537123A5 JP2015546894A JP2015546894A JP2015537123A5 JP 2015537123 A5 JP2015537123 A5 JP 2015537123A5 JP 2015546894 A JP2015546894 A JP 2015546894A JP 2015546894 A JP2015546894 A JP 2015546894A JP 2015537123 A5 JP2015537123 A5 JP 2015537123A5
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Japan
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power supply
electrolyte
anodes
soluble
insoluble
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JP2015546894A
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English (en)
Japanese (ja)
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JP2015537123A (ja
JP6169719B2 (ja
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Priority claimed from DE102012024758.3A external-priority patent/DE102012024758B4/de
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Publication of JP2015537123A5 publication Critical patent/JP2015537123A5/ja
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JP2015546894A 2012-12-18 2013-12-09 物体の電解コーティングのためのデバイス及び方法 Active JP6169719B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012024758.3 2012-12-18
DE102012024758.3A DE102012024758B4 (de) 2012-12-18 2012-12-18 Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung
PCT/EP2013/003710 WO2014094998A1 (de) 2012-12-18 2013-12-09 Vorrichtung und verfahren zum elektrolytischen beschichten eines gegenstandes

Publications (3)

Publication Number Publication Date
JP2015537123A JP2015537123A (ja) 2015-12-24
JP2015537123A5 true JP2015537123A5 (https=) 2016-04-14
JP6169719B2 JP6169719B2 (ja) 2017-07-26

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ID=49841627

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JP2015546894A Active JP6169719B2 (ja) 2012-12-18 2013-12-09 物体の電解コーティングのためのデバイス及び方法

Country Status (10)

Country Link
US (1) US10047449B2 (https=)
EP (1) EP2935661B1 (https=)
JP (1) JP6169719B2 (https=)
CN (1) CN104685112A (https=)
DE (1) DE102012024758B4 (https=)
ES (1) ES3055815T3 (https=)
MX (1) MX348141B (https=)
PL (1) PL2935661T3 (https=)
RU (1) RU2635058C2 (https=)
WO (1) WO2014094998A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
JP6423320B2 (ja) * 2015-06-25 2018-11-14 田中貴金属工業株式会社 めっき装置及びめっき方法
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
WO2018053158A1 (en) * 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
EP4010516A1 (de) * 2019-08-05 2022-06-15 SMS Group GmbH Verfahren und anlage zum elektrolytischen beschichten eines elektrisch leitfähigen bandes und/oder gewebes mittels pulstechnik
US12209323B2 (en) * 2020-12-08 2025-01-28 Honeywell International Inc. Electroplating shield device and methods of fabricating the same
RU2751355C1 (ru) * 2021-02-26 2021-07-13 Акционерное общество "Саратовское предприятие промышленной электроники и энергетики" (АО "Промэлектроника") Способ нанесения гальванического покрытия на прецизионные металлические нити и установка для его реализации

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1465034A (en) 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
US2823180A (en) * 1953-11-25 1958-02-11 Rothschild Edgar Method and means for coating wires
US4169780A (en) * 1977-05-24 1979-10-02 Societe Les Piles Wonder Process and apparatus for making negative electrodes, in particular in cadmium or zinc, for electrochemical generators, and the negative electrodes thus obtained
FR2392502A1 (fr) 1977-05-24 1978-12-22 Wonder Procede et dispositif pour fabriquer des electrodes negatives, notamment en cadmium ou en zinc, pour generateurs electrochimiques et electrodes negatives ainsi obtenues
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
US4514266A (en) * 1981-09-11 1985-04-30 Republic Steel Corporation Method and apparatus for electroplating
JPS6386886A (ja) * 1986-09-29 1988-04-18 Nippon Steel Corp 電気合金めつき帯鋼の製造方法
JPS63317698A (ja) * 1987-06-20 1988-12-26 Toyota Motor Corp 電気めっき液の金属イオン濃度と水素イオン濃度の制御装置
CN87211969U (zh) * 1987-08-22 1988-07-20 北京高熔金属材料厂 钨丝镀金用连续电镀装置
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil
JPH04191394A (ja) * 1990-11-26 1992-07-09 Furukawa Electric Co Ltd:The 銅被覆鋼線の製造方法
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
US5100517A (en) 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
DE4235227A1 (de) 1992-10-13 1994-04-14 Galvanotechnik Juergen Rossman Verfahren zur Metallkonzentrations-Stabilisierung im Elektrolyten eines sauren Kupferbades bei der Verkupferung von Tiefdruckzylindern in der Druckindustrie
JP2943551B2 (ja) * 1993-02-10 1999-08-30 ヤマハ株式会社 メッキ方法及びその装置
DE19539865A1 (de) 1995-10-26 1997-04-30 Lea Ronal Gmbh Durchlauf-Galvanikanlage
CN1477238A (zh) * 2002-08-20 2004-02-25 株式会社Smc 电镀装置
RU2431000C2 (ru) * 2009-06-22 2011-10-10 Николай Иванович Толкачев Способ электролитического никелирования

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