JP6294838B2 - 高密度に実装された光インターコネクトを有するチップアセンブリ構成 - Google Patents

高密度に実装された光インターコネクトを有するチップアセンブリ構成 Download PDF

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JP6294838B2
JP6294838B2 JP2014560046A JP2014560046A JP6294838B2 JP 6294838 B2 JP6294838 B2 JP 6294838B2 JP 2014560046 A JP2014560046 A JP 2014560046A JP 2014560046 A JP2014560046 A JP 2014560046A JP 6294838 B2 JP6294838 B2 JP 6294838B2
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connector
chip assembly
assembly configuration
substrate
integrated circuit
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Japanese (ja)
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JP2015511027A5 (enExample
JP2015511027A (ja
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ラジ，カナン
ファン，ダーウェイ
アンシャンズリー，ニコラス・イー
シー，テレサ
マケルフレッシュ，デイビッド・ケイ
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オラクル・インターナショナル・コーポレイション
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
  • Semiconductor Lasers (AREA)
JP2014560046A 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成 Active JP6294838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/410,113 2012-03-01
US13/410,113 US20130230272A1 (en) 2012-03-01 2012-03-01 Chip assembly configuration with densely packed optical interconnects
PCT/US2013/028355 WO2013130831A2 (en) 2012-03-01 2013-02-28 Chip assembly configuration with densely packed optical interconnects

Publications (3)

Publication Number Publication Date
JP2015511027A JP2015511027A (ja) 2015-04-13
JP2015511027A5 JP2015511027A5 (enExample) 2016-02-18
JP6294838B2 true JP6294838B2 (ja) 2018-03-14

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JP2014560046A Active JP6294838B2 (ja) 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成

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Country Link
US (1) US20130230272A1 (enExample)
EP (1) EP2820461B1 (enExample)
JP (1) JP6294838B2 (enExample)
CN (1) CN104395801B (enExample)
TW (1) TWI598647B (enExample)
WO (1) WO2013130831A2 (enExample)

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Publication number Publication date
WO2013130831A3 (en) 2013-12-27
US20130230272A1 (en) 2013-09-05
JP2015511027A (ja) 2015-04-13
EP2820461A2 (en) 2015-01-07
CN104395801B (zh) 2017-03-01
EP2820461B1 (en) 2020-04-08
TWI598647B (zh) 2017-09-11
TW201400894A (zh) 2014-01-01
CN104395801A (zh) 2015-03-04
WO2013130831A2 (en) 2013-09-06

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