JP6294838B2 - 高密度に実装された光インターコネクトを有するチップアセンブリ構成 - Google Patents

高密度に実装された光インターコネクトを有するチップアセンブリ構成 Download PDF

Info

Publication number
JP6294838B2
JP6294838B2 JP2014560046A JP2014560046A JP6294838B2 JP 6294838 B2 JP6294838 B2 JP 6294838B2 JP 2014560046 A JP2014560046 A JP 2014560046A JP 2014560046 A JP2014560046 A JP 2014560046A JP 6294838 B2 JP6294838 B2 JP 6294838B2
Authority
JP
Japan
Prior art keywords
connector
chip assembly
assembly configuration
substrate
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014560046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015511027A5 (enExample
JP2015511027A (ja
Inventor
ラジ，カナン
ファン，ダーウェイ
アンシャンズリー，ニコラス・イー
シー，テレサ
マケルフレッシュ，デイビッド・ケイ
Original Assignee
オラクル・インターナショナル・コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オラクル・インターナショナル・コーポレイション filed Critical オラクル・インターナショナル・コーポレイション
Publication of JP2015511027A publication Critical patent/JP2015511027A/ja
Publication of JP2015511027A5 publication Critical patent/JP2015511027A5/ja
Application granted granted Critical
Publication of JP6294838B2 publication Critical patent/JP6294838B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
  • Semiconductor Lasers (AREA)
JP2014560046A 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成 Active JP6294838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/410,113 US20130230272A1 (en) 2012-03-01 2012-03-01 Chip assembly configuration with densely packed optical interconnects
US13/410,113 2012-03-01
PCT/US2013/028355 WO2013130831A2 (en) 2012-03-01 2013-02-28 Chip assembly configuration with densely packed optical interconnects

Publications (3)

Publication Number Publication Date
JP2015511027A JP2015511027A (ja) 2015-04-13
JP2015511027A5 JP2015511027A5 (enExample) 2016-02-18
JP6294838B2 true JP6294838B2 (ja) 2018-03-14

Family

ID=47915320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014560046A Active JP6294838B2 (ja) 2012-03-01 2013-02-28 高密度に実装された光インターコネクトを有するチップアセンブリ構成

Country Status (6)

