JP2015533895A - 接着剤組成物及び接着テープ - Google Patents
接着剤組成物及び接着テープ Download PDFInfo
- Publication number
- JP2015533895A JP2015533895A JP2015533403A JP2015533403A JP2015533895A JP 2015533895 A JP2015533895 A JP 2015533895A JP 2015533403 A JP2015533403 A JP 2015533403A JP 2015533403 A JP2015533403 A JP 2015533403A JP 2015533895 A JP2015533895 A JP 2015533895A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- adhesive
- photoinitiator
- adhesive composition
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 130
- 239000000853 adhesive Substances 0.000 title claims abstract description 72
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 72
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 26
- 239000003063 flame retardant Substances 0.000 claims abstract description 45
- 239000004593 Epoxy Substances 0.000 claims abstract description 39
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 35
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 23
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 52
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 39
- 239000012790 adhesive layer Substances 0.000 claims description 34
- -1 acylated sulfonylurea oxygen radical ketone Chemical class 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 239000000178 monomer Substances 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229920000058 polyacrylate Polymers 0.000 claims description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 11
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 7
- 239000002952 polymeric resin Substances 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 5
- 150000004692 metal hydroxides Chemical class 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 3
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 125000005410 aryl sulfonium group Chemical group 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000007770 graphite material Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000002562 thickening agent Substances 0.000 claims description 2
- 229920002799 BoPET Polymers 0.000 claims 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 claims 1
- 150000001642 boronic acid derivatives Chemical class 0.000 claims 1
- 239000000975 dye Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 23
- 238000012360 testing method Methods 0.000 description 21
- 239000000047 product Substances 0.000 description 17
- 239000002904 solvent Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 239000011231 conductive filler Substances 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 6
- 229910052582 BN Inorganic materials 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- 239000012952 cationic photoinitiator Substances 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002118 epoxides Chemical class 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- 230000002195 synergetic effect Effects 0.000 description 4
