CN106980159A - Photoelectric module packaging structure based on photoelectric hybrid integration - Google Patents
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
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- G02B6/4251—Sealed packages
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- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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Abstract
本发明提供一种基于光电混合集成的光电模块封装结构,包括基板;键合在基板上的平面光子回路载板;连接到平面光子回路载板的光纤连接器;位于平面光子回路载板内并与基板表面平行的第一光波导;位于基板内的垂直互连结构及其焊盘;集成在基板上的透镜、光子器件和电子器件;以及位于光子器件上方的散热装置;其中光子器件与第一光波导耦合。本发明适于板载光模块以及光收发组件,能够减小互连损耗、进行高带宽光互连信号传播,并且能够实现波分复用功能,拓展光电混合集成模块的通道数以及波长。
The invention provides a photoelectric module packaging structure based on photoelectric hybrid integration, including a substrate; a planar photonic circuit carrier bonded on the substrate; an optical fiber connector connected to the planar photonic circuit carrier; located in the planar photonic circuit carrier and A first optical waveguide parallel to the surface of the substrate; a vertical interconnection structure and pads thereof located in the substrate; a lens, a photonic device and an electronic device integrated on the substrate; and a heat dissipation device located above the photonic device; wherein the photonic device and the first an optical waveguide coupling. The invention is suitable for board-mounted optical modules and optical transceiver components, can reduce interconnection loss, carry out high-bandwidth optical interconnection signal propagation, and can realize wavelength division multiplexing function, and expand the channel number and wavelength of the photoelectric hybrid integrated module.
Description
技术领域technical field
本发明涉及光电子学技术领域,尤其涉及一种基于光电混合集成的光电模块封装结构。The invention relates to the technical field of optoelectronics, in particular to an optoelectronic module packaging structure based on optoelectronic hybrid integration.
背景技术Background technique
随着科技进步,传统的电学互连在物理性能上的局限性逐渐凸显,下一代互连的传输速率及电学带宽要求逐渐提高,电学互连受到极大限制。在高密度、低功耗的方向上,光学互连应用前景广阔。由于IC特征尺寸越来越小,导致互连引线横截面和线间距的减小,电阻、电容、电感引起的寄生效应越来越影响电路的性能,互连RC延迟成为限制整体信号传播速率的重要原因。克服电学互连带来的损耗以及反射,缩小光子器件和电子器件封装的互连线长度已经成为光电封装的重要问题。With the advancement of science and technology, the limitations of traditional electrical interconnection in terms of physical performance are gradually highlighted, and the transmission rate and electrical bandwidth requirements of next-generation interconnection are gradually increasing, and electrical interconnection is greatly limited. In the direction of high density and low power consumption, the application prospect of optical interconnection is broad. As the IC feature size is getting smaller and smaller, the cross-section and line spacing of the interconnection leads are reduced, and the parasitic effects caused by resistance, capacitance, and inductance are increasingly affecting the performance of the circuit, and the interconnection RC delay becomes the factor that limits the overall signal propagation rate. important reason. Overcoming the loss and reflection caused by electrical interconnection and reducing the length of interconnection wires in photonic devices and electronic device packaging has become an important issue in optoelectronic packaging.
在现有技术中,硅基技术基本趋于成熟,基于CMOS集成调制器、激光器、光波导以及光电探测器的芯片间通信技术正被商业化。在单晶硅上用VLSI技术集成调制器、光波导、探测器、光开关等光模块已经可行。通常在板的边缘集成光模块,这种光模块由于物理位置原因,距离芯片的距离较长,损耗较大,互连密度较低。并且,在片外光模块中,通常使用硅光器件以及EAM等器件,虽然其端面耦合对偏振不敏感,能够支持高带宽的光发射器件,但是耦合冗余度大。另外,在现有技术中,通常封装材料使用树脂或陶瓷等,其损耗较高,难以形成对光电模块通道和波长的增益。In the existing technology, the silicon-based technology is basically mature, and the inter-chip communication technology based on CMOS integrated modulators, lasers, optical waveguides and photodetectors is being commercialized. It is already feasible to use VLSI technology to integrate optical modules such as modulators, optical waveguides, detectors, and optical switches on single crystal silicon. The optical module is usually integrated on the edge of the board. Due to the physical location of this optical module, the distance from the chip is longer, the loss is larger, and the interconnection density is lower. In addition, silicon optical devices and EAM devices are usually used in off-chip optical modules. Although the end face coupling is not sensitive to polarization and can support high-bandwidth optical emitting devices, the coupling redundancy is large. In addition, in the prior art, resins or ceramics are usually used as packaging materials, which have high loss, and it is difficult to form a gain for the channel and wavelength of the optoelectronic module.
板载光模块通常采用基于镜片或者有源方式耦合各类电子及光子器件,并使用可插拔光接口与PCB连接,能够减少PCB基板面占用空间、减少信号损失、保证通道高传输能力、快速灵活组装和拆卸、方便使用和更换。近年来,为满足对VLSI集成电路用的低功率、轻型及小型封装的生产技术要求,产生了3D封装技术,在光电混合集成电路小型化方面取得了极大的改进,同时,由于3D封装技术总互连长度更短,系统功耗可降低约30%。板载光模块以及3D封装目前已经成为光电集成电路未来的发展方向。On-board optical modules usually use lenses or active methods to couple various electronic and photonic devices, and use pluggable optical interfaces to connect to the PCB, which can reduce the space occupied by the PCB substrate, reduce signal loss, ensure high transmission capacity of the channel, and fast Flexible assembly and disassembly, convenient use and replacement. In recent years, in order to meet the production technical requirements of low power, light and small packaging for VLSI integrated circuits, 3D packaging technology has been produced, which has made great improvements in the miniaturization of optoelectronic hybrid integrated circuits. At the same time, due to the 3D packaging technology The total interconnect length is shorter and the system power consumption can be reduced by about 30%. On-board optical modules and 3D packaging have become the future development direction of optoelectronic integrated circuits.
发明内容Contents of the invention
本发明提供的基于光电混合集成的光电模块封装结构,能够进行高带宽、低损耗的光互连信号传播。The optoelectronic module packaging structure based on optoelectronic hybrid integration provided by the invention can perform optical interconnection signal propagation with high bandwidth and low loss.
第一方面,本发明提供一种基于光电混合集成的光电模块封装结构,包括基板;键合在所述基板上的平面光子回路载板;连接到所述平面光子回路载板的光纤连接器;位于所述平面光子回路载板内并与所述基板表面平行的第一光波导;位于所述基板内的垂直互连结构及其焊盘;集成在所述基板上的透镜、光子器件和电子器件;以及位于所述光子器件上方的散热装置;其中所述光子器件与所述第一光波导耦合。In the first aspect, the present invention provides a photoelectric module packaging structure based on photoelectric hybrid integration, including a substrate; a planar photonic circuit carrier bonded on the substrate; an optical fiber connector connected to the planar photonic circuit carrier; A first optical waveguide located in the planar photonic circuit carrier and parallel to the surface of the substrate; a vertical interconnect structure and its pads located in the substrate; lenses, photonic devices and electronic components integrated on the substrate a device; and a heat sink positioned above the photonic device; wherein the photonic device is coupled to the first optical waveguide.
可选地,上述透镜位于所述光子器件和所述第一光波导之间,所述光子器件通过透镜与所述第一光波导耦合。Optionally, the lens is located between the photonic device and the first optical waveguide, and the photonic device is coupled to the first optical waveguide through a lens.
可选地,上述光电模块封装结构还包括所述散热装置和所述平面光子回路载板之间、所述散热装置和所述基板之间的密封装置,用于对所述光子器件和所述透镜进行密封。Optionally, the photoelectric module packaging structure above further includes sealing devices between the heat sink and the planar photonic circuit carrier, and between the heat sink and the substrate, for sealing the photonic device and the The lens is sealed.
可选地,上述光子器件还包括位于所述光子器件内部并与所述基板表面平行的第二光波导,所述光子器件通过消逝波与所述第一光波导耦合。Optionally, the above photonic device further includes a second optical waveguide located inside the photonic device and parallel to the surface of the substrate, and the photonic device is coupled to the first optical waveguide through an evanescent wave.
可选地,上述光电模块封装结构仅对所述光子器件进行封装,并灵活集成所述电子器件。Optionally, the above photoelectric module packaging structure only packages the photonic device and flexibly integrates the electronic device.
可选地,上述光电模块封装结构对所述光子器件和所述电子器件进行三维封装。Optionally, the optoelectronic module packaging structure performs three-dimensional packaging on the photonic device and the electronic device.
可选地,上述光子器件和所述电子器件通过玻璃通孔技术或者硅通孔技术在所述基板的垂直方向上堆叠。Optionally, the above-mentioned photonic device and the electronic device are stacked in the vertical direction of the substrate by using a through-glass via technology or a through-silicon via technology.
可选地,上述光电模块封装结构以晶体管外壳罐式封装形式集成在挠性印刷电路板上。Optionally, the above photoelectric module packaging structure is integrated on a flexible printed circuit board in the form of a transistor housing can package.
可选地,上述光电模块封装结构结合所述基板以及母板封装,形成板上光收发模块。Optionally, the above photoelectric module packaging structure is combined with the substrate and motherboard packaging to form an on-board optical transceiver module.
可选地,上述平面光子回路载板通过胶水键合在所述基板上。Optionally, the above-mentioned planar photonic circuit carrier board is bonded on the substrate by glue.
可选地,上述基板材料为玻璃。Optionally, the above substrate material is glass.
可选地,上述光纤连接器为FC型光纤连接器、SC型光纤连接器、ST型光纤连接器、LC型光纤连接器或者MT-RJ型连接器。Optionally, the above optical fiber connector is an FC type optical fiber connector, an SC type optical fiber connector, an ST type optical fiber