Country Link
US (1) US20130230272A1 (enExample)
EP (1) EP2820461B1 (enExample)
JP (1) JP6294838B2 (enExample)
CN (1) CN104395801B (enExample)
TW (1) TWI598647B (enExample)
WO (1) WO2013130831A2 (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9874688B2 (en) * 2012-04-26 2018-01-23 Acacia Communications, Inc. Co-packaging photonic integrated circuits and application specific integrated circuits
US10446700B2 (en) * 2013-05-22 2019-10-15 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
US11121271B2 (en) 2013-05-22 2021-09-14 W&WSens, Devices, Inc. Microstructure enhanced absorption photosensitive devices
KR102358584B1 (ko) 2013-05-22 2022-02-04 시-위안 왕 마이크로구조-증강 흡수 감광성 디바이스
US10700225B2 (en) 2013-05-22 2020-06-30 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
US10468543B2 (en) 2013-05-22 2019-11-05 W&Wsens Devices, Inc. Microstructure enhanced absorption photosensitive devices
US9496248B2 (en) * 2014-01-06 2016-11-15 Fujitsu Limited Interposer for integrated circuit chip package
US9671572B2 (en) * 2014-09-22 2017-06-06 Oracle International Corporation Integrated chip package with optical interface
SG10201805058VA (en) 2014-10-29 2018-07-30 Acacia Communications Inc Optoelectronic ball grid array package with fiber
US9678271B2 (en) * 2015-01-26 2017-06-13 Oracle International Corporation Packaged opto-electronic module
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
CN107534029B (zh) * 2015-07-31 2021-11-26 慧与发展有限责任合伙企业 多芯片模块
US10031177B2 (en) * 2015-08-18 2018-07-24 Juniper Networks, Inc. Methods and apparatus for optical transceiver calibration and test
US10234626B2 (en) * 2016-02-08 2019-03-19 Skorpios Technologies, Inc. Stepped optical bridge for connecting semiconductor waveguides
US10732349B2 (en) 2016-02-08 2020-08-04 Skorpios Technologies, Inc. Broadband back mirror for a III-V chip in silicon photonics
US10509163B2 (en) 2016-02-08 2019-12-17 Skorpios Technologies, Inc. High-speed optical transmitter with a silicon substrate
CN105608298B (zh) * 2016-03-03 2019-07-16 深圳市紫光同创电子有限公司 一种基于阵列封装的fpga芯片
US9900974B2 (en) * 2016-06-02 2018-02-20 Finisar Corporation Flex-less multilayer ceramic substrate
US10390114B2 (en) * 2016-07-22 2019-08-20 Intel Corporation Memory sharing for physical accelerator resources in a data center
US11531174B2 (en) 2017-09-28 2022-12-20 Intel Corporation Co-packaging with silicon photonics hybrid planar lightwave circuit
US10928588B2 (en) 2017-10-13 2021-02-23 Skorpios Technologies, Inc. Transceiver module for optical communication
US11327259B2 (en) * 2017-12-07 2022-05-10 Intel Corporation Integrated circuit package with electro-optical interconnect circuitry
GB2587961B (en) 2018-04-12 2022-05-18 Rockley Photonics Ltd Electro-optical package and method of fabrication
US11573387B2 (en) * 2018-04-12 2023-02-07 Rockley Photonics Limited Optical engine
GB2587962B (en) * 2018-04-12 2022-12-14 Rockley Photonics Ltd Optical engine
US10716213B2 (en) 2018-07-28 2020-07-14 Hewlett Packard Enterprise Development Lp Direct connection of high speed signals on PCB chip
US10517167B1 (en) 2018-10-19 2019-12-24 Eagle Technology, Llc Systems and methods for providing a high speed interconnect system with reduced crosstalk
US11024617B2 (en) * 2018-10-26 2021-06-01 Micron Technology, Inc. Semiconductor packages having photon integrated circuit (PIC) chips
US10928585B2 (en) 2018-10-26 2021-02-23 Micron Technology, Inc. Semiconductor devices having electro-optical substrates
US20210398961A1 (en) * 2018-12-03 2021-12-23 Aayuna Inc. High Density Optical Interconnection Assembly
GB2597179B (en) * 2019-04-04 2023-07-05 Rockley Photonics Ltd Optical engine
WO2021005235A1 (en) 2019-07-10 2021-01-14 Rockley Photonics Limited Through mold via frame
US11056850B2 (en) 2019-07-26 2021-07-06 Eagle Technology, Llc Systems and methods for providing a soldered interface on a printed circuit board having a blind feature
US11602800B2 (en) 2019-10-10 2023-03-14 Eagle Technology, Llc Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US11256049B2 (en) * 2020-04-22 2022-02-22 Nokia Solutions And Networks Oy Optical-to-electric-to-optical routing engine
US11437323B2 (en) 2020-06-03 2022-09-06 Hewlett Packard Enterprise Development Lp Silicon interposer for capacitive coupling of photodiode arrays
US11283204B1 (en) 2020-11-19 2022-03-22 Eagle Technology, Llc Systems and methods for providing a composite connector for high speed interconnect systems
US11929357B2 (en) 2021-10-20 2024-03-12 Advanced Semiconductor Engineering, Inc. Optoelectronic package structure and method of manufacturing the same
CN113917631B (zh) * 2021-10-20 2024-03-01 东莞立讯技术有限公司 共封装集成光电模块及共封装光电交换芯片结构
CN116299887B (zh) * 2021-12-14 2026-04-21 上海曦智科技股份有限公司 光互连装置及其制造方法、计算装置
JP7895434B2 (ja) 2022-03-18 2026-07-27 セレスティアル エーアイ インコーポレイテッド 光学マルチダイ相互接続ブリッジ（ｏｍｉｂ）
US12436346B2 (en) 2022-03-18 2025-10-07 Celestial Ai Inc. Optically bridged multicomponent package with extended temperature range
CN116936557A (zh) * 2022-03-31 2023-10-24 华为技术有限公司 一种光电共封装结构及通信设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9202077L (sv) * 1992-07-06 1994-01-07 Ellemtel Utvecklings Ab Komponentmodul
JP2002050821A (ja) * 2000-07-31 2002-02-15 Kyocera Corp 光実装基板及びそれを用いた光モジュール
JP2002261265A (ja) * 2001-03-06 2002-09-13 Sumitomo Electric Ind Ltd 光通信装置
US20030038297A1 (en) * 2001-07-24 2003-02-27 Robert Carroll Apparatus,system, and method for transmission of information between microelectronic devices
US6752539B2 (en) * 2002-06-28 2004-06-22 International Buisness Machines Corporation Apparatus and system for providing optical bus interprocessor interconnection
US7327022B2 (en) * 2002-12-30 2008-02-05 General Electric Company Assembly, contact and coupling interconnection for optoelectronics
US7128472B2 (en) * 2003-07-31 2006-10-31 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
JP2005085844A (ja) * 2003-09-05 2005-03-31 Ngk Spark Plug Co Ltd 光電気複合配線構造体及びその製造方法
JP2005159060A (ja) * 2003-11-26 2005-06-16 Kyocera Corp 同軸型半導体レーザモジュール
US7058247B2 (en) * 2003-12-17 2006-06-06 International Business Machines Corporation Silicon carrier for optical interconnect modules
US7657185B2 (en) * 2004-01-26 2010-02-02 Opnext, Inc. Electronic interface for long reach optical transceiver
JP4138689B2 (ja) * 2004-03-30 2008-08-27 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージ及びｌｓｉパッケージ
JP2006259682A (ja) * 2005-02-18 2006-09-28 Sony Corp 光電複合装置、それに用いられるｉｃソケットおよび光導波路、光導波路結合チップ、並びにそれを用いた電子機器
JP2007057972A (ja) * 2005-08-25 2007-03-08 Nec Electronics Corp 光モジュール
US8014638B2 (en) * 2006-04-03 2011-09-06 The University Of Tokyo Signal transmission device
KR101057565B1 (ko) * 2006-09-21 2011-08-17 히다치 가세고교 가부시끼가이샤 광 도파로 기판 및 그것을 이용한 광전기 하이브리드 회로 실장 기판
US7891924B2 (en) * 2006-11-03 2011-02-22 Huck International, Inc. Low swage load fastening system and method
US7329054B1 (en) * 2007-03-05 2008-02-12 Aprius, Inc. Optical transceiver for computing applications
JP4895957B2 (ja) * 2007-09-25 2012-03-14 日本特殊陶業株式会社 光電気混載パッケージ、光電気混載モジュール
DE112008003647B4 (de) * 2008-01-30 2015-05-21 Hewlett-Packard Development Company, L.P. Optische Verbindungen
US8422837B2 (en) * 2008-02-28 2013-04-16 Nec Corporation Semiconductor device
US9112616B2 (en) * 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
JP5102815B2 (ja) * 2009-08-31 2012-12-19 日立電線株式会社 光電気複合配線モジュールおよびその製造方法
JP5300700B2 (ja) * 2009-11-28 2013-09-25 京セラ株式会社 光配線基板
JP2011248243A (ja) * 2010-05-28 2011-12-08 Fujitsu Component Ltd 光電変換モジュール及び光電変換装置