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 4
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920013701 VORANOL™ Polymers 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920003346 Levapren® Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001463 metal phosphate Inorganic materials 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 125000000466 oxiranyl group Chemical group 0.000 description 2
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- ADSJQLCBJDWPBJ-UHFFFAOYSA-N (4-methyl-7-oxabicyclo[4.1.0]heptan-4-yl) 3-(3-ethyloxiran-2-yl)-2-methylpropanoate Chemical compound CCC1OC1CC(C)C(=O)OC1(C)CC2OC2CC1 ADSJQLCBJDWPBJ-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- DLEWDCPFCNLJEY-UHFFFAOYSA-N 1-morpholin-4-ylpropan-1-one Chemical compound CCC(=O)N1CCOCC1 DLEWDCPFCNLJEY-UHFFFAOYSA-N 0.000 description 1
- GHTVHGGJFHMYBA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCOC(=O)C1CC2OC2CC1 GHTVHGGJFHMYBA-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 101150082840 SM30 gene Proteins 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical class [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- FIBARIGPBPUBHC-UHFFFAOYSA-N octyl 8-(3-octyloxiran-2-yl)octanoate Chemical compound CCCCCCCCOC(=O)CCCCCCCC1OC1CCCCCCCC FIBARIGPBPUBHC-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- ATLPLEZDTSBZQG-UHFFFAOYSA-N propan-2-ylphosphonic acid Chemical compound CC(C)P(O)(O)=O ATLPLEZDTSBZQG-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
- C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C08L31/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1476—Release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
(a)5〜70重量%のエポキシ成分と、
(b)5〜60重量%の熱伝導性材料と、
(c)0.001〜10重量%の光開始剤と、
(d)0〜40重量%の熱可塑性ポリマーと、
(e)0〜50重量%のヒドロキシル官能性成分と、
(f)0〜50重量%のハロゲンフリー難燃剤と、を含む、熱伝導性感圧接着剤組成物を提供する。
(i)裏材層と、
(ii)裏材層の少なくとも片面に設けられた熱伝導性感圧接着剤層であって、接着剤層の総重量に基づいて、
(a)5〜70重量%のエポキシ成分と、
(b)5〜60重量%の熱伝導性材料と、
(c)0.001〜10重量%の光開始剤と、
(d)0〜40重量%の熱可塑性ポリマーと、
(e)0〜50重量%のヒドロキシル官能性成分と、
(f)0〜50重量%のハロゲンフリー難燃剤と、を含む、熱伝導性感圧接着剤層と、を備える、熱伝導性感圧接着剤テープを提供する。
(a)5〜70重量%のエポキシ成分と、
(b)5〜60重量%の熱伝導性材料と、
(c)0.001〜10重量%の光開始剤と、
(d)0〜40重量%の熱可塑性ポリマーと、
(e)0〜50重量%のヒドロキシル官能性成分と、
(f)0〜50重量%のハロゲンフリー難燃剤と、を含む、熱伝導性接着剤組成物が提供される。
(a)5〜60重量%のエポキシ成分と、
(b)10〜50重量%の熱伝導性材料と、
(c)0.1〜8重量%の光開始剤と、
(d)1〜40重量の%熱可塑性ポリマーと、
(e)0〜20重量%のヒドロキシル官能性成分と、
(f)0〜40重量%のハロゲンフリー難燃剤と、を含む、熱伝導性接着剤組成物が提供される。
(a)10〜50重量%のエポキシ成分と、
(b)15〜40重量%の熱伝導性材料と、
(c)0.1〜6重量%の光開始剤と、
(d)2〜30重量%の熱可塑性ポリマーと、
(e)0〜10重量%のヒドロキシル官能性成分と、
(f)0〜30重量%のハロゲンフリー難燃剤と、を含む、熱伝導性接着剤組成物が提供される。
(a)15〜45重量%のエポキシ成分と、
(b)20〜40重量%の熱伝導性材料と、
(c)0.5〜4重量%の光開始剤と、
(d)5〜25重量%の熱可塑性ポリマーと、
(e)1〜5重量%のヒドロキシル官能性成分と、
(f)1〜25重量%のハロゲンフリー難燃剤と、を含む、熱伝導性接着剤組成物が提供される。
