SG11201703131WA - Optoelectronic ball grid array package with fiber - Google Patents

Optoelectronic ball grid array package with fiber

Info

Publication number
SG11201703131WA
SG11201703131WA SG11201703131WA SG11201703131WA SG11201703131WA SG 11201703131W A SG11201703131W A SG 11201703131WA SG 11201703131W A SG11201703131W A SG 11201703131WA SG 11201703131W A SG11201703131W A SG 11201703131WA SG 11201703131W A SG11201703131W A SG 11201703131WA
Authority
SG
Singapore
Prior art keywords
optoelectronic
fiber
grid array
ball grid
array package
Prior art date
Application number
SG11201703131WA
Inventor
Christopher Doerr
Original Assignee
Acacia Communications Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acacia Communications Inc filed Critical Acacia Communications Inc
Publication of SG11201703131WA publication Critical patent/SG11201703131WA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4273—Thermal aspects, temperature control or temperature monitoring with heat insulation means to thermally decouple or restrain the heat from spreading
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/4457—Bobbins; Reels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
SG11201703131WA 2014-10-29 2015-10-29 Optoelectronic ball grid array package with fiber SG11201703131WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462069877P 2014-10-29 2014-10-29
PCT/US2015/058070 WO2016069901A1 (en) 2014-10-29 2015-10-29 Optoelectronic ball grid array package with fiber

Publications (1)

Publication Number Publication Date
SG11201703131WA true SG11201703131WA (en) 2017-05-30

Family

ID=54479012

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201805058VA SG10201805058VA (en) 2014-10-29 2015-10-29 Optoelectronic ball grid array package with fiber
SG11201703131WA SG11201703131WA (en) 2014-10-29 2015-10-29 Optoelectronic ball grid array package with fiber

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201805058VA SG10201805058VA (en) 2014-10-29 2015-10-29 Optoelectronic ball grid array package with fiber

Country Status (5)

Country Link
US (2) US11360278B2 (en)
CN (1) CN107076933B (en)
DE (1) DE112015004963T5 (en)
SG (2) SG10201805058VA (en)
WO (1) WO2016069901A1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3400486B1 (en) * 2016-01-04 2023-06-07 Infinera Corporation Photonic integrated circuit package
US20170288780A1 (en) * 2016-03-31 2017-10-05 Intel Corporation Optoelectronic transceiver assemblies
US10749603B2 (en) * 2016-07-14 2020-08-18 Ayar Labs, Inc. Laser module for optical data communication system within silicon interposer
FR3058005B1 (en) 2016-10-21 2018-10-26 Sagemcom Broadband Sas COIL INTENDED TO WIND A FIBER OPTIC CABLE TYPE CABLE STRING
US10054749B1 (en) * 2017-04-12 2018-08-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports
US10025047B1 (en) * 2017-04-14 2018-07-17 Google Llc Integration of silicon photonics IC for high data rate
US11333907B2 (en) 2017-05-23 2022-05-17 Rockley Photonics Limited Optical engine
CN111566532B (en) * 2018-02-01 2022-07-05 电光-Ic股份有限公司 Surface mount package for single mode electro-optic modules
US11573387B2 (en) 2018-04-12 2023-02-07 Rockley Photonics Limited Optical engine
CN112368621B (en) * 2018-04-12 2024-06-21 洛克利光子有限公司 Electro-optic package and method of manufacture
US11043478B2 (en) 2018-04-24 2021-06-22 Cisco Technology, Inc. Integrated circuit bridge for photonics and electrical chip integration
US10872854B2 (en) 2018-04-25 2020-12-22 Rockley Photonics Limited Electro-optical package and method of fabrication
JP6774456B2 (en) * 2018-04-26 2020-10-21 日本電信電話株式会社 Optical module
US11507818B2 (en) 2018-06-05 2022-11-22 Lightelligence PTE. Ltd. Optoelectronic computing systems
JP2021527287A (en) 2018-06-05 2021-10-11 ライテリジェンス・インコーポレイテッド Optical electronic computing system
CN108879325B (en) * 2018-07-05 2020-07-31 扬州乾照光电有限公司 VCSE L array chip and manufacturing method
EP3847876A4 (en) * 2018-09-04 2021-08-25 Jabil, Inc. Apparatus, system, and method of providing a tray for holding an optoelectronic device during printed circuit board manufacturing
US10928593B2 (en) * 2018-10-03 2021-02-23 Elenion Technologies, Llc Fiber holder
US11734556B2 (en) 2019-01-14 2023-08-22 Lightelligence PTE. Ltd. Optoelectronic computing systems
JP6853298B2 (en) * 2019-05-21 2021-03-31 Ｎｔｔエレクトロニクス株式会社 Optical module
JPWO2021001890A1 (en) * 2019-07-01 2021-01-07
EP4022371A4 (en) * 2019-09-27 2023-08-23 IPG Photonics Corporation Photonic integrated circuit (pic) package
US11387374B2 (en) 2019-11-26 2022-07-12 Corning Research & Development Corporation Optoelectronic package assemblies including solder reflow compatible fiber array units and methods for assembling the same
WO2021195942A1 (en) * 2020-03-31 2021-10-07 华为技术有限公司 Photoelectric co-packaging integrated device
US20230258872A1 (en) * 2020-08-05 2023-08-17 Nippon Telegraph And Telephone Corporation Optical Module
CN114077016B (en) * 2020-08-11 2023-09-01 美国莫列斯有限公司 Package structure with photonic integrated circuit
US11726260B2 (en) * 2020-09-29 2023-08-15 Google Llc Substrate coupled grating couplers in photonic integrated circuits
US20220187549A1 (en) * 2020-12-15 2022-06-16 Intel Corporation Faraday rotator optical interconnects for optical insulator in semiconductor substrate packaging
CN113514923B (en) * 2021-07-01 2023-04-25 上海曦智科技有限公司 Packaging structure and packaging method thereof
DE102021208953A1 (en) * 2021-08-16 2023-02-16 Robert Bosch Gesellschaft mit beschränkter Haftung Packaging arrangement as well as LiDAR system
US11762155B2 (en) 2021-08-25 2023-09-19 Cisco Technology, Inc. Photonics packaging platform
US11835777B2 (en) * 2022-03-18 2023-12-05 Celestial Ai Inc. Optical multi-die interconnect bridge (OMIB)
CN114779412B (en) * 2022-03-28 2023-05-09 青岛海信宽带多媒体技术有限公司 Optical module

