CN113514923B

CN113514923B - Packaging structure and packaging method thereof

Info

Publication number: CN113514923B
Application number: CN202110744573.5A
Authority: CN
Inventors: 陈俊杰; 吴建华; 孟怀宇; 沈亦晨
Original assignee: Shanghai Xizhi Technology Co ltd
Current assignee: Shanghai Xizhi Technology Co ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2023-04-25
Anticipated expiration: 2041-07-01
Also published as: WO2023273862A1; CN113514923A; CN116299902A

Abstract

The invention provides a packaging structure and a packaging method thereof, wherein the packaging structure comprises: a first substrate having a bearing surface; an electronic integrated circuit disposed on the bearing surface; a photonic integrated circuit having a first surface and a second surface, the first surface of the photonic integrated circuit facing the first substrate, the photonic integrated circuit being disposed on a side of the electronic integrated circuit remote from the first substrate; wherein, the electronic integrated circuit is provided with a through hole; a connector is arranged in the through hole; and the connector is used for electrically connecting the photonic integrated circuit with the first substrate. The invention provides a packaging structure and a packaging method thereof, which can reduce voltage drop and provide richer packaging modes for arrangement of optical elements and electrical elements and electric connection arrangement modes thereof, so that the packaging structure is more flexible and smaller in volume.

Description

Packaging structure and packaging method thereof

Technical Field

The invention relates to a packaging structure and a packaging method thereof.

Background

Currently, optical signals are available for high-speed and secure data transmission between two devices. In some applications, devices capable of optical data transmission and computation generally include a wiring substrate 12, a photonic integrated circuit (Photonic integrated circuits, PIC) component 22, and an electronic integrated circuit (Electronic integrated circuits, EIC) component 16.

Further, fig. 1 shows a package structure in the prior art. As shown in fig. 1, in this structure, the wiring substrate 12, the photonic integrated circuit component 22, and the electronic integrated circuit component 16 are disposed in this order from bottom to top. Further, the dashed arrows in fig. 1 schematically illustrate current paths or signal transmission paths from the electronic integrated circuit assembly 16 to the wiring substrate 12. Specifically, as shown, the current/signal sequentially passes through the wiring lines of the electronic integrated circuit assembly 16, the bonding structures of the electronic integrated circuit assembly 16 and the photonic integrated circuit assembly 22, and the wiring lines of the photonic integrated circuit assembly 22, and is transmitted to the leads 14 through the wiring lines of the photonic integrated circuit assembly 22, and finally flows from the leads 14 into the circuit substrate 12. Since the leads 14 have a certain resistance, and when the photonic integrated circuit element 22 is large in size, the wiring thereon for electrical connection is long. Therefore, due to the resistor, when a larger current flows through the circuit of the electronic integrated circuit assembly 16, a larger voltage drop is generated, so that the voltage actually loaded on the electronic integrated circuit assembly 16 is lower than the design value, and the normal operation requirement of the product cannot be met. Furthermore, in the above-described structure, since the photonic integrated circuit element 22 is located below the electronic integrated circuit element 16, the optical connection and the optical input/output port of the photonic integrated circuit element 22 may be limited, and even the other optical element/electrical element arrangement positions may be limited.

Therefore, there is a need to provide a packaging structure and a packaging method thereof to solve the above-mentioned problems.

It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not to be considered as known to the person skilled in the art simply because they are set forth in the background of the invention section.

Disclosure of Invention

Based on the defects in the prior art, the invention provides the packaging structure and the packaging method thereof, which can reduce voltage drop and provide richer packaging modes for the arrangement of the optical element and the electrical connection arrangement mode thereof, thereby leading the packaging structure to be more flexible and smaller in volume.

In order to achieve the above object, the present invention provides the following technical solutions. A package structure, comprising: a first substrate having a bearing surface; an electronic integrated circuit disposed on the bearing surface; a photonic integrated circuit having a first surface and a second surface, the first surface of the photonic integrated circuit facing the first substrate, the photonic integrated circuit being disposed on a side of the electronic integrated circuit remote from the first substrate; wherein, the electronic integrated circuit is provided with a through hole; a connector is arranged in the through hole; and the connector is used for electrically connecting the photonic integrated circuit with the first substrate.

A package structure, comprising: a first substrate; a photonic integrated circuit having a first surface and a second surface, the first surface of the photonic integrated circuit facing the first substrate; the photonic integrated circuit is spaced from the first substrate by a distance.

As a preferred embodiment, further comprising: and the connecting structure is connected with the first substrate and/or the photonic integrated circuit, and is connected with the second surface of the photonic integrated circuit.

As a preferred embodiment, further comprising: and the light guide structure is optically coupled with the photonic integrated circuit.

As a preferred embodiment, further comprising: the light guide structure is arranged on one side of the photonic integrated circuit, which faces the bearing surface.

As a preferred embodiment, further comprising: and the first substrate is arranged on the second substrate.

As a preferred embodiment, at least one of the first substrate, the second substrate and the connection structure is provided with an opening, and the light guiding structure is optically coupled with the photonic integrated circuit through the opening.

As a preferred embodiment, further comprising: and the heat sink is arranged on one side of the photonic integrated circuit far away from the first substrate, or is positioned between the photonic integrated circuit and the connecting structure.

As a preferred embodiment, the first substrate has a bearing surface; the packaging structure comprises an electronic integrated circuit, wherein the electronic integrated circuit is arranged on the bearing surface of the first substrate; the photonic integrated circuit is arranged on one side of the electronic integrated circuit far away from the first substrate.

As a preferred embodiment, a receiving space is formed between the connection structure and the first substrate, and the photonic integrated circuit and the electronic integrated circuit are both received in the receiving space.

As a preferred embodiment, a carrier plate is arranged between the photonic integrated circuit and the connection structure.

As a preferred embodiment, further comprising: the light source assembly, the lens assembly and the steering prism assembly are sequentially arranged in the transmission direction of the light signals; the light source assembly is used for generating an optical signal; the lens component is used for converging the optical signals; the steering prism component is used for changing the transmission direction of the converged optical signals; the photonic integrated circuit is located downstream of the turning prism assembly in a transmission direction of the optical signal; so as to be capable of receiving the light signal emitted by the steering prism assembly.