(i)裏材層と、
(ii)本発明の上記のいずれか1つの実施形態において提供される熱伝導性接着剤組成物を含み、裏材層の少なくとも片面に設けられた、熱伝導性感圧接着剤層と、を備える、熱伝導性感圧接着テープを提供する。
本明細書に記載のエポキシ成分は、1種類以上のエポキシ樹脂及び/又はモノマーを含み、接着構造構成の形成に使用される。
本発明の組成物は、熱伝導性充填剤など熱伝導性材料を含む。熱伝導性に加えて高い電気絶縁性を得るために、好ましくは電気絶縁性かつ熱伝導性の充填剤が使用される。好適な材料としては、セラミック、金属酸化物、金属窒化物、及び金属水酸化物、例えば、Al(OH)3、BN、SiC、AlN、Al2O3、Si3N4などが挙げられるが、これらに限定されない。熱伝導性材料は、好ましくは100W/m・k以上の熱伝導率を有する。これらの材料は、単独で、又はこれらの2種類以上を組み合わせて使用され得る。熱伝導性材料の量は、所望の熱伝導性と接着組成物の好適な凝集とのバランスを考慮して、組成物又は接着剤層の総重量(100重量%)に基づいて、約5〜60重量%、好ましくは約10〜50重量%、更により好ましくは約15〜40重量%、最も好ましくは約20〜40重量%の範囲である。粒径の異なる充填剤を組み合わせて同時に使用することができる。好ましい平均粒径は、層の厚さに応じて、約0.01〜50μmの範囲である。本発明の接着剤又はテープは、感圧接着剤結合用途向けの10〜500μm、好ましくは30〜300μmの厚さを有する製品として作製され得る。熱伝導性充填剤の寸法は、片面にコーティングされた乾燥接着剤層の厚さ、又は裏材層に任意の技術手段で取り付けられたか、位置付けられた乾燥接着剤層の厚さ以下になる。
本接着剤組成物又はテープはまた、感圧接着剤を架橋するための硬化剤として有効量の光開始剤成分を含む。本発明で用いるための光開始剤は、望ましくは、光化学的手段、例えば、化学線(すなわち、紫外線、又は電磁スペクトルの可視部分の波長を有する放射線)又はEビームによって活性化される。熱による開始と比較すると、光開始は、エネルギー消費量を考慮すると、著しく効率的である。
本発明の接着剤組成物及びテープは、熱可塑性ポリマーを含んで、コーティングプロセス及び接着フィルムの形成を促進してよい。熱可塑性ポリマーは、本発明組成物で使用するエポキシ樹脂と良好な適合性を有する必要がある。本明細書で使用する熱可塑性ポリマーは好ましくは、コーティングプロセス及び接着フィルムの形成において必要である良好な特性及び適切な分子量を確保するために、100℃において10〜100、好ましくは10〜70の範囲のムーニー粘度を有する。熱可塑性ポリマーの分子量が低すぎると、ポリマーは、コーティングフィルムを形成するために好適な凝集性を有さない。一方、熱可塑性ポリマーの分子量が高すぎると、コーティングプロセスのために溶媒にポリマーを容易に溶解させることができない。
組成物は、0〜50重量%のヒドロキシル官能性成分(ポリオールなど)を更に含んでよい。ヒドロキシル官能性成分は、光開始剤の効果を促進し得る。更なる光への曝露がないとしても、より効率的に反応を続行し得る。
ハロゲンフリー難燃剤は、窒素含有化合物系難燃剤、グラファイト材料系難燃剤、シアヌル酸メラミン系難燃剤、金属水酸化物系難燃剤、金属酸化物系難燃剤、金属リン酸塩系難燃剤、金属ホウ酸塩系難燃剤、及び有機リン酸塩系難燃剤からなる群から選択されてよい。好適な例としては、MPP(ポリリン酸メラミン)、Mg(OH)2、Al(OH)3、ホウ酸亜鉛、APP(ポリリン酸アンモニウム)、DMMP(ジメチルメチルホスホン酸)、TPP(リン酸トリフェニル)、リン酸亜鉛、MCA(シアヌル酸メラミン)、MP(リン酸メラミン)、DOPO(9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン10−オキシド)などが挙げられるが、これらに限定されない。
本発明の組成物及びテープはまた、粘着付与剤、酸化防止剤、カップリング剤、増粘剤、補助難燃剤、消泡剤、色素、界面活性剤、表面改質剤などを、組成物の総重量に基づいて、約0〜5重量%、より好ましくは0〜3重量%、更により好ましくは0.1〜2重量%、及び最も好ましくは0.2〜1重量%の量で含んで、組成物及びテープにその用途に応じて好ましい物理的特性をもたらしてよい。
本発明はまた、熱伝導性感圧接着テープを提供する。テープは、少なくとも1つの感圧接着剤層と、裏材層と、を備え、感圧接着剤層は、本発明のいずれか1つの実施形態によって提供される感圧接着剤組成物を含む。
ポリマーB:M029、Eternal Chemical Companyから市販、アクリルポリマー、IV>1.0、固形分30%
ポリマーC:YD128、Kukdo Chemical(Kunshan)Co.Ltd(China)から、エポキシ当量約187、室温及び大気圧において液体
ポリマーD:VORANOL 2070、Dow Company(USA)から、ポリエーテルトリオール、分子量700
樹脂:GA90A、Wu zhou Sun shine Company(China)から、ロジンエステル、軟化点:85〜95℃
光開始剤:カチオン性光開始剤1190、IGM Resins(China)から、トリアリールスルホニウムヘキサフルオロホスフェート塩の混合物
架橋剤:芳香族ビスアミド化合物、RD−1054、3M Company(USA)から、5重量%キシレン溶液として使用。
難燃剤A:P30、Chengzaicheng Company(China)から、液体型難燃剤、リン酸トリフェニル(CAS:115−86−6)と芳香族リン酸エステルとの混合物、リン含有率:8〜9重量%
溶媒:エチルアセテート
カップリング剤:A171、Dow Corning(USA)から
熱伝導性材料A:CF200、Yingkou Pengda Chemical Material Company(China)から、BN粉末、平均粒径:8〜15μm、表面積:3〜5m2/g、タップ密度:0.35g/cc、<25% 4.45μm、<50% 7.3μm、<75% 10.5μm、<90% 13.4μm。
熱伝導性材料B:ATH、Suzhou Ruifeng Material company(China)から、平均粒径5〜10μm;D10/D90:1/15μm