Family Cites Families (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2492542A1 (en) 1980-09-23 1982-04-23 Thomson Csf METHOD FOR ALIGNING A GLASS FIBER THAT IS PART OF AN OPTICAL TRANSMISSION CABLE WITH AN OPTOELECTRONIC COMPONENT, ADAPTER, AND COUPLING HEAD COMPRISING THE USE OF THE METHOD
US4776661A (en) 1985-11-25 1988-10-11 Canon Kabushiki Kaisha Integrated optical device
US4826272A (en) 1987-08-27 1989-05-02 American Telephone And Telegraph Company At&T Bell Laboratories Means for coupling an optical fiber to an opto-electronic device
EP0309744A3 (en) 1987-09-29 1989-06-28 Siemens Aktiengesellschaft Arrangement with a thin-film waveguide extending in a flat manner
US5146518A (en) 1990-03-30 1992-09-08 The Furukawa Electric Co., Ltd. Optical directional coupler device and a method of driving same
JPH04219657A (en) 1990-04-13 1992-08-10 Ricoh Co Ltd Magneto-optical information recording and reproducing device and mode splitter
IT1255953B (en) * 1992-10-30 1995-11-17 Pirelli Cavi Spa COMPACT OPTICAL AMPLIFIER WITH SEPARATE FUNCTIONS
US5469526A (en) * 1994-01-07 1995-11-21 Porta Systems Corp. Optical fiber support for printed circuit boards
US5420947A (en) 1994-06-17 1995-05-30 Eastman Kodak Company Method for achromatically coupling a beam of light into a waveguide
US5544268A (en) 1994-09-09 1996-08-06 Deacon Research Display panel with electrically-controlled waveguide-routing
US5581642A (en) 1994-09-09 1996-12-03 Deacon Research Optical frequency channel selection filter with electronically-controlled grating structures
US6320257B1 (en) * 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US5790730A (en) 1994-11-10 1998-08-04 Kravitz; Stanley H. Package for integrated optic circuit and method
US5659641A (en) * 1995-12-22 1997-08-19 Corning, Inc. Optical circuit on printed circuit board
IT1283720B1 (en) * 1996-04-05 1998-04-30 Pirelli Cavi S P A Ora Pirelli EQUIPMENT AND METHOD FOR THE HOUSING OF ELECTRO-OPTICAL COMPONENTS WITH HIGH HEAT EMISSION
IT1283721B1 (en) * 1996-04-05 1998-04-30 Pirelli Cavi S P A Ora Pirelli APPARATUS AND METHOD FOR HOUSING OPTICAL COMPONENTS
KR100242412B1 (en) * 1996-10-25 2000-03-02 윤종용 Packaging box for optical element fixing of optical fiber amplifier
TW373083B (en) 1996-12-20 1999-11-01 Corning Inc Reflective coupling array for optical waveguide
US5778132A (en) * 1997-01-16 1998-07-07 Ciena Corporation Modular optical amplifier and cassette system
US5943461A (en) * 1997-05-12 1999-08-24 Lucent Technologies Inc Connectorized optical module package and method using same with internal fiber connections
GB9710062D0 (en) 1997-05-16 1997-07-09 British Tech Group Optical devices and methods of fabrication thereof
DE19720784A1 (en) 1997-05-17 1998-11-26 Deutsche Telekom Ag Integrated optical circuit
KR100248050B1 (en) * 1997-07-31 2000-03-15 윤종용 Packaging apparatus for optical fiber amplifier
US6224268B1 (en) * 1998-04-23 2001-05-01 The Whitaker Corporation Plug housing with attached cantilevered latch for a fiber optic connector
JP2000013460A (en) * 1998-06-23 2000-01-14 Fujitsu Ltd Line terminating device
JP3688131B2 (en) * 1998-09-10 2005-08-24 日本電信電話株式会社 Optical amplification element
US6198860B1 (en) 1998-09-22 2001-03-06 Massachusetts Institute Of Technology Optical waveguide crossings
US6684007B2 (en) * 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6690845B1 (en) * 1998-10-09 2004-02-10 Fujitsu Limited Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making
US6263143B1 (en) * 1998-10-15 2001-07-17 Lucent Technologies Inc. Package housing for laser module wound on a spool
JP2002531937A (en) * 1998-12-02 2002-09-24 コーニング インコーポレイテッド Removable integrated card-type plug-in pump laser device
US6546180B1 (en) * 1999-01-06 2003-04-08 Sumitomo Electric Industries, Ltd. Coiled optical assembly and fabricating method for the same
JP3684101B2 (en) * 1999-04-02 2005-08-17 日本電信電話株式会社 Optical component module
