CN104685112A - 用于对目标物电解涂覆的设备和方法 - Google Patents

用于对目标物电解涂覆的设备和方法 Download PDF

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Publication number
CN104685112A
CN104685112A CN201380049504.6A CN201380049504A CN104685112A CN 104685112 A CN104685112 A CN 104685112A CN 201380049504 A CN201380049504 A CN 201380049504A CN 104685112 A CN104685112 A CN 104685112A
Authority
CN
China
Prior art keywords
electrolyte
direct current
power source
source
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380049504.6A
Other languages
English (en)
Chinese (zh)
Inventor
达格玛·洛伦兹
克劳斯·梅宁根
马库斯·拉布
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KraussMaffei Extrusion GmbH
Original Assignee
Berstorff GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berstorff GmbH filed Critical Berstorff GmbH
Publication of CN104685112A publication Critical patent/CN104685112A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201380049504.6A 2012-12-18 2013-12-09 用于对目标物电解涂覆的设备和方法 Pending CN104685112A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012024758.3 2012-12-18
DE102012024758.3A DE102012024758B4 (de) 2012-12-18 2012-12-18 Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung
PCT/EP2013/003710 WO2014094998A1 (de) 2012-12-18 2013-12-09 Vorrichtung und verfahren zum elektrolytischen beschichten eines gegenstandes

Publications (1)

Publication Number Publication Date
CN104685112A true CN104685112A (zh) 2015-06-03

Family

ID=49841627

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380049504.6A Pending CN104685112A (zh) 2012-12-18 2013-12-09 用于对目标物电解涂覆的设备和方法

Country Status (10)

Country Link
US (1) US10047449B2 (https=)
EP (1) EP2935661B1 (https=)
JP (1) JP6169719B2 (https=)
CN (1) CN104685112A (https=)
DE (1) DE102012024758B4 (https=)
ES (1) ES3055815T3 (https=)
MX (1) MX348141B (https=)
PL (1) PL2935661T3 (https=)
RU (1) RU2635058C2 (https=)
WO (1) WO2014094998A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107012497A (zh) * 2015-10-20 2017-08-04 亚洲电镀器材有限公司 一种电镀机和电镀方法
CN114174559A (zh) * 2019-08-05 2022-03-11 Sms集团有限公司 使用脉冲技术对导电带材和/或织物进行电解涂层的方法和设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
JP6423320B2 (ja) * 2015-06-25 2018-11-14 田中貴金属工業株式会社 めっき装置及びめっき方法
WO2018053158A1 (en) * 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
US12209323B2 (en) * 2020-12-08 2025-01-28 Honeywell International Inc. Electroplating shield device and methods of fabricating the same
RU2751355C1 (ru) * 2021-02-26 2021-07-13 Акционерное общество "Саратовское предприятие промышленной электроники и энергетики" (АО "Промэлектроника") Способ нанесения гальванического покрытия на прецизионные металлические нити и установка для его реализации

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1465034A (en) * 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
US4419192A (en) * 1980-03-27 1983-12-06 Schering Aktiengesellschaft Method for galvanic deposition of copper
CN87211969U (zh) * 1987-08-22 1988-07-20 北京高熔金属材料厂 钨丝镀金用连续电镀装置
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
CN1061055A (zh) * 1990-10-30 1992-05-13 古尔德有限公司 对金属箔进行表面处理的方法和装置
DE4235227A1 (de) * 1992-10-13 1994-04-14 Galvanotechnik Juergen Rossman Verfahren zur Metallkonzentrations-Stabilisierung im Elektrolyten eines sauren Kupferbades bei der Verkupferung von Tiefdruckzylindern in der Druckindustrie
US5441620A (en) * 1993-02-10 1995-08-15 Yamaha Corporation Electroplating apparatus
CN1477238A (zh) * 2002-08-20 2004-02-25 株式会社Smc 电镀装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2823180A (en) * 1953-11-25 1958-02-11 Rothschild Edgar Method and means for coating wires
US4169780A (en) * 1977-05-24 1979-10-02 Societe Les Piles Wonder Process and apparatus for making negative electrodes, in particular in cadmium or zinc, for electrochemical generators, and the negative electrodes thus obtained
FR2392502A1 (fr) 1977-05-24 1978-12-22 Wonder Procede et dispositif pour fabriquer des electrodes negatives, notamment en cadmium ou en zinc, pour generateurs electrochimiques et electrodes negatives ainsi obtenues
US4514266A (en) * 1981-09-11 1985-04-30 Republic Steel Corporation Method and apparatus for electroplating
JPS6386886A (ja) * 1986-09-29 1988-04-18 Nippon Steel Corp 電気合金めつき帯鋼の製造方法
JPS63317698A (ja) * 1987-06-20 1988-12-26 Toyota Motor Corp 電気めっき液の金属イオン濃度と水素イオン濃度の制御装置
JPH04191394A (ja) * 1990-11-26 1992-07-09 Furukawa Electric Co Ltd:The 銅被覆鋼線の製造方法
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
DE19539865A1 (de) 1995-10-26 1997-04-30 Lea Ronal Gmbh Durchlauf-Galvanikanlage
RU2431000C2 (ru) * 2009-06-22 2011-10-10 Николай Иванович Толкачев Способ электролитического никелирования

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1465034A (en) * 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
US4419192A (en) * 1980-03-27 1983-12-06 Schering Aktiengesellschaft Method for galvanic deposition of copper
CN87211969U (zh) * 1987-08-22 1988-07-20 北京高熔金属材料厂 钨丝镀金用连续电镀装置
CN1061055A (zh) * 1990-10-30 1992-05-13 古尔德有限公司 对金属箔进行表面处理的方法和装置
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
DE4235227A1 (de) * 1992-10-13 1994-04-14 Galvanotechnik Juergen Rossman Verfahren zur Metallkonzentrations-Stabilisierung im Elektrolyten eines sauren Kupferbades bei der Verkupferung von Tiefdruckzylindern in der Druckindustrie
US5441620A (en) * 1993-02-10 1995-08-15 Yamaha Corporation Electroplating apparatus
CN1477238A (zh) * 2002-08-20 2004-02-25 株式会社Smc 电镀装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107012497A (zh) * 2015-10-20 2017-08-04 亚洲电镀器材有限公司 一种电镀机和电镀方法
CN107012497B (zh) * 2015-10-20 2020-06-02 亚洲电镀器材有限公司 一种电镀机和电镀方法
CN114174559A (zh) * 2019-08-05 2022-03-11 Sms集团有限公司 使用脉冲技术对导电带材和/或织物进行电解涂层的方法和设备

Also Published As

Publication number Publication date
DE102012024758A1 (de) 2014-06-18
US10047449B2 (en) 2018-08-14
MX2015004743A (es) 2015-07-23
WO2014094998A1 (de) 2014-06-26
DE102012024758B4 (de) 2024-02-01
US20150284867A1 (en) 2015-10-08
JP2015537123A (ja) 2015-12-24
MX348141B (es) 2017-05-30
BR112015012707A2 (pt) 2017-07-11
JP6169719B2 (ja) 2017-07-26
EP2935661B1 (de) 2025-09-10
RU2015117784A (ru) 2017-01-23
EP2935661A1 (de) 2015-10-28
ES3055815T3 (en) 2026-02-16
PL2935661T3 (pl) 2026-03-02
RU2635058C2 (ru) 2017-11-08

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Application publication date: 20150603