難燃剤B:OP935、Clariant Chemicals Company(India)、有機リン酸塩、リン含有率:23〜24重量%、粒径:D95<10μm、密度:1.2g/cm3、分解温度>300℃
プロセス:
表1に記載の成分を使用する。
実施例2〜9の組成物調製物及び試料調製物は、表1に示した各成分及び比を使用した以外は実施例1と同様とした。比較例1は、表1に示した成分を使用して調製する。
開裂接着強度:
引張試験装置(Instron 5565、Instron Corp.から入手可能)を使用した。イソプロパノールを使用して、アルミニウム試験ブロック(1インチ×1インチ(2.54cm×2.54cm))を拭いた。
調製した各配合接着フィルムを直径30mmのウェーハに切断し、各試料の熱伝導率を、試験規格GB5598−85に従って熱伝導率計DRL−II(Xiangtan Yiqiyibiao Company(China))を使用して測定した。試験データを表2に示す。
UL−94(U.S.Underwriters’Laboratories Inc.によって確立された規格)の垂直燃焼試験に従って、試料の下に10秒間、接炎してから離し、試料の燃焼が止まるまでに要した時間を測定した。試料の燃焼が止まった後、試料の下に再び更に10秒間接炎してから離し、試料の燃焼が止まるまでに要した時間を測定した。5つの試料のペアについて評価を行った(燃焼時間を合計10回測定した)。10個の燃焼時間のうちの最大の燃焼時間、10個の燃焼時間の合計、及び燃焼中に試料の落下があったか否かを評価した。
Instron5565(Instron Corp.から入手可能)及びトルク力テスタ20N DPSK(Japan KANON Corp.から入手可能)を使用した。イソプロパノールを使用して、アルミニウム試験パネル(幅2インチ×長さ6インチ(幅5cm×長さ15cm))及びAlブロック(有効試験面積1cm2、幅10mm*長さ10mm*高さ5mm)を拭いた。
表2からわかるように、本発明の接着テープは、比較例1のテープと比較すると、トルク力(>10Kgf・cm(>0.98Nm))、高熱伝導率(>0.60W/m・k)、及び高開裂接着力(>1.0MPa)において十分な性能の組み合わせを提供できた。
Claims (20)
- 組成物の総重量に基づいて、
(a)5〜70重量%のエポキシ成分と、
(b)5〜60重量%の熱伝導性材料と、
(c)0.001〜10重量%の光開始剤と、
(d)0〜40重量%の熱可塑性ポリマーと、
(e)0〜50重量%のヒドロキシル官能性成分と、
(f)0〜50重量%のハロゲンフリー難燃剤と、を含む、熱伝導性感圧接着剤組成物。 - 前記組成物の総重量に基づいて、
(a)5〜60重量%のエポキシ成分と、
(b)10〜50重量%の熱伝導性材料と、
(c)0.1〜8重量%の光開始剤と、
(d)1〜40重量の%熱可塑性ポリマーと、
(e)0〜20重量%のヒドロキシル官能性成分と、
(f)0〜40重量%のハロゲンフリー難燃剤と、を含む、請求項1に記載の接着剤組成物。 - 前記組成物の総重量に基づいて、
(a)10〜50重量%のエポキシ成分と、
(b)15〜40重量%の熱伝導性材料と、
(c)0.1〜6重量%の光開始剤と、
(d)2〜30重量%の熱可塑性ポリマーと、
(e)0〜10重量%のヒドロキシル官能性成分と、
(f)0〜30重量%のハロゲンフリー難燃剤と、を含む、請求項1に記載の接着剤組成物。 - 前記組成物の総重量に基づいて、
(a)15〜45重量%のエポキシ成分と、
(b)20〜40重量%の熱伝導性材料と、
(c)0.5〜4重量%の光開始剤と、
(d)5〜25重量%の熱可塑性ポリマーと、
(e)1〜5重量%のヒドロキシル官能性成分と、
(f)1〜25重量%のハロゲンフリー難燃剤と、を含む、請求項1に記載の接着剤組成物。 - 前記エポキシ成分が1種類以上のエポキシ樹脂及び/又はモノマーを含む、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 前記熱伝導性材料が、セラミック、金属酸化物、金属窒化物、金属水酸化物、BN、SiC、AlN、Al2O3、Si3N4から選択される1つ以上である、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 前記熱伝導性材料が100W/m・k以上の熱伝導率を有する、請求項1〜6のいずれか一項に記載の接着剤組成物。
- 前記金属水酸化物が、水酸化アルミニウム、アルカリ金属水酸化物、及びアルカリ土類金属水酸化物からなる群から選択される、請求項6に記載の接着剤組成物。
- 前記光開始剤が、α−アミノケトン基を含む光開始剤、ベンジルケタール基を含む光開始剤、ベンゾフェノン基を含む光開始剤、アリールヨードニウム塩型光開始剤、アリールスルホニウム塩型光開始剤、アルキルスルホニウム塩型光開始剤、鉄芳香族塩型光開始剤、及びアシル化スルホニルウレア酸素ラジカルケトンから選択される1つ以上である、請求項1〜8のいずれか一項に記載の熱伝導性接着剤組成物。
- 前記光開始剤が、トリアリールスルホニウムヘキサフルオロホスフェート塩の混合物である、請求項1〜9のいずれか一項に記載の接着剤組成物。
- 前記熱可塑性ポリマーが、エチレンビニルアセテートコポリマー成分、アクリルポリマー樹脂、又はエポキシ変性アクリルポリマー樹脂である、請求項1〜10のいずれか一項に記載の接着剤組成物。
- 前記エチレンビニルアセテートコポリマー成分が1種類以上のエチレンビニルアセテートコポリマーを含む、請求項11に記載の接着剤組成物。
- 前記ヒドロキシル官能性成分が、少なくとも1つのヒドロキシル官能基を有する1種類以上のヒドロキシル含有化合物を含む、請求項1〜12のいずれか一項に記載の接着剤組成物。
- 前記ハロゲンフリー難燃剤が、金属酸化物、水和金属化合物、リン含有化合物、ポリリン酸アンモニウム、金属ホウ酸塩、及びグラファイト材料からなる群から選択される、請求項1〜13のいずれか一項に記載の接着剤組成物。
- 0〜5重量%の添加剤を更に含み、該添加剤が、粘着付与剤、酸化防止剤、カップリング剤、増粘剤、補助難燃剤、消泡剤、色素、界面活性剤、及び表面改質剤から選択される1つ以上である、請求項1〜14のいずれか一項に記載の熱伝導性接着剤組成物。
- 裏材層と、