As a preferred embodiment, the light source assembly and the lens assembly are arranged in parallel on the bearing surface, and the turning prism assembly is arranged on the side of the photonic integrated circuit facing the bearing surface.

As a preferred embodiment, the first base plate is provided with a first opening at a position facing the steering prism assembly, the first opening being for mounting the steering prism assembly and exposing the steering prism assembly to the outside.

As a preferred embodiment, further comprising: the carrier plate is arranged on one side of the photonic integrated circuit, which is far away from the electronic integrated circuit; the light source component and the lens component are arranged on the carrier plate in parallel; the turning prism assembly is disposed on the photonic integrated circuit.

As a preferred embodiment, the first substrate is provided with a second opening for mounting the light source assembly, the lens assembly and the turning prism assembly, and exposing the light source assembly, the lens assembly and the turning prism assembly to the outside.

As a preferred embodiment, the light source assembly, the lens assembly and the turning prism assembly are all adhered to the photonic integrated circuit.

As a preferred embodiment, the first substrate is provided with a third opening for the light source assembly, the lens assembly and the turning prism assembly to extend into and expose all of the light source assembly, the lens assembly and the turning prism assembly.

A method of packaging, comprising: providing a first substrate, wherein the first substrate is provided with a bearing surface; a through hole is formed in the electronic integrated circuit, and a connector is arranged in the through hole; mounting an electronic integrated circuit on the bearing surface; the first surface of the photonic integrated circuit faces the first substrate, and the photonic integrated circuit is arranged on one side of the electronic integrated circuit away from the bearing surface; and electrically connecting the photonic integrated circuit with the first substrate through the connector.

A method of packaging, comprising: providing a first substrate; the first surface of the photonic integrated circuit is oriented toward the first substrate such that the photonic integrated circuit is spaced a distance from the first substrate.

As a preferred embodiment, further comprising: and mounting a connection structure on the second surface of the photonic integrated circuit, and connecting the connection structure with the first substrate and/or the photonic integrated circuit.

As a preferred embodiment, further comprising: optically coupling a light guiding structure with the photonic integrated circuit.

As a preferred embodiment, further comprising: and installing the light guide structure on one side of the photonic integrated circuit facing the bearing surface.

As a preferred embodiment, further comprising: the first substrate is mounted on a second substrate.

As a preferred embodiment, further comprising: and opening at least one of the first substrate, the second substrate and the connecting structure so that the light guide structure can pass through the opening to be optically coupled with the photonic integrated circuit.

As a preferred embodiment, further comprising: and installing a heat sink on one side of the photonic integrated circuit far away from the first substrate, or installing a heat sink between the photonic integrated circuit and the connection structure.

As a preferred embodiment, the step of directing the first surface of the photonic integrated circuit toward the first substrate such that the photonic integrated circuit is spaced apart from the first substrate by a distance, specifically includes: mounting an electronic integrated circuit on a bearing surface of the first substrate; the photonic integrated circuit is disposed on a side of the electronic integrated circuit remote from the first substrate.

As a preferred embodiment, further comprising: accommodating both the photonic integrated circuit and the electronic integrated circuit in an accommodating space; wherein, the connecting structure and the first substrate form the accommodating space therebetween.

As a preferred embodiment, further comprising: and mounting a carrier plate between the photonic integrated circuit and the connection structure.

As a preferred embodiment, further comprising: the light source component, the lens component and the steering prism component are arranged, so that the photonic integrated circuit can receive the light signals emitted by the steering prism component.

As a preferred embodiment, the steps of installing the light source assembly, the lens assembly and the turning prism assembly so that the photonic integrated circuit can receive the light signal emitted by the turning prism assembly include: attaching a light source assembly and a lens assembly in parallel on the bearing surface; and adhering the steering prism assembly to a side of the photonic integrated circuit facing the bearing surface through a first opening, wherein the first opening is arranged on the first substrate.

As a preferred embodiment, the steps of installing the light source assembly, the lens assembly and the turning prism assembly so that the photonic integrated circuit can receive the light signal emitted by the turning prism assembly include: the light source component, the lens component and the steering prism component are adhered to the side of the carrier plate, which faces the carrying surface, in parallel through the second opening; wherein the carrier plate is positioned at one side of the photonic integrated circuit far away from the electronic integrated circuit; the second opening is arranged on the first substrate;

Or alternatively, the process may be performed,

adhering the light source component and the lens component to one side of the carrier plate facing the carrying surface in parallel through the second opening; and adhering the turning prism assembly to the photonic integrated circuit.

As a preferred embodiment, the steps of installing the light source assembly, the lens assembly and the turning prism assembly so that the photonic integrated circuit can receive the light signal emitted by the turning prism assembly include: adhering the light source assembly, the lens assembly and the turning prism assembly in parallel to a side of the photonic integrated circuit facing the bearing surface through a third opening; wherein the third opening is disposed on the first substrate.

The packaging structure and the packaging method thereof of the embodiment of the invention are provided with the first substrate, the electronic integrated circuit and the photonic integrated circuit. The photonic integrated circuit is arranged on one side of the electronic integrated circuit far away from the bearing surface. For example, as shown in fig. 2, the photonic integrated circuit is disposed above the electronic integrated circuit such that the arrangement of optical elements on the photonic integrated circuit is not affected by other devices above it; and photonic integrated circuits do not limit the placement of other optical or electrical components. Compared with the packaging structure shown in fig. 1 in the prior art, the packaging structure of the embodiment of the invention has more flexible arrangement modes of the optical elements and the electrical elements and is also richer. Further, the electronic integrated circuit is electrically connected to the first substrate. Compared with the packaging structure shown in fig. 1 in the prior art, the current/signal on the electronic integrated circuit can be directly transmitted to the first substrate without passing through the photonic integrated circuit, so that the transmission distance between the current/signal on the electronic integrated circuit and the first substrate is shortened, and the voltage drop of the electronic integrated circuit can be reduced; so that the voltage actually loaded on the electronic integrated circuit (Electronic integrated circuits, EIC) is not lower than the design value, thereby meeting the normal working requirement of the product. Still further, a via is also provided on the electronic integrated circuit. A connector is arranged in the through hole. The connector is used for electrically connecting the photonic integrated circuit with the first substrate. Thus, the transmission distance between the current/signal on the photonic integrated circuit and the first substrate is shortened, and the voltage drop of the photonic integrated circuit can be reduced. The invention further provides a packaging structure and a packaging method thereof, which can reduce voltage drop and provide richer packaging modes for the arrangement of optical elements and electrical elements and the electrical connection arrangement modes thereof, so that the packaging structure is more flexible and smaller in volume.