US6445939B1 (en) 1999-08-09 2002-09-03 Lightlab Imaging, Llc Ultra-small optical probes, imaging optics, and methods for using same
US6334020B1 (en) * 1999-09-30 2001-12-25 The Boeing Company Compact package structure for fiber optic devices
US6567963B1 (en) * 1999-10-22 2003-05-20 Tera Connect, Inc. Wafer scale integration and remoted subsystems using opto-electronic transceivers
DE60017284T2 (en) * 1999-11-30 2005-12-08 Corning O.T.I. S.R.L. OPTICAL DEVICE WITH A FIBER OPTIC COMPONENT
US6477297B1 (en) * 2000-03-08 2002-11-05 Corning Incorporated Reduction of bend loss through constraint of optical fiber parameters
JP2001257402A (en) * 2000-03-08 2001-09-21 Nec Corp Optical amplification medium component and optical fiber amplifier provided therewith
RU2176411C1 (en) 2000-03-31 2001-11-27 Павлов Борис Сергеевич Acoustooptical frequency filter
US6631027B2 (en) * 2000-04-13 2003-10-07 Corning Incorporated Universal controller for an optical amplifier that operates over a wide dynamic range of optical signals and optical amplifiers utilizing such controllers
US6642613B1 (en) * 2000-05-09 2003-11-04 National Semiconductor Corporation Techniques for joining an opto-electronic module to a semiconductor package
US6542682B2 (en) 2000-08-15 2003-04-01 Corning Incorporated Active photonic crystal waveguide device
AU2002239622A1 (en) * 2000-12-13 2002-06-24 Teraconnect, Inc. An optical waveguide assembly for interfacing a two-dimensional optoelectronic array to fiber bundles
AU2002231027A1 (en) * 2000-12-13 2002-06-24 Teraconnect, Inc. A packaging system for two-dimensional optoelectronic arrays
US6442322B1 (en) * 2000-12-22 2002-08-27 Jds Uniphase Corporation Optical fiber management device
US20020168147A1 (en) * 2001-02-20 2002-11-14 Case Steven K. Optical circuit pick and place machine
US6522459B1 (en) * 2001-02-22 2003-02-18 Onetta, Inc. Temperature control and monitoring of optical detector components in an optical communication system
GB2373374B (en) * 2001-03-15 2004-03-17 Agilent Technologies Inc Novel fiber optic transceiver module
WO2002075379A2 (en) * 2001-03-19 2002-09-26 Bookham Technology Plc Optical components
US6503336B1 (en) * 2001-03-21 2003-01-07 Emc Corporation Techniques for modifying a circuit board using a flow through nozzle
JP2002286976A (en) * 2001-03-26 2002-10-03 Auto Network Gijutsu Kenkyusho:Kk Optical connector device and optical connector
US20030016440A1 (en) * 2001-07-17 2003-01-23 Terra Worx, Inc. Optical fiber oven
US7073953B2 (en) * 2001-08-31 2006-07-11 Amphenol Corporation Modular fiber optic connection system
US6668130B2 (en) * 2001-10-18 2003-12-23 Tektronix, Inc. Optical fiber harness
US7110527B2 (en) * 2001-12-04 2006-09-19 Adc Telecommunications, Inc. Housing for telecommunications equipment
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US20030223683A1 (en) * 2002-03-27 2003-12-04 Bennett Kevin W. Modular optical amplifier assembly
DE60224359D1 (en) * 2002-03-27 2008-02-14 Avago Tech Fiber Ip Sg Pte Ltd module device
GB0208255D0 (en) 2002-04-10 2002-05-22 Imec Inter Uni Micro Electr Photonic crystal based fiber-to-waveguide coupler for polarisation independent photonic integrated circuits
US7233712B2 (en) * 2002-04-22 2007-06-19 Sanmina-Sci Corporation Temperature-controlled flexible optical circuit for use in an erbium-doped fiber amplifier and method for fabricating the flexible optical circuit
US7239783B2 (en) * 2002-07-01 2007-07-03 Sumitomo Electric Industries, Ltd. Optical fiber, dispersion compensator, and optical transmission system
US6822465B1 (en) * 2002-08-09 2004-11-23 Unisys Corporation Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent
US20040036170A1 (en) * 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
JP3861864B2 (en) * 2002-10-10 2006-12-27 住友電気工業株式会社 Optical module
US20040076380A1 (en) * 2002-10-22 2004-04-22 Autonetworks Technologies, Ltd. Optical connector
US20040101020A1 (en) * 2002-11-26 2004-05-27 Photodigm, Inc. Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule
EP1579253A1 (en) * 2002-12-19 2005-09-28 Red Sky Systems, Inc. Hermetically sealed optical amplifier module to be integrated into a pressure vessel
US7327022B2 (en) * 2002-12-30 2008-02-05 General Electric Company Assembly, contact and coupling interconnection for optoelectronics
US6932520B2 (en) * 2003-02-03 2005-08-23 Jds Uniphase Corporation Modular optical components
US6945712B1 (en) * 2003-02-27 2005-09-20 Xilinx, Inc. Fiber optic field programmable gate array integrated circuit packaging
US7006732B2 (en) 2003-03-21 2006-02-28 Luxtera, Inc. Polarization splitting grating couplers
ITTO20030284A1 (en) 2003-04-11 2004-10-12 St Microelectronics Srl PROCEDURE FOR THE IMPLEMENTATION OF ENCAPSULATED OPTO-ELECTRONIC DEVICES AND ENCAPSULATED DEVICE SO OBTAINED.
JP3795877B2 (en) * 2003-07-28 2006-07-12 株式会社東芝 Optical semiconductor module and manufacturing method thereof
US7058247B2 (en) * 2003-12-17 2006-06-06 International Business Machines Corporation Silicon carrier for optical interconnect modules
TWI231108B (en) 2004-02-06 2005-04-11 Delta Electronics Inc Optical transceiver module and manufacturing method thereof
US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
JP4138689B2 (en) * 2004-03-30 2008-08-27 株式会社東芝 LSI package with interface module and LSI package
US7295037B2 (en) 2004-11-08 2007-11-13 Tabula, Inc. Configurable IC with routing circuits with offset connections
JP2006301610A (en) * 2005-03-25 2006-11-02 Fuji Xerox Co Ltd Optical coupling device
TWI279095B (en) 2005-04-01 2007-04-11 Delta Electronics Inc Optical transceiver module
JP4116017B2 (en) * 2005-05-25 2008-07-09 株式会社フジクラ Optical connector
US20070031100A1 (en) * 2005-08-04 2007-02-08 Garcia Cesar G Optical fiber distribution cabinet
US7729581B2 (en) * 2006-05-05 2010-06-01 Reflex Photonics Inc. Optically-enabled integrated circuit package
JP4687621B2 (en) * 2006-09-08 2011-05-25 日立電線株式会社 Communication module with switch function and communication device
US7782911B2 (en) * 2007-02-21 2010-08-24 Deep Photonics Corporation Method and apparatus for increasing fiber laser output power
JP2008225339A (en) * 2007-03-15 2008-09-25 Hitachi Cable Ltd Optical system connection structure, optical member, and optical transmission module
JP4877009B2 (en) * 2007-03-28 2012-02-15 日本電気株式会社 Optical direct amplifier for WDM optical transmission
JP2008257094A (en) * 2007-04-09 2008-10-23 Hitachi Cable Ltd Optical transmission module and optical patch cable
US7785020B2 (en) * 2007-07-06 2010-08-31 Finisar Corporation Optical component and transceiver packaging
US8064739B2 (en) * 2007-10-23 2011-11-22 Hewlett-Packard Development Company, L.P. Three-dimensional die stacks with inter-device and intra-device optical interconnect
JP5157393B2 (en) * 2007-11-29 2013-03-06 住友電気工業株式会社 Optical module and cable unit with optical module
WO2009117371A1 (en) * 2008-03-15 2009-09-24 Morgan Research Corporation Fiber laser coil form and related manufacturing techniques
US8168939B2 (en) * 2008-07-09 2012-05-01 Luxtera, Inc. Method and system for a light source assembly supporting direct coupling to an integrated circuit
US8877616B2 (en) * 2008-09-08 2014-11-04 Luxtera, Inc. Method and system for monolithic integration of photonics and electronics in CMOS processes
US8831437B2 (en) * 2009-09-04 2014-09-09 Luxtera, Inc. Method and system for a photonic interposer
US7957623B2 (en) * 2008-09-19 2011-06-07 Pyrophotonics Lasers Inc. Deformable thermal pads for optical fibers
US8058137B1 (en) * 2009-04-14 2011-11-15 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8290008B2 (en) * 2009-08-20 2012-10-16 International Business Machines Corporation Silicon carrier optoelectronic packaging
EP2462751B1 (en) 2009-09-09 2013-06-05 Broadcom Corporation Ethernet passive optical network over coaxial (epoc)
US8821039B2 (en) * 2009-10-29 2014-09-02 Sumitomo Electric Industries, Ltd. Optical transceiver having optical receptacle arranged diagonally to longitudinal axis
JP2012252135A (en) * 2011-06-02 2012-12-20 Sumitomo Electric Ind Ltd Optical communication device
US9052477B2 (en) * 2009-10-29 2015-06-09 Sumitomo Electric Industries, Ltd. Optical transceiver with inner fiber set within tray securing thermal path from electronic device to housing
US8376634B2 (en) * 2009-10-29 2013-02-19 Sumitomo Electric Industries, Ltd. Pluggable optical transceiver and method for manufacturing the same
US20110135301A1 (en) 2009-12-08 2011-06-09 Vello Systems, Inc. Wavelocker for Improving Laser Wavelength Accuracy in WDM Networks
US8493651B1 (en) * 2010-04-12 2013-07-23 Lockheed Martin Corporation Apparatus for optical fiber management and cooling
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
JP2012028588A (en) * 2010-07-23 2012-02-09 Fujitsu Ltd Optical amplification module and optical switch device
US8824837B2 (en) * 2010-08-26 2014-09-02 The Board Of Trustees Of The Leland Stanford Junior University Integration of optoelectronics with waveguides using interposer layer
US8582975B2 (en) * 2010-09-07 2013-11-12 Infinera Corporation Wavelength division multiplexed passive optical network
EP2428828B1 (en) * 2010-09-13 2016-06-29 Tyco Electronics Svenska Holdings AB Miniaturized high speed optical module
US8273610B2 (en) * 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
CN103238094B (en) * 2010-11-05 2016-03-16 Fci公司 There is the optical-electric module of patch cord
US8666255B2 (en) 2010-12-30 2014-03-04 Source Photonics, Inc. Circuits, architectures, apparatuses, systems, and methods for merging of management and data signals, and for recovery of a management signal
TWM449964U (en) * 2011-01-18 2013-04-01 Framatome Connectors Int An optical communications system, and an optical communication module
US8469610B2 (en) * 2011-01-18 2013-06-25 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical connection system with plug having optical turn
US8655183B2 (en) * 2011-08-12 2014-02-18 Applied Optoelectronics, Inc. Optical transceiver that maintains a bend diameter of an internal optical fiber and method of assembling same
EP2788805A4 (en) * 2011-12-09 2015-11-04 Hewlett Packard Development Co Optical connections
US9011025B2 (en) * 2011-12-19 2015-04-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Modified transistor outline (TO)-can assembly for use in optical communications and a method
US9507086B2 (en) * 2011-12-30 2016-11-29 Intel Corporation Optical I/O system using planar light-wave integrated circuit
US9213152B2 (en) * 2012-01-09 2015-12-15 Cisco Technology Inc. Releasable fiber connector for opto-electronic assemblies
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
US9874688B2 (en) * 2012-04-26 2018-01-23 Acacia Communications, Inc. Co-packaging photonic integrated circuits and application specific integrated circuits
US9435959B2 (en) 2012-04-26 2016-09-06 Acacia Communications, Inc. Coupling of fiber optics to planar grating couplers
US9020001B2 (en) 2012-04-26 2015-04-28 Acacia Communications, Inc. Tunable laser using III-V gain materials
US9091827B2 (en) * 2012-07-09 2015-07-28 Luxtera, Inc. Method and system for grating couplers incorporating perturbed waveguides
US9557478B2 (en) * 2012-08-28 2017-01-31 Acacia Communications, Inc. Electronic and optical co-packaging of coherent transceiver
US20140099061A1 (en) * 2012-10-05 2014-04-10 Corning Cable Systems Llc Reconfigurable fiber optic cable assemblies and optical connectors
US9105635B2 (en) * 2013-03-13 2015-08-11 Intel Corporation Stubby pads for channel cross-talk reduction
US9541775B2 (en) * 2013-03-19 2017-01-10 Luxtera, Inc. Method and system for a low-voltage integrated silicon high-speed modulator
US9405073B2 (en) 2013-08-31 2016-08-02 Acacia Communications, Inc. Fiber assembly for facet optical coupling
US9917412B1 (en) * 2016-11-04 2018-03-13 Cisco Technology, Inc. Optical amplifiers with liquid crystal device
CN114204994B (en) * 2018-03-09 2023-07-07 华为技术有限公司 Optical fiber amplifier and gain adjusting method thereof