該裏材層の片面に配置され、請求項1〜15のいずれか一項に記載の組成物を含む第1熱伝導性接着剤層と、を備える、熱伝導性感圧接着テープ。 - 前記裏材層のもう一方の面に配置され、請求項1〜15のいずれか一項に記載の組成物を含む第2熱伝導性接着剤層と、
前記裏材層の反対側の、前記第1熱伝導性接着剤層の片面に配置された剥離ライナーと、を更に含む、請求項16に記載の接着テープ。 - 前記裏材層の反対側の、前記第1熱伝導性接着剤層の片面に配置された剥離ライナーを更に含む、請求項16に記載の接着テープ。
- 前記裏材層が、PIフィルム、PETフィルム、又はガラス繊維メッシュから選択される、請求項16〜18のいずれか一項に記載の接着テープ。
- 前記裏材層が超薄型プラスチックフィルム、絶縁性織布材料、又は絶縁性不織布材料である、請求項18に記載の接着テープ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2012/082466 WO2014047932A1 (en) | 2012-09-29 | 2012-09-29 | Adhesive composition and adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015533895A true JP2015533895A (ja) | 2015-11-26 |
JP6039083B2 JP6039083B2 (ja) | 2016-12-07 |
Family
ID=50386898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015533403A Expired - Fee Related JP6039083B2 (ja) | 2012-09-29 | 2012-09-29 | 接着剤組成物及び接着テープ |
Country Status (10)
Country | Link |
---|---|
US (1) | US9540550B2 (ja) |
EP (1) | EP2900779B1 (ja) |
JP (1) | JP6039083B2 (ja) |
KR (1) | KR20150067219A (ja) |
BR (1) | BR112015007082A2 (ja) |
CA (1) | CA2886406A1 (ja) |
MX (1) | MX2015003975A (ja) |
RU (1) | RU2608525C2 (ja) |
SG (1) | SG11201502443WA (ja) |
WO (1) | WO2014047932A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018035244A (ja) * | 2016-08-30 | 2018-03-08 | 中松 義郎 | 工業用テープ |
KR20180129255A (ko) * | 2017-05-26 | 2018-12-05 | 단국대학교 산학협력단 | 난연성 자외선 경화형 점착제 조성물 및 이를 이용한 점착제 제조방법 |
JP2019502780A (ja) * | 2015-12-01 | 2019-01-31 | スリーエム イノベイティブ プロパティズ カンパニー | Bステージ化可能な接着剤組成物 |
KR20190072146A (ko) * | 2017-12-15 | 2019-06-25 | 주식회사 엘지화학 | 접착제 조성물 및 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104673160A (zh) * | 2014-06-30 | 2015-06-03 | 广东丹邦科技有限公司 | 填充表面改性碳化硅各向同性导热胶黏剂及制备方法 |
JP6906448B2 (ja) | 2015-06-04 | 2021-07-21 | スリーエム イノベイティブ プロパティズ カンパニー | 車両用ガラスにハードウェアを接合する方法 |
JP6465037B2 (ja) * | 2016-01-07 | 2019-02-06 | 信越化学工業株式会社 | 縮合硬化反応と有機過酸化物硬化反応を併用したシリコーン組成物 |
DE102017001696A1 (de) | 2017-02-22 | 2018-08-23 | Lohmann Gmbh & Co. Kg | UV-aktivierbares strukturelles Haftklebeband |
CA3065085A1 (en) * | 2017-06-28 | 2019-01-03 | Celanese EVA Performance Polymers Corporation | Polymer composition for use in cables |
DE102017122431A1 (de) * | 2017-09-27 | 2019-03-28 | Webasto SE | Klebeband zum Aufbringen auf ein Bauteil eines Kraftfahrzeugs, Verwendung eines Klebebands, Verbund zweier Bauteile sowie Verfahren zum Verkleben zweier Bauteile eines Kraftfahrzeugs |
JP2019125529A (ja) * | 2018-01-18 | 2019-07-25 | タツタ電線株式会社 | 導電性接着フィルム及びそれを用いた電磁波シールドフィルム |
US20210230454A1 (en) * | 2018-05-02 | 2021-07-29 | Lohmann Gmbh & Co. Kg | Adhesive tape that can be wound and stamped for selective uv activation |
CN110577803B (zh) * | 2018-06-11 | 2021-11-26 | 3M创新有限公司 | 一种阻燃压敏胶粘合剂、阻燃压敏胶粘合片及其制备方法 |
US11084955B2 (en) | 2018-07-23 | 2021-08-10 | Microsoft Technology Licensing, Llc | Pressure sensitive adhesive with thermally conductive release tab |