Also Published As

Publication number Publication date
EP2820461B1 (en) 2020-04-08
WO2013130831A2 (en) 2013-09-06
TWI598647B (zh) 2017-09-11
US20130230272A1 (en) 2013-09-05
TW201400894A (zh) 2014-01-01
CN104395801A (zh) 2015-03-04
WO2013130831A3 (en) 2013-12-27
JP2015511027A (ja) 2015-04-13
CN104395801B (zh) 2017-03-01
EP2820461A2 (en) 2015-01-07

Similar Documents

Publication Publication Date Title
EP2820461B1 (en) Chip assembly configuration with densely packed optical interconnects
US11424837B2 (en) Method and system for large silicon photonic interposers by stitching
US12274036B2 (en) Heatsink for co-packaged optical switch rack package
US9671572B2 (en) Integrated chip package with optical interface
US20240036254A1 (en) High-capacity optical input/output for data processors
Krishnamoorthy et al. From chip to cloud: Optical interconnects in engineered systems
US8998509B2 (en) Stackable photonic interconnect module
US20240097796A1 (en) Photonic chiplet packaging
TWI730325B (zh) 伺服器盒子
CN110837150A (zh) 互连封装件、互连器件和制成光学通信的互连器件的方法
US11561352B2 (en) High density optical I/O inside a data center switch using multi-core fibers
CN104503044A (zh) 光模块
US11630274B2 (en) High-density optical communications using multi-core fiber
US12101122B2 (en) Hybrid integration of microLED interconnects with ICs
Schow et al. Get on the optical bus
Li et al. Transferring high-speed data over long distances with combined FPGA and multichannel optical modules
Schares et al. Optics in future data center networks
Tsiokos et al. Optical interconnects: fundamentals
WO2015132849A1 (ja) 光電気変換モジュールおよびそれを用いた情報装置
US10791385B2 (en) Optical to electrical conversion module
US20030038297A1 (en) Apparatus,system, and method for transmission of information between microelectronic devices
US12627380B2 (en) Communication interface unit
Taira Technology for optical co-packaging
TWI879509B (zh) 半導體結構及其製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20161130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170131

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170704

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20171027

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20171120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180123

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180216

R150 Certificate of patent or registration of utility model

Ref document number: 6294838

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250