Specific embodiments of the invention are disclosed in detail below with reference to the following description and the accompanying drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not limited in scope thereby. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, proportional sizes, and the like of the respective components in the drawings are merely illustrative for aiding in understanding the present invention, and are not particularly limited. Those skilled in the art with access to the teachings of the present invention can select a variety of possible shapes and scale sizes to practice the present invention as the case may be. In the drawings:

Fig. 1 is a schematic structural diagram of a package structure in the prior art.

Fig. 2 is a schematic structural diagram of a package structure according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a first embodiment of a package structure according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of another embodiment of the package structure according to the embodiment of the present application.

Fig. 5 is a schematic structural diagram of a second embodiment of a package structure according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of another embodiment of a package structure according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of another embodiment of a package structure according to an embodiment of the present application.

Fig. 8 is a flowchart of a packaging method according to an embodiment of the present application.

Fig. 9 is a flowchart of another packaging method according to an embodiment of the present application.

Reference numerals illustrate:

11. a first substrate; 12. a circuit substrate; 13. a bearing surface; 14. a lead wire; 15. an electronic integrated circuit; 16. an electronic integrated circuit assembly; 17. a through hole; 19. a connecting body; 21. a photonic integrated circuit; 22. a photonic integrated circuit component; 23. a third surface; 25. a fourth surface; 27. a second substrate; 29. a light guiding structure; 31. a first opening; 33. a second opening; 35. a third opening; 37. a heat sink; 39. a connection structure; 41. an accommodating space; 43. a carrier plate; 45. a light source assembly; 47. a lens assembly; 49. a steering prism assembly; 51. a first opening, 53, a second opening; 55. a third opening; 57. a first surface; 59. a second surface.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, shall fall within the scope of the invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Specifically, the upward direction illustrated in fig. 1 to 7 is defined as "up", and the downward direction illustrated in fig. 1 to 7 is defined as "down".

It should be noted that, the directions are defined in this specification for convenience of illustrating the technical solution of the present invention, and the directions of the package structure in the embodiments of the present invention in the use, testing, transporting and manufacturing scenarios may be reversed or the positions of the components may be changed, which are not limited.

The packaging structure and the packaging method thereof provided by the embodiment of the invention can reduce voltage drop, and provide richer packaging modes for the arrangement of the optical element and the electrical connection arrangement mode thereof, so that the packaging structure is more flexible and smaller in volume. Specifically, in one embodiment, the package structure may generally include the first substrate 11, the electronic integrated circuit 15, and the photonic integrated circuit 21. In another embodiment, the package structure may generally include a first substrate 11 and a photonic integrated circuit 21.

In the present embodiment, the first substrate 11 has a bearing surface 13. The bearing surface 13 is used for bearing. For example, as shown in fig. 2, the bearing surface 13 faces upward. Further, the first substrate 11 further includes a bottom surface opposite to the carrying surface 13. For example, as shown in fig. 2, the bottom surface faces downward. Further, the first substrate 11 may include a base material and a conductive line disposed on the base material. Specifically, the substrate may be bakelite plate, fiberglass plate, plastic plate, etc., which is not specified in this application. Further, the first substrate 11 may be a printed circuit board (Printed circuit boards, PCB). Further, the first substrate 11 may be further provided with a power source and an electronic device thereon. The power supply is electrically connected with the electronic device and the conductive circuit. The electronic device may be a resistor, a capacitor, an inductor, a transistor, a diode, etc., which is not specified in this application. The electronic device may be soldered to a printed circuit board (Printed circuit boards, PCB).

In some embodiments, the photonic integrated circuit is spaced from the electronic integrated circuit by a distance that allows room for optical components such as light sources, lenses, optical fibers, prisms (e.g., turning prisms), etc., which can reduce the package volume.

In the present embodiment, the electronic integrated circuit 15 is disposed on the carrying surface 13. For example, as shown in fig. 2, the electronic integrated circuit 15 is located above the first substrate 11. In particular, the electronic integrated circuit 15 may be adhered to the carrying surface 13. Further, the electronic integrated circuit 15 is electrically connected to the first substrate 11. Specifically, the electronic integrated circuit 15 is electrically connected to the conductive traces of the first substrate 11. Thus, the current/signal on the electronic integrated circuit 15 can be directly transmitted to the first substrate 11 without passing through the photonic integrated circuit 21, so that the transmission distance between the current/signal on the electronic integrated circuit 15 and the first substrate 11 is shortened, and the voltage drop of the electronic integrated circuit 15 can be reduced; so that the voltage actually loaded on the electronic integrated circuit 15 (Electronic integrated circuits, EIC) is not lower than the design value, so as to meet the normal working requirement of the product. In some embodiments, electronic integrated circuit 15 includes one or more active components and/or passive components. Examples of passive components include, but are not limited to, resistors, capacitors, and inductors. Examples of active components include, but are not limited to, diodes, field effect transistors, metal oxide semiconductor field effect transistors, and the like.

Specifically, the electronic integrated circuit 15 is provided with a through hole 17. More specifically, the electronic integrated circuit 15 may be fabricated on a wafer or silicon substrate by semiconductor processing. Further, the via hole 17 may be a via hole formed on the electronic integrated circuit 15 by etching, or the like. Further, the through hole 17 may have a columnar shape. The shape of the through hole 17 is of course not limited to this, and its cross section is irregular, and this is not specified in the present application. Further, a connector 19 is provided in the through hole 17. The connecting body 19 may be filled in the whole through hole 17, that is, the connecting body 19 fills the whole through hole 17, and the connecting body 19 may be irregularly shaped. In this way, the photonic integrated circuit 21 can be electrically connected to the first substrate 11 through the connection body 19 in the through hole 17, the electrical connection distance between the photonic integrated circuit 21 and the first substrate 11 is reduced, and unnecessary voltage drop can be reduced. Illustratively, the photonic integrated circuit 21 is electrically connected to the connection body 19 through a second bonding structure, and the connection body 19 is electrically connected to the first substrate 11 through a third bonding structure. Illustratively, the second and third bonding structures have a molding material (molding compound) surrounding them, which may be, for example, a resin.