WO2020019703A1 (en) * | 2018-07-24 | 2020-01-30 | Henkel Ag & Co. Kgaa | Flame retardant adhesive composition |
DE102018118581A1 (de) * | 2018-07-31 | 2020-02-06 | Lohmann Gmbh & Co. Kg | Kartuschenabdeckvorrichtung zum Versiegeln einer mikrofluidischen Kartusche |
JP6819833B2 (ja) * | 2018-12-25 | 2021-01-27 | Dic株式会社 | 粘着テープ |
US20220251331A1 (en) | 2019-05-21 | 2022-08-11 | Ddp Specialty Electronic Materials Us, Llc | Thermal interface materials |
CN113841234A (zh) | 2019-05-21 | 2021-12-24 | Ddp特种电子材料美国有限责任公司 | 两部分界面材料、包括该界面材料的系统及其方法 |
CN114746469A (zh) * | 2019-11-26 | 2022-07-12 | Ddp特种电子材料美国有限责任公司 | 环氧基热界面材料 |
CN112980352B (zh) * | 2019-12-18 | 2022-05-27 | 3M创新有限公司 | 可紫外固化组合物、可紫外固化胶膜和可紫外固化胶带 |
CN111303796B (zh) * | 2020-04-21 | 2021-04-27 | 徐文忠 | 石墨导电胶的制备方法 |
JP2023550229A (ja) | 2020-09-14 | 2023-12-01 | ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー | 熱界面材料 |
DE102022102650A1 (de) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09291267A (ja) * | 1996-04-25 | 1997-11-11 | Hitachi Chem Co Ltd | 紫外線硬化型接着剤組成物 |
JP2000109757A (ja) * | 1998-10-09 | 2000-04-18 | Sekisui Chem Co Ltd | 光硬化型熱伝導性粘接着剤組成物及び光硬化型熱伝導性粘接着シート |
JP2004530745A (ja) * | 2001-03-29 | 2004-10-07 | スリーエム イノベイティブ プロパティズ カンパニー | 構造用結合テープ、およびそれを含有する物品 |
JP2009010296A (ja) * | 2007-06-29 | 2009-01-15 | Nitto Denko Corp | 熱伝導性接着フィルム及びその製造方法 |
WO2010024236A1 (ja) * | 2008-08-27 | 2010-03-04 | 日立化成工業株式会社 | 両面接着フィルム及びこれを用いた電子部品モジュール |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB559885A (en) | 1942-06-19 | 1944-03-09 | Braithwaite & Company Engineer | Improvements in the connection of flanged plates such as are used in the construction of storage tanks and the like |
US4256828A (en) * | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
CA2115888A1 (en) | 1993-04-15 | 1994-10-16 | Clayton A. George | Epoxy/polyester hot melt compositions |
JP2000501551A (ja) * | 1995-12-06 | 2000-02-08 | シーメンス アクチエンゲゼルシヤフト | 導電性反応樹脂混合物 |
US6309502B1 (en) | 1997-08-19 | 2001-10-30 | 3M Innovative Properties Company | Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
KR100563806B1 (ko) * | 1997-08-19 | 2006-03-28 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | 전도성 에폭시 수지 조성물, 비등방 전도성 접착 필름 및전기 접속 방법 |
US6274643B1 (en) | 1998-05-01 | 2001-08-14 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
JP2000281997A (ja) | 1999-03-30 | 2000-10-10 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
US20040094264A1 (en) | 2001-01-30 | 2004-05-20 | Hiroaki Yamaguchi | Method for adhering substrates using light activatable adhesive film |
JP2002226822A (ja) * | 2001-01-30 | 2002-08-14 | Three M Innovative Properties Co | 光線活性化型接着フィルムを用いた基材接着方法 |
US6955739B2 (en) | 2001-06-19 | 2005-10-18 | 3M Innovative Properties Company | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