Also Published As

Publication number Publication date
CN107076933A (en) 2017-08-18
US20160124164A1 (en) 2016-05-05
CN107076933B (en) 2020-08-07
DE112015004963T5 (en) 2017-07-20
SG10201805058VA (en) 2018-07-30
WO2016069901A1 (en) 2016-05-06
US11360278B2 (en) 2022-06-14
US11892690B1 (en) 2024-02-06

Similar Documents

Publication Publication Date Title
SG11201703131WA (en) Optoelectronic ball grid array package with fiber
GB201417836D0 (en) Fibre optic cable with transverse sensitivity
GB201408125D0 (en) Fibre optic distributed sensing
GB201408130D0 (en) Improvements in fibre optic distributed sensing
GB2542924B (en) Optical fiber distributed sensors with improved dynamic range
GB201617419D0 (en) Optical fiber
EP3029498A4 (en) Multi-core fiber
GB201408132D0 (en) Improvements in fibre optic distributed sensing
LT3097395T (en) Fiber coupled integrating sphere based-laser energy meter
GB2553968B (en) Combination microlens optical device
SG10201802209WA (en) Fibers with filler
GB2562334B (en) Optoelectronic device
EP3036289A4 (en) Light harvesting array
HUE058735T2 (en) Fabricating thin-film optoelectronic devices with modified surface
IL260188B (en) Avalanche photodetectors
GB2514993B (en) Optical diode
SG10201706775RA (en) Optoelectronic component
EP3035091A4 (en) Multicore fiber
GB201407699D0 (en) A solar array
SG11201608033RA (en) Solar cell with trench-free emitter regions
EP2963465A4 (en) Multi-core fiber
IL238310B (en) Cdhgte photodiodes array
GB201408947D0 (en) Increased - transparency optoelectronic device
GB201309409D0 (en) Optoelectronic device
EP3161878A4 (en) Optoelectronic package