Further, the electronic integrated circuit 15 has a third surface 23 close to the carrying surface 13 and a fourth surface 25 remote from the carrying surface 13. The third surface 23 faces downwards, as shown for example in fig. 2. The fourth surface 25 faces upward. Further, the through hole 17 penetrates the third surface 23 and the fourth surface 25. The through hole 17 is a via hole penetrating the electronic integrated circuit 15.

In this embodiment, photonic integrated circuit 21 has a first surface 57 and a second surface 59. For example, as shown in fig. 2, the first surface 57 is a lower surface of the photonic integrated circuit 21. The second surface 59 is the upper surface of the photonic integrated circuit 21. Further, the first surface 57 of the photonic integrated circuit 21 faces the first substrate 11. The photonic integrated circuit 21 is arranged on the side of the electronic integrated circuit 15 remote from the carrying surface 13. For example, as shown in fig. 2, photonic integrated circuit 21 is disposed above electronic integrated circuit 15. I.e. photonic integrated circuit 21 is arranged on one side of fourth surface 25. The arrangement of the optical elements on photonic integrated circuit 21 is thus not affected by other devices above it; and photonic integrated circuit 21 does not limit the placement of other optical or electrical components. Therefore, the arrangement modes of the optical elements and the electrical elements of the packaging structure of the embodiment of the invention are more flexible and richer.

Further, the photonic integrated circuit 21 is electrically connected to the electronic integrated circuit 15, so that the photonic integrated circuit 21 can implement information interaction with the electronic integrated circuit 15, and so on. The photonic integrated circuit 21 may include, among other things, a substrate, an optical modulator, an optical waveguide, an optical coupling structure, and a photodetector. Illustratively, the photonic integrated circuit 21 is electrically connected to the electronic integrated circuit 15 via a first bond structure. Illustratively, the first bonding structure is surrounded by a molding compound (molding compound), which may be, for example, a resin. The electronic integrated circuit 15 is illustratively electrically connected to the optical modulator such that the electronic integrated circuit 15 can send an electrical signal to the optical modulator to modulate and encode the light input to the optical modulator. Of course, the information interaction between the photonic integrated circuit 21 and the electronic integrated circuit 15 may be other ways, which are not specified in the present application. Further, the substrate may include a semiconductor-on-insulator structure, such as a buried dielectric layer. Further, the substrate comprises silicon, silicon oxide, aluminum oxide, sapphire, or any other suitable material.

Further, the package structure of the embodiment of the present application further includes: a second substrate 27. The first substrate 11 is disposed on the second substrate 27. Specifically, the second substrate 27 is disposed on a side of the first substrate 11 away from the carrying surface 13. As shown in fig. 3 to 7, for example, the second substrate 27 is disposed on one side of the bottom surface of the first substrate 11. The second substrate 27 is for supporting the first substrate 11. In particular, the second substrate 27 may be a printed circuit board (Printed circuit boards, PCB). Or the second substrate 27 contains electrical components, optical components, wiring. Or the second substrate 27 is a carrier plate that serves only a load-bearing function. In some embodiments, the second substrate 27 may be a susceptor or replaced with a susceptor. Or the second substrate 27 may be packaged on other substrates, such as a third substrate, or other connection structure 39, a fixed structure, as desired.

Further, the package structure according to the embodiment of the application further includes: a connection structure 39. The connection structure 39 is connected to the first substrate 11 and/or the photonic integrated circuit 21 and the connection structure 39 is connected to the second surface 59 of the photonic integrated circuit 31.

Further, the photonic integrated circuit 21 is provided with a heat sink 37 at a side remote from the first substrate 11. As shown in fig. 3-7, for example, heat sink 37 is disposed over photonic integrated circuit 21. Or heat sink 37 is located between photonic integrated circuit 21 and connection structure 39.

Further, the connection structure 39 may be in the form of a housing, a cover, a connecting rod, a connecting arm, or the like. Further, the connection structure 39 may be a heat conductive material, such as a metal material of copper, aluminum, or the like, or a ceramic material, or graphene, or the like. Further, the connection structure 39 is used to fixedly connect the heat sink 37 and/or the photonic integrated circuit 21 to the first substrate 11. This enhances the robustness of the heat sink 37 and/or the photonic integrated circuit 21 by means of the connection structure 39.

Further, a receiving space 41 is formed between the connection structure 39 and the first substrate 11. The photonic integrated circuit 21 and the electronic integrated circuit 15 are both accommodated in the accommodation space 41.

Further, a carrier plate 43 is arranged between the photonic integrated circuit 21 and the connection structure 39. Specifically, the carrier plate 43 is a thermally conductive rigid chassis. More specifically, the thermally conductive rigid base plate may be a ceramic plate or a metal plate. Further, the carrier plate 43 may be adhered to the photonic integrated circuit 21 and the connection structure 39 by an adhesive.

Further, as shown in fig. 3 to 7, fig. 3 shows a schematic structural diagram of a first example of the package structure according to the embodiment of the present application. Fig. 4 shows another schematic structural diagram of the first embodiment of the package structure according to the embodiment of the present application. Fig. 5 shows a schematic structural diagram of a second embodiment of the package structure according to the embodiment of the present application. Fig. 6 shows another schematic structural diagram of a second example of the package structure according to the embodiment of the present application. Fig. 7 is a schematic structural diagram of another embodiment of a package structure according to an embodiment of the present application. The structural schematic diagrams of the first and second embodiments of the package structure according to the embodiment of the present application will be described in detail below with reference to fig. 3 to 7.

In a first embodiment, the package structure according to the embodiment of the present application further includes: the light guiding structure 29. The light guiding structure 29 is optically coupled to the photonic integrated circuit 21. In particular, the light guiding structure 29 may be arranged on a side of the photonic integrated circuit 21 facing the carrying surface 13. In this embodiment, the light guiding structure 29 is at least one optical fiber. Further, the light guiding structure 29 may be a fiber array (fiber array). Further, as shown in fig. 3 and 4, since the optical region is located outside the electronic integrated circuit 15, the light guiding structure 29 is adhered to the optical region of the photonic integrated circuit 21. The light guiding structure 29 can thus be optically coupled to an optical coupling structure, which may be a grating coupler. The light guiding structure 29 is used for transmitting optical signals.

Further, an opening is provided in at least one of the first substrate 11, the second substrate 27, and the connection structure 39. Light guiding structure 29 may be optically coupled to photonic integrated circuit 21 through the opening. Specifically, in one embodiment, the first substrate 11 and the second substrate 27 are provided with a first opening 31 and a second opening 33, respectively. For example, as shown in fig. 3, the first substrate 11 is provided with a first opening 31 on the outside of the electronic integrated circuit 15. The second substrate 27 is provided with a second opening 33 on the outside of the electronic integrated circuit 15. The first opening 31 and the second opening 33 are each configured to receive the light guiding structure 29, so that the light guiding structure 29 can extend through the first substrate 11 and the second substrate 27. As shown in fig. 3, for example, the light guiding structure 29 extends through the first opening 31 and the second opening 33 toward the lower side of the second substrate 27. The openings on the first substrate 11 and the second substrate 27 can enable the light guide structure 29 to extend into the packaging structure from the bottom, and the light guide structure 29 can extend into the packaging structure from the side or the bottom due to the arrangement of the opening of the light guide structure 29, so that the packaging structure is optimized.

In another embodiment, the first substrate 11 is provided with a third opening 35 at the edge, i.e. an edge opening (edge notch). As shown in fig. 4, for example, the first substrate 11 is provided with a third opening 35 on the outside of the electronic integrated circuit 15. The third opening 35 is opened toward the left side of the first substrate 11. The third opening 35 is configured to receive the light guiding structure 29, so that the light guiding structure 29 can extend laterally through the first substrate 11, thereby preventing the light guiding structure 29 from passing through the second substrate 27. For example, as shown in fig. 4, the light guiding structure 29 is bent at almost 90 degrees so as to be capable of penetrating into the third opening 35. Of course, the light guide structure 29 is not limited to a bent structure, and may be a structure with a beveled end surface, and this is not specified in the present application. On the one hand, the space occupied by the light guide structure 29 along the up-down direction is reduced, so that the height of the packaging structure is reduced, and the volume is reduced; on the other hand, the opening of the second substrate 27 is avoided, so that the structural strength of the second substrate 27 is improved and the process is simplified.

In a second embodiment, the package structure according to the embodiment of the present application further includes: the light source assembly 45, the lens assembly 47, and the turning prism assembly 49 are sequentially arranged in the transmission direction of the light signal. As shown in fig. 5 to 7, for example, the light source assembly 45, the lens assembly 47, and the turning prism assembly 49 are arranged in this order in the left-to-right direction. Further, the light source assembly 45 is used for generating an optical signal. Specifically, the light source assembly 45 may be, for example, a laser. Further, the lens assembly 47 is used to focus the optical signals. In particular, the lens assembly 47 may be a convex lens. Further, the turning prism assembly 49 is used to change the transmission direction of the converged optical signals. Specifically, the turning prism assembly 49 is an inverted trapezoidal prism. Further, photonic integrated circuit 21 is located downstream of turning prism assembly 49 in the direction of transmission of the optical signal; so as to be able to receive the light signal exiting the turning prism assembly 49. For example, as shown in fig. 5, the turning prism assembly 49 is located on the right side of the lens assembly 47, so that the turning prism assembly 49 can turn the outgoing light signal of the lens assembly 47, and thus the photonic integrated circuit 21 can receive the outgoing light signal of the turning prism assembly 49.

In one embodiment, the light source assembly 45 and the lens assembly 47 are juxtaposed on the bearing surface 13. Further, specifically, as shown in fig. 5, for example, the light source assembly 45 and the lens assembly 47 are positively adhered to the bearing surface 13 at a position outside the photonic integrated circuit 21. The forward adhesion is to set the light emitting head of the light source assembly 45 for emitting the light signal upward. And the lens assembly 47 is provided for focusing the lens toward the upper side. Further, a turning prism assembly 49 is adhered to the side of photonic integrated circuit 21 facing bearing surface 13. Specifically, as shown in fig. 5, for example, turning prism assembly 49 is attached upside down to the side of the optical area on photonic integrated circuit 21 facing bearing surface 13. The inverted attachment is such that the prism that is used to steer the steering prism assembly 49 is oriented downward. This allows turning prism assembly 49 to adjust the direction of the outgoing optical signal of lens assembly 47 toward the optical coupling structure so that the optical coupling structure can receive the optical signal. Further, as shown in fig. 5, the centers of the light source assembly 45 and the turning prism assembly 49 are both located on the optical axis of the lens assembly 47.

Further, as shown in fig. 5, the first substrate 11 is provided with a first opening 51 at a position facing the turning prism assembly 49. The first opening 51 is used to mount the steering prism assembly 49 and expose the steering prism assembly 49 to the outside. The installation of the steering prism assembly 49 is thus facilitated and visually inspected through the first aperture 51. Further, the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 are all accommodated in the accommodating space 41. The accommodating space 41 can be fully utilized, the waste of space is avoided, and the volume of the packaging structure in the embodiment of the application is reduced.

In another embodiment, the light source assembly 45 and the lens assembly 47 are disposed side-by-side on the carrier plate 43. Further, specifically, as shown in fig. 6, for example, the light source assembly 45 and the lens assembly 47 are reversed to adhere to the carrier plate 43 at a position outside the photonic integrated circuit 21. Further, turning prism assembly 49 is adhered to photonic integrated circuit 21. Specifically, as shown in fig. 6, for example, turning prism assembly 49 is attached upside down to the side of the optical area on photonic integrated circuit 21 facing bearing surface 13. The inverted attachment is such that the prism that is used to steer the steering prism assembly 49 is oriented downward. This allows turning prism assembly 49 to redirect the outgoing light signal of lens assembly 47 toward the light coupling structure within the optical zone so that the light coupling structure can receive the light signal. Further, as shown in fig. 6, the centers of the light source assembly 45 and the turning prism assembly 49 are located on the optical axis of the lens assembly 47. Further, in this embodiment, the turning prism assembly 49 may also be adhered to the carrier plate 43 at a position outside the photonic integrated circuit 21.

Further, as shown in fig. 6, the first substrate 11 is provided with a second opening 53. The second opening 53 is used to mount the light source assembly 45, the lens assembly 47, and the turning prism assembly 49, and expose all of the light source assembly 45, the lens assembly 47, and the turning prism assembly 49 to the outside. The light source assembly 45, the lens assembly 47 and the turning prism assembly 49 can thus be conveniently and visually installed through the second opening 53.

In another embodiment, light source assembly 45, lens assembly 47, and turning prism assembly 49 are all adhered to photonic integrated circuit 21. Specifically, as shown in fig. 7, for example, the light source assembly 45, the lens assembly 47, and the turning prism assembly 49 are adhered upside down to the side of the photonic integrated circuit 21 facing the carrying surface 13. Further, as shown in fig. 7, for example, turning prism assembly 49 is attached upside down to the side of the optical area on photonic integrated circuit 21 facing bearing surface 13. The inverted attachment is such that the prism that is used to steer the steering prism assembly 49 is oriented downward. This allows turning prism assembly 49 to redirect the outgoing light signal of lens assembly 47 toward the light coupling structure within the optical zone so that the light coupling structure can receive the light signal. Further, as shown in fig. 7, the centers of the light source assembly 45 and the turning prism assembly 49 are both located on the optical axis of the lens assembly 47.

Further, as shown in fig. 7, the first substrate 11 is provided with a third opening 55. The third opening 55 is used for allowing the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 to be inserted, and exposing the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 outwards. The light source assembly 45, the lens assembly 47 and the turning prism assembly 49 can thus be conveniently and visually installed through the third opening 55.

In the present embodiment, the connector 19 is used to electrically connect the photonic integrated circuit 21 and the first substrate 11. Specifically, the connector 19 may be used to electrically connect the photonic integrated circuit 21 with the conductive traces of the first substrate 11. This shortens the transmission distance between the current/signal on the photonic integrated circuit 21 and the first substrate 11, and thus reduces the voltage drop of the photonic integrated circuit 21. Specifically, an end of the connector 19 near the fourth surface 25 is electrically connected to the photonic integrated circuit 21.

Further, the present invention also provides a packaging method, which may include S01: electrically connecting the photonic integrated circuit with the electronic integrated circuit, S03: the photonic integrated circuit is electrically connected to the first substrate. Illustratively, S05 may further include: an electronic integrated circuit is disposed on the first substrate. The order of execution of the above steps is not particularly limited. Illustratively, in step S01, a bond structure may be used to electrically connect the photonic integrated circuit to the electronic integrated circuit. Illustratively, in step S03, the photonic integrated circuit may be electrically connected to the first substrate by a connector in the electronic integrated circuit.

Further, as shown in fig. 8, an embodiment of the present application provides a packaging method, which includes: step S11: providing a first substrate 11, wherein the first substrate 11 is provided with a bearing surface 13; step S13: a through hole 17 is formed on the electronic integrated circuit 15, and a connecting body 19 is arranged in the through hole 17; step S15: mounting an electronic integrated circuit 15 on the carrying surface 13; step S17: directing the first surface 57 of the photonic integrated circuit 21 towards the first substrate 11 and mounting the photonic integrated circuit 21 on a side of the electronic integrated circuit 15 remote from the carrying surface 13; and electrically connecting the photonic integrated circuit 21 to the electronic integrated circuit 15; and the photonic integrated circuit 21 is electrically connected to the first substrate 11 through the connector 19.

In the present embodiment, step S13 opens the through hole 17 in the electronic integrated circuit 15; and a connector 19 is provided in the through hole 17. In particular, when the electronic integrated circuit 15 is fabricated on a wafer or silicon substrate by a semiconductor process, the via 17 may be formed by etching or etching by a semiconductor process. Specifically, the connecting body 19 may be filled in the entire through hole 17. I.e. the connecting body 19 fills the entire through hole 17.

In the present embodiment, step S15: an electronic integrated circuit 15 is mounted on the carrying surface 13. Specifically, the electronic integrated circuit 15 may be adhered to the carrying surface 13 by an adhesive. Further, the electronic integrated circuit 15 may be electrically connected to the conductive traces of the first substrate 11. The adhesive may be, for example, a molding material (molding compound), such as a resin.

In the present embodiment, step S17: the first surface 57 of the photonic integrated circuit 21 is directed towards the first substrate 11, and the photonic integrated circuit 21 is mounted on the side of the electronic integrated circuit 15 remote from the carrying surface 13; and the photonic integrated circuit 21 is electrically connected to the first substrate 11 through the connection body 19. Specifically, photonic integrated circuit 21 may be adhered to fourth surface 25 by an adhesive. And may electrically connect photonic integrated circuit 21 to electronic integrated circuit 15. And one end of the connector 19 is electrically connected with the photonic integrated circuit 21; and the other end of the connecting body 19 is electrically connected with the conductive circuit of the first substrate 11. Further, as shown in fig. 9, the embodiment of the present application further provides a packaging method, including: step S50: providing a first substrate 11; step S52: the first surface 57 of the photonic integrated circuit 21 is directed towards the first substrate 11 such that the photonic integrated circuit 21 is spaced a distance from the first substrate 11.

Further, the package structure according to the embodiment of the application further includes: a second substrate 27 is mounted on the side of the first substrate 11 remote from the carrying surface 13. The second substrate 27 may be adhered to the bottom surface of the first substrate 11 by an adhesive.

Further, the package structure according to the embodiment of the application further includes: the connection structure 39 is mounted on the second surface 59 of the photonic integrated circuit 21 and the connection structure 39 is connected to the first substrate 11 and/or the photonic integrated circuit 21. Specifically, the connection structure 39 is mounted above the photonic integrated circuit 21. And the photonic integrated circuit 21 is adhered to the connection structure 39. The connection structure 39 is fixed to the first substrate 11. The fixing means may be a welded fixing.