JP2003020452A (ja) * | 2001-06-19 | 2003-01-24 | Three M Innovative Properties Co | 紫外線活性化型接着フィルムを用いた基材接着方法及び紫外線照射装置 |
JP4276407B2 (ja) | 2002-05-08 | 2009-06-10 | ヘンケル コーポレイション | 光カチオン硬化型エポキシ樹脂組成物 |
JP4907840B2 (ja) | 2003-11-12 | 2012-04-04 | 日立化成工業株式会社 | 異方導電フィルム及びこれを用いた回路板 |
RU2276169C1 (ru) * | 2004-08-09 | 2006-05-10 | Федеральное Государственное унитарное предприятие Государственный научно-производственный ракетно-космический центр (ФГУП ГНПРКЦ "ЦСКБ-Прогресс") | Композиция для теплопроводного клеевого состава |
CN101189275B (zh) | 2005-05-31 | 2011-08-17 | 株式会社艾迪科 | 环氧树脂固化性组合物 |
WO2007100329A1 (en) | 2006-03-02 | 2007-09-07 | Designer Molecules, Inc. | Adhesive composition containing cyclic siloxanes |
US7744803B2 (en) * | 2006-08-02 | 2010-06-29 | Shawcor Ltd. | Photo-crosslinkable polyolefin compositions |
JP5143449B2 (ja) | 2007-03-02 | 2013-02-13 | 株式会社ダイセル | 熱又は活性エネルギー線硬化型接着剤 |
US20110210407A1 (en) | 2008-08-27 | 2011-09-01 | Youji Katayama | Double-faced adhesive film and electronic component module using same |
CN101798439A (zh) | 2010-02-09 | 2010-08-11 | 广东生益科技股份有限公司 | 无卤高导热的树脂组合物及用其制作的导热胶膜 |
WO2013000161A1 (en) | 2011-06-30 | 2013-01-03 | 3M Innovative Properties Company | Adhesive composition, adhesive tape and adhesion structure |
-
2012
- 2012-09-29 BR BR112015007082A patent/BR112015007082A2/pt not_active Application Discontinuation
- 2012-09-29 JP JP2015533403A patent/JP6039083B2/ja not_active Expired - Fee Related
- 2012-09-29 KR KR1020157010735A patent/KR20150067219A/ko not_active Application Discontinuation
- 2012-09-29 CA CA2886406A patent/CA2886406A1/en not_active Abandoned
- 2012-09-29 EP EP12885253.0A patent/EP2900779B1/en not_active Not-in-force
- 2012-09-29 RU RU2015112345A patent/RU2608525C2/ru not_active IP Right Cessation
- 2012-09-29 SG SG11201502443WA patent/SG11201502443WA/en unknown
- 2012-09-29 MX MX2015003975A patent/MX2015003975A/es unknown
- 2012-09-29 WO PCT/CN2012/082466 patent/WO2014047932A1/en active Application Filing
- 2012-09-29 US US14/431,815 patent/US9540550B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09291267A (ja) * | 1996-04-25 | 1997-11-11 | Hitachi Chem Co Ltd | 紫外線硬化型接着剤組成物 |
JP2000109757A (ja) * | 1998-10-09 | 2000-04-18 | Sekisui Chem Co Ltd | 光硬化型熱伝導性粘接着剤組成物及び光硬化型熱伝導性粘接着シート |
JP2004530745A (ja) * | 2001-03-29 | 2004-10-07 | スリーエム イノベイティブ プロパティズ カンパニー | 構造用結合テープ、およびそれを含有する物品 |
JP2009010296A (ja) * | 2007-06-29 | 2009-01-15 | Nitto Denko Corp | 熱伝導性接着フィルム及びその製造方法 |
WO2010024236A1 (ja) * | 2008-08-27 | 2010-03-04 | 日立化成工業株式会社 | 両面接着フィルム及びこれを用いた電子部品モジュール |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019502780A (ja) * | 2015-12-01 | 2019-01-31 | スリーエム イノベイティブ プロパティズ カンパニー | Bステージ化可能な接着剤組成物 |
