CN104395801B - 具有密集封装的光学互联的芯片组装配置 - Google Patents

具有密集封装的光学互联的芯片组装配置 Download PDF

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Publication number
CN104395801B
CN104395801B CN201380011906.7A CN201380011906A CN104395801B CN 104395801 B CN104395801 B CN 104395801B CN 201380011906 A CN201380011906 A CN 201380011906A CN 104395801 B CN104395801 B CN 104395801B
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China
Prior art keywords
connector
chip assembly
substrate
integrated circuit
optical
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CN201380011906.7A
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English (en)
Chinese (zh)
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CN104395801A (zh
Inventor
K·拉杰
黄大威
N·E·安尼尚斯莱
T·斯泽
D·K·迈塞尔弗雷什
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Oracle International Corp
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Oracle International Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
  • Semiconductor Lasers (AREA)
CN201380011906.7A 2012-03-01 2013-02-28 具有密集封装的光学互联的芯片组装配置 Active CN104395801B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/410,113 US20130230272A1 (en) 2012-03-01 2012-03-01 Chip assembly configuration with densely packed optical interconnects
US13/410,113 2012-03-01
PCT/US2013/028355 WO2013130831A2 (en) 2012-03-01 2013-02-28 Chip assembly configuration with densely packed optical interconnects

Publications (2)

Publication Number Publication Date
CN104395801A CN104395801A (zh) 2015-03-04
CN104395801B true CN104395801B (zh) 2017-03-01

Family

ID=47915320

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380011906.7A Active CN104395801B (zh) 2012-03-01 2013-02-28 具有密集封装的光学互联的芯片组装配置

Country Status (6)

Country Link
US (1) US20130230272A1 (enExample)
EP (1) EP2820461B1 (enExample)
JP (1) JP6294838B2 (enExample)
CN (1) CN104395801B (enExample)
TW (1) TWI598647B (enExample)
WO (1) WO2013130831A2 (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9874688B2 (en) * 2012-04-26 2018-01-23 Acacia Communications, Inc. Co-packaging photonic integrated circuits and application specific integrated circuits
US10700225B2 (en) 2013-05-22 2020-06-30 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
US10468543B2 (en) 2013-05-22 2019-11-05 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
US11121271B2 (en) 2013-05-22 2021-09-14 W&WSens, Devices, Inc. Microstructure enhanced absorption photosensitive devices
US10446700B2 (en) * 2013-05-22 2019-10-15 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
WO2014190189A2 (en) 2013-05-22 2014-11-27 Shih-Yuan Wang Microstructure enhanced absorption photosensitive devices
US9496248B2 (en) * 2014-01-06 2016-11-15 Fujitsu Limited Interposer for integrated circuit chip package
US9671572B2 (en) * 2014-09-22 2017-06-06 Oracle International Corporation Integrated chip package with optical interface
SG11201703131WA (en) * 2014-10-29 2017-05-30 Acacia Communications Inc Optoelectronic ball grid array package with fiber
US9678271B2 (en) * 2015-01-26 2017-06-13 Oracle International Corporation Packaged opto-electronic module
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
WO2017023257A1 (en) 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Multi-chip module
US10031177B2 (en) * 2015-08-18 2018-07-24 Juniper Networks, Inc. Methods and apparatus for optical transceiver calibration and test
US10234626B2 (en) * 2016-02-08 2019-03-19 Skorpios Technologies, Inc. Stepped optical bridge for connecting semiconductor waveguides
US10732349B2 (en) 2016-02-08 2020-08-04 Skorpios Technologies, Inc. Broadband back mirror for a III-V chip in silicon photonics
US10509163B2 (en) 2016-02-08 2019-12-17 Skorpios Technologies, Inc. High-speed optical transmitter with a silicon substrate
CN105608298B (zh) * 2016-03-03 2019-07-16 深圳市紫光同创电子有限公司 一种基于阵列封装的fpga芯片
US9900974B2 (en) * 2016-06-02 2018-02-20 Finisar Corporation Flex-less multilayer ceramic substrate
US10091904B2 (en) * 2016-07-22 2018-10-02 Intel Corporation Storage sled for data center
US11531174B2 (en) 2017-09-28 2022-12-20 Intel Corporation Co-packaging with silicon photonics hybrid planar lightwave circuit
US10928588B2 (en) 2017-10-13 2021-02-23 Skorpios Technologies, Inc. Transceiver module for optical communication
US11327259B2 (en) * 2017-12-07 2022-05-10 Intel Corporation Integrated circuit package with electro-optical interconnect circuitry
US11573387B2 (en) * 2018-04-12 2023-02-07 Rockley Photonics Limited Optical engine
CN112567650B (zh) * 2018-04-12 2025-02-14 洛克利光子有限公司 光学引擎
US11054597B2 (en) 2018-04-12 2021-07-06 Rockley Photonics Limited Electro-optical package and method of fabrication
US10716213B2 (en) 2018-07-28 2020-07-14 Hewlett Packard Enterprise Development Lp Direct connection of high speed signals on PCB chip
US10517167B1 (en) 2018-10-19 2019-12-24 Eagle Technology, Llc Systems and methods for providing a high speed interconnect system with reduced crosstalk
US10928585B2 (en) 2018-10-26 2021-02-23 Micron Technology, Inc. Semiconductor devices having electro-optical substrates
US11024617B2 (en) 2018-10-26 2021-06-01 Micron Technology, Inc. Semiconductor packages having photon integrated circuit (PIC) chips
CN113169234A (zh) * 2018-12-03 2021-07-23 艾尤纳公司 高密度光学互连组件
WO2020201539A1 (en) * 2019-04-04 2020-10-08 Rockley Photonics Limited Optical engine
US12308307B2 (en) 2019-07-10 2025-05-20 Rockley Photonics Limited Through mold via frame
US11056850B2 (en) 2019-07-26 2021-07-06 Eagle Technology, Llc Systems and methods for providing a soldered interface on a printed circuit board having a blind feature
US11602800B2 (en) 2019-10-10 2023-03-14 Eagle Technology, Llc Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US11256049B2 (en) * 2020-04-22 2022-02-22 Nokia Solutions And Networks Oy Optical-to-electric-to-optical routing engine
US11437323B2 (en) 2020-06-03 2022-09-06 Hewlett Packard Enterprise Development Lp Silicon interposer for capacitive coupling of photodiode arrays
US11283204B1 (en) 2020-11-19 2022-03-22 Eagle Technology, Llc Systems and methods for providing a composite connector for high speed interconnect systems
US11929357B2 (en) 2021-10-20 2024-03-12 Advanced Semiconductor Engineering, Inc. Optoelectronic package structure and method of manufacturing the same
CN113917631B (zh) * 2021-10-20 2024-03-01 东莞立讯技术有限公司 共封装集成光电模块及共封装光电交换芯片结构
CN116299887A (zh) * 2021-12-14 2023-06-23 上海曦智科技有限公司 光互连装置及其制造方法、计算装置
US12442999B2 (en) 2022-03-18 2025-10-14 Celestial Ai Inc. Optically bridged multicomponent package with extended temperature range
WO2023177848A1 (en) * 2022-03-18 2023-09-21 Celestial Al Inc. Optical multi-die interconnect bridge (omib)
CN116936557A (zh) * 2022-03-31 2023-10-24 华为技术有限公司 一种光电共封装结构及通信设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030038297A1 (en) * 2001-07-24 2003-02-27 Robert Carroll Apparatus,system, and method for transmission of information between microelectronic devices
CN1629671A (zh) * 2003-12-17 2005-06-22 国际商业机器公司 用于光互连模块的硅载体
CN1732399A (zh) * 2002-12-30 2006-02-08 通用电气公司 用于光电互连的组装、连接和耦合
US7766559B2 (en) * 2007-03-05 2010-08-03 Aprius, Inc. Fiber orientation for optical transceiver
CN101932963A (zh) * 2008-01-30 2010-12-29 惠普发展公司，有限责任合伙企业 光学互连

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9202077L (sv) * 1992-07-06 1994-01-07 Ellemtel Utvecklings Ab Komponentmodul
JP2002050821A (ja) * 2000-07-31 2002-02-15 Kyocera Corp 光実装基板及びそれを用いた光モジュール
JP2002261265A (ja) * 2001-03-06 2002-09-13 Sumitomo Electric Ind Ltd 光通信装置
US6752539B2 (en) * 2002-06-28 2004-06-22 International Buisness Machines Corporation Apparatus and system for providing optical bus interprocessor interconnection
US7128472B2 (en) * 2003-07-31 2006-10-31 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
JP2005085844A (ja) * 2003-09-05 2005-03-31 Ngk Spark Plug Co Ltd 光電気複合配線構造体及びその製造方法
JP2005159060A (ja) * 2003-11-26 2005-06-16 Kyocera Corp 同軸型半導体レーザモジュール
US7657185B2 (en) * 2004-01-26 2010-02-02 Opnext, Inc. Electronic interface for long reach optical transceiver
JP4138689B2 (ja) * 2004-03-30 2008-08-27 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージ及びｌｓｉパッケージ
JP2006259682A (ja) * 2005-02-18 2006-09-28 Sony Corp 光電複合装置、それに用いられるｉｃソケットおよび光導波路、光導波路結合チップ、並びにそれを用いた電子機器
JP2007057972A (ja) * 2005-08-25 2007-03-08 Nec Electronics Corp 光モジュール
JP4876263B2 (ja) * 2006-04-03 2012-02-15 国立大学法人 東京大学 信号伝送機器
US7991248B2 (en) * 2006-09-21 2011-08-02 Hitachi Chemical Co., Ltd. Optical waveguide substrate and substrate mounting photoelectric hybrid circuit
US7891924B2 (en) * 2006-11-03 2011-02-22 Huck International, Inc. Low swage load fastening system and method
JP4895957B2 (ja) * 2007-09-25 2012-03-14 日本特殊陶業株式会社 光電気混載パッケージ、光電気混載モジュール
WO2009107742A1 (ja) * 2008-02-28 2009-09-03 日本電気株式会社 半導体装置
US9112616B2 (en) * 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
JP5102815B2 (ja) * 2009-08-31 2012-12-19 日立電線株式会社 光電気複合配線モジュールおよびその製造方法
JP5300700B2 (ja) * 2009-11-28 2013-09-25 京セラ株式会社 光配線基板
JP2011248243A (ja) * 2010-05-28 2011-12-08 Fujitsu Component Ltd 光電変換モジュール及び光電変換装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030038297A1 (en) * 2001-07-24 2003-02-27 Robert Carroll Apparatus,system, and method for transmission of information between microelectronic devices
CN1732399A (zh) * 2002-12-30 2006-02-08 通用电气公司 用于光电互连的组装、连接和耦合
CN1629671A (zh) * 2003-12-17 2005-06-22 国际商业机器公司 用于光互连模块的硅载体
US7766559B2 (en) * 2007-03-05 2010-08-03 Aprius, Inc. Fiber orientation for optical transceiver
CN101932963A (zh) * 2008-01-30 2010-12-29 惠普发展公司，有限责任合伙企业 光学互连

Also Published As

Publication number Publication date
TW201400894A (zh) 2014-01-01
WO2013130831A2 (en) 2013-09-06
CN104395801A (zh) 2015-03-04
JP2015511027A (ja) 2015-04-13
US20130230272A1 (en) 2013-09-05
EP2820461B1 (en) 2020-04-08
EP2820461A2 (en) 2015-01-07
WO2013130831A3 (en) 2013-12-27
TWI598647B (zh) 2017-09-11
JP6294838B2 (ja) 2018-03-14

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