Further, the package structure according to the embodiment of the application further includes: a heat sink 37 is mounted on the side of photonic integrated circuit 21 remote from electronic integrated circuit 15; or a heat sink 37 is mounted between photonic integrated circuit 15 and connection structure 39. The heat sink 37 and/or the photonic integrated circuit 21 are thus fixedly connected to the first substrate 11 by means of the connection structure 39.

Further, the package structure according to the embodiment of the application further includes: light guiding structure 29 is optically coupled to photonic integrated circuit 21. Specifically, an opening is provided in at least one of the first substrate 11, the second substrate 27, and the connection structure 9, so that the light guiding structure 29 can be optically coupled with the photonic integrated circuit 21 through the opening. More specifically, the light guiding structure 29 is adhered to the side of the photonic integrated circuit 21 facing the carrying surface 13 through the first opening 31 and the second opening 33; and the light guiding structure 29 extends through the first opening 31 and the second opening 33; wherein the first opening 31 and the second opening 33 are respectively provided on the first substrate 11 and the second substrate 27; the second substrate 27 is disposed on a side of the first substrate 11 opposite to the carrying surface 13. Specifically, the first opening 31 may be opened on the first substrate 11 by a mechanical device such as a punch or a cutter. And the second opening 33 may be opened in the second substrate 27 by a mechanical device such as a punch or a cutter. Passing the light guiding structure 29 through the first opening 31 and the second opening 33 to be capable of adhering to a side of the photonic integrated circuit 21 facing the carrying surface 13; and the light guiding structure 29 extends through the first opening 31 and the second opening 33.

Further, the package structure according to the embodiment of the application further includes: the light guiding structure 29 is mounted on the side of the photonic integrated circuit 21 facing the carrying surface 13. Specifically: adhering the light guiding structure 29 to the side of the photonic integrated circuit 21 facing the carrying surface 13 through the third opening 35; and the light guide structure 29 extends laterally toward the first substrate 11 through the third opening 35; wherein, the first substrate 11 is provided with a third opening 35. Specifically, the third opening 35 may be opened on the first substrate 11 by a mechanical device such as a punch or a cutter. Passing the light guiding structure 29 through the third opening 35 to be capable of adhering to a side of the photonic integrated circuit 21 facing the carrying surface 13; and the light guiding structure 29 is extended laterally toward the first substrate 11 through the third opening 35.

Further, the package structure according to the embodiment of the application further includes: the carrier plate 43 is mounted between the photonic integrated circuit 21 and the connection structure 39. Specifically, a carrier plate 43 is adhered between the photonic integrated circuit 21 and the connection structure 39.

Further, the package structure according to the embodiment of the application further includes: the light source assembly 45, the lens assembly 47, and the turning prism assembly 49 are mounted so that the photonic integrated circuit 21 can receive the light signal emitted from the turning prism assembly 49.

Further, the steps of installing the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 so that the photonic integrated circuit 21 can receive the light signal emitted from the turning prism assembly 49 include:

a light source assembly 45 and a lens assembly 47 are adhered in parallel on the bearing surface 13; and the turning prism assembly 49 is adhered to the side of the photonic integrated circuit 21 facing the carrying surface 13 through the first opening 51, wherein the first opening 51 is disposed on the first substrate 11. Specifically, the light source assembly 45 and the lens assembly 47 are first adhered in parallel on the carrying surface 13. And the first opening 51 is opened in the first substrate 11 by a mechanical device such as a punch or a cutter. The turning prism assembly 49 is then adhered to the side of the photonic integrated circuit 21 facing the bearing surface 13 through the first opening 51.

the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 are adhered in parallel to the side of the carrier plate 43 facing the carrying surface 13 through the second opening 53; wherein the second opening 53 is disposed on the first substrate 11. Specifically, first, the second opening 53 is opened in the first substrate 11 by a mechanical device such as a punch or a cutter. The light source assembly 45, the lens assembly 47 and the turning prism assembly 49 are then adhered side-by-side to the side of the carrier plate 43 facing the carrying surface 13 through the second opening 53.

Or alternatively, the process may be performed,

the light source assembly 45 and the lens assembly 47 are adhered in parallel to the side of the carrier plate 43 facing the carrying surface 13 through the second opening 53; and the turning prism assembly 49 is adhered to the photonic integrated circuit 21. Specifically, first, the second opening 53 is opened in the first substrate 11 by a mechanical device such as a punch or a cutter. The light source assembly 45 and the lens assembly 47 are then adhered in parallel to the side of the carrier plate 43 facing the carrying surface 13 through the second opening 53; and the turning prism assembly 49 is adhered to the photonic integrated circuit 21.

Further, the steps of installing the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 so that the photonic integrated circuit 21 can receive the light signal emitted from the turning prism assembly 49 include: the light source assembly 45, the lens assembly 47 and the turning prism assembly 49 are adhered in parallel to the side of the photonic integrated circuit 21 facing the carrying surface 13 through the third opening 55; the third opening 55 is disposed on the first substrate 11. Specifically, first, the third opening 55 is opened in the first substrate 11 by a mechanical device such as a punch or a cutter. The light source assembly 45, the lens assembly 47 and the turning prism assembly 49 are then adhered side-by-side to the side of the photonic integrated circuit 21 facing the bearing surface 13 through the third aperture 55.

It should be noted that, in the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the applicant be deemed to have such subject matter not considered to be part of the disclosed subject matter.

Claims

1. A package structure, comprising:

a first substrate having a bearing surface;

an electronic integrated circuit disposed on the bearing surface;

a photonic integrated circuit having a first surface and a second surface, the first surface of the photonic integrated circuit facing the first substrate, the photonic integrated circuit being disposed on a side of the electronic integrated circuit remote from the first substrate;

wherein, the electronic integrated circuit is provided with a through hole; a connector is arranged in the through hole; and the connector is used for electrically connecting the photonic integrated circuit with the first substrate.

2. The package structure of claim 1, further comprising: and the connecting structure is connected with the first substrate and/or the photonic integrated circuit, and is connected with the second surface of the photonic integrated circuit.

3. The package structure of claim 2, further comprising: and the light guide structure is optically coupled with the photonic integrated circuit.

4. The package structure of claim 3, further comprising: the light guide structure is arranged on one side of the photonic integrated circuit, which faces the bearing surface.