JP2018035244A (ja) * | 2016-08-30 | 2018-03-08 | 中松 義郎 | 工業用テープ |
KR20180129255A (ko) * | 2017-05-26 | 2018-12-05 | 단국대학교 산학협력단 | 난연성 자외선 경화형 점착제 조성물 및 이를 이용한 점착제 제조방법 |
KR102046154B1 (ko) * | 2017-05-26 | 2019-11-18 | 단국대학교 산학협력단 | 난연성 자외선 경화형 점착제 조성물 및 이를 이용한 점착제 제조방법 |
KR20190072146A (ko) * | 2017-12-15 | 2019-06-25 | 주식회사 엘지화학 | 접착제 조성물 및 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
KR102201543B1 (ko) | 2017-12-15 | 2021-01-11 | 주식회사 엘지화학 | 접착제 조성물 및 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
Also Published As
Publication number | Publication date |
---|---|
EP2900779A1 (en) | 2015-08-05 |
CA2886406A1 (en) | 2014-04-03 |
WO2014047932A1 (en) | 2014-04-03 |
US9540550B2 (en) | 2017-01-10 |
MX2015003975A (es) | 2015-07-06 |
RU2608525C2 (ru) | 2017-01-19 |
EP2900779B1 (en) | 2018-12-19 |
US20150232718A1 (en) | 2015-08-20 |
EP2900779A4 (en) | 2016-06-01 |
SG11201502443WA (en) | 2015-04-29 |
RU2015112345A (ru) | 2016-11-20 |
BR112015007082A2 (pt) | 2017-07-04 |
KR20150067219A (ko) | 2015-06-17 |
JP6039083B2 (ja) | 2016-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6039083B2 (ja) | 接着剤組成物及び接着テープ | |
JP5889406B2 (ja) | 接着剤組成物、接着テープ、及び接着構造 | |
KR100600936B1 (ko) | 박리가능한 점착제 조성물 | |
JP6078239B2 (ja) | ガスケット | |
JP4995316B2 (ja) | ガスケット | |
JP5930870B2 (ja) | ガスケット | |
WO2009058630A2 (en) | Thermally conductive adhesives and adhesive tape using the same | |
JP6541359B2 (ja) | 保護膜形成用シート、及び保護膜形成用複合シート | |
EP2927951B1 (en) | Composition for a protective film, protective film formed from the composition, and chip with cured protective film | |
JP2001279196A (ja) | 無基材熱伝導性粘着テープ・シート及びその製造方法 | |
JP2022535205A (ja) | 硬化性感圧接着剤組成物、硬化性感圧接着テープ、及びバッテリーパック | |
JP5763009B2 (ja) | ガスケット | |
KR20150087752A (ko) | 편광판용 접착제 조성물, 이로부터 제조된 편광판용 접착필름, 이를 포함하는 편광판 및 이를 포함하는 광학표시장치 | |
CN111484820B (zh) | 光固化粘合剂组合物和光固化胶带 | |
JP2020105480A (ja) | 粘接着剤組成物および粘接着シート | |
KR20170053136A (ko) | 광학용 점착제 조성물, 광학용 점착제 조성물의 제조방법 및 광학용 점착 필름 | |
KR101542290B1 (ko) | 점착제 조성물 | |
KR20120077639A (ko) | 다이싱 다이 본딩 필름용 점착제 조성물 | |
KR20120102016A (ko) | 점착 조성물, 및 점착 테이프 | |
WO2024127346A1 (en) | Cooling plate assembly and two-part curable adhesive composition | |
JP6148926B2 (ja) | 機能性粘着シート | |
TW202140737A (zh) | 膜狀接著劑以及切割黏晶片 | |
JP2022169994A (ja) | 熱伝導性シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150330 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150928 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150928 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160609 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160621 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160912 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161102 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6039083 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |