JP2015511027A5 - - Google Patents

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Publication number
JP2015511027A5
JP2015511027A5 JP2014560046A JP2014560046A JP2015511027A5 JP 2015511027 A5 JP2015511027 A5 JP 2015511027A5 JP 2014560046 A JP2014560046 A JP 2014560046A JP 2014560046 A JP2014560046 A JP 2014560046A JP 2015511027 A5 JP2015511027 A5 JP 2015511027A5
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JP
Japan
Prior art keywords
connector
chip assembly
substrate
assembly configuration
integrated circuit
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Application number
JP2014560046A
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English (en)
Japanese (ja)
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JP6294838B2 (ja
JP2015511027A (ja
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Priority claimed from US13/410,113 external-priority patent/US20130230272A1/en
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Publication of JP2015511027A publication Critical patent/JP2015511027A/ja
Publication of JP2015511027A5 publication Critical patent/JP2015511027A5/ja
Application granted granted Critical
Publication of JP6294838B2 publication Critical patent/JP6294838B2/ja
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JP2014560046A 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成 Active JP6294838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/410,113 2012-03-01
US13/410,113 US20130230272A1 (en) 2012-03-01 2012-03-01 Chip assembly configuration with densely packed optical interconnects
PCT/US2013/028355 WO2013130831A2 (en) 2012-03-01 2013-02-28 Chip assembly configuration with densely packed optical interconnects

Publications (3)

Publication Number Publication Date
JP2015511027A JP2015511027A (ja) 2015-04-13
JP2015511027A5 true JP2015511027A5 (enExample) 2016-02-18
JP6294838B2 JP6294838B2 (ja) 2018-03-14

Family

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Family Applications (1)

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JP2014560046A Active JP6294838B2 (ja) 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成

Country Status (6)

Country Link
US (1) US20130230272A1 (enExample)
EP (1) EP2820461B1 (enExample)
JP (1) JP6294838B2 (enExample)
CN (1) CN104395801B (enExample)
TW (1) TWI598647B (enExample)
WO (1) WO2013130831A2 (enExample)

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