5. The package structure of claim 4, further comprising: and the first substrate is arranged on the second substrate.

6. The package structure of claim 5, wherein at least one of the first substrate, the second substrate, and the connection structure is provided with an opening through which the light guiding structure is optically coupled to the photonic integrated circuit.

7. The package structure of claim 2, further comprising: and the heat sink is arranged on one side of the photonic integrated circuit far away from the first substrate, or is positioned between the photonic integrated circuit and the connecting structure.

8. The package structure of claim 4, wherein the first substrate has a bearing surface; the packaging structure comprises an electronic integrated circuit, wherein the electronic integrated circuit is arranged on the bearing surface of the first substrate; the photonic integrated circuit is arranged on one side of the electronic integrated circuit far away from the first substrate.

9. The package structure of claim 8, wherein a receiving space is formed between the connection structure and the first substrate, and the photonic integrated circuit and the electronic integrated circuit are both received in the receiving space.

10. The package structure of claim 8, wherein a carrier is disposed between the photonic integrated circuit and the connection structure.

11. The package structure of claim 1, further comprising: the light source assembly, the lens assembly and the steering prism assembly are sequentially arranged in the transmission direction of the light signals; the light source assembly is used for generating an optical signal; the lens component is used for converging the optical signals; the steering prism component is used for changing the transmission direction of the converged optical signals; the photonic integrated circuit is located downstream of the turning prism assembly in a transmission direction of the optical signal; so as to be capable of receiving the light signal emitted by the steering prism assembly.

12. The package structure of claim 11, wherein the light source assembly and the lens assembly are disposed in parallel on the bearing surface, and the turning prism assembly is disposed on a side of the photonic integrated circuit facing the bearing surface.

13. The package of claim 12, wherein the first substrate is provided with a first opening at a position opposite the turning prism assembly, the first opening for mounting the turning prism assembly and exposing the turning prism assembly outward.

14. The package structure of claim 11, further comprising: the carrier plate is arranged on one side of the photonic integrated circuit, which is far away from the electronic integrated circuit; the light source component and the lens component are arranged on the carrier plate in parallel; the turning prism assembly is disposed on the photonic integrated circuit.

15. The package structure of claim 14, wherein the first substrate is provided with a second opening for mounting the light source assembly, the lens assembly, and the turning prism assembly, and exposing the light source assembly, the lens assembly, and the turning prism assembly to the outside.

16. The package structure of claim 11, wherein the light source assembly, the lens assembly, and the turning prism assembly are all adhered to the photonic integrated circuit.

17. The package structure of claim 16, wherein a third opening is provided in the first substrate, the third opening being configured to allow the light source assembly, the lens assembly, and the turning prism assembly to extend into and expose the light source assembly, the lens assembly, and the turning prism assembly.

18. A method of packaging, comprising:

providing a first substrate, wherein the first substrate is provided with a bearing surface;

a through hole is formed in the electronic integrated circuit, and a connector is arranged in the through hole;

mounting an electronic integrated circuit on the bearing surface;

and the first surface of the photonic integrated circuit faces the first substrate, the photonic integrated circuit is arranged on one side of the electronic integrated circuit far away from the bearing surface, and the photonic integrated circuit is electrically connected with the first substrate through the connector.

19. The packaging method of claim 18, further comprising: and mounting a connection structure on the second surface of the photonic integrated circuit, and connecting the connection structure with the first substrate and/or the photonic integrated circuit.

20. The packaging method of claim 19, further comprising: optically coupling a light guiding structure with the photonic integrated circuit.

21. The packaging method of claim 20, further comprising: and installing the light guide structure on one side of the photonic integrated circuit facing the bearing surface.

22. The packaging method of claim 21, further comprising: the first substrate is mounted on a second substrate.

23. The packaging method of claim 22, further comprising: and opening at least one of the first substrate, the second substrate and the connecting structure so that the light guide structure can pass through the opening to be optically coupled with the photonic integrated circuit.

24. The packaging method of claim 23, further comprising:

and installing a heat sink on one side of the photonic integrated circuit far away from the first substrate, or installing a heat sink between the photonic integrated circuit and the connection structure.

25. The method of packaging of claim 21, wherein the step of orienting the first surface of the photonic integrated circuit toward the first substrate such that the photonic integrated circuit is spaced a distance from the first substrate comprises:

mounting an electronic integrated circuit on a bearing surface of the first substrate;

the photonic integrated circuit is disposed on a side of the electronic integrated circuit remote from the first substrate.

26. The packaging method of claim 25, further comprising: accommodating both the photonic integrated circuit and the electronic integrated circuit in an accommodating space; wherein, the connecting structure and the first substrate form the accommodating space therebetween.

27. The packaging method of claim 25, further comprising: and mounting a carrier plate between the photonic integrated circuit and the connection structure.

28. The packaging method of claim 18, further comprising: the light source component, the lens component and the steering prism component are arranged, so that the photonic integrated circuit can receive the light signals emitted by the steering prism component.

29. The packaging method of claim 28, wherein the steps of mounting the light source assembly, the lens assembly and the turning prism assembly such that the photonic integrated circuit receives the light signal emitted from the turning prism assembly include:

attaching a light source assembly and a lens assembly in parallel on the bearing surface; and adhering the steering prism assembly to a side of the photonic integrated circuit facing the bearing surface through a first opening, wherein the first opening is arranged on the first substrate.

30. The packaging method of claim 28, wherein the steps of mounting the light source assembly, the lens assembly and the turning prism assembly such that the photonic integrated circuit receives the light signal emitted from the turning prism assembly include:

The light source assembly, the lens assembly and the steering prism assembly are adhered to the side of the carrier plate, which faces the carrying surface, in parallel through a second opening; wherein the carrier plate is positioned at one side of the photonic integrated circuit far away from the electronic integrated circuit; the second opening is arranged on the first substrate;

or alternatively, the process may be performed,

31. The packaging method of claim 28, wherein the steps of mounting the light source assembly, the lens assembly and the turning prism assembly such that the photonic integrated circuit receives the light signal emitted from the turning prism assembly include:

adhering the light source assembly, the lens assembly and the turning prism assembly in parallel to a side of the photonic integrated circuit facing the bearing surface through a third opening; wherein the third opening is disposed on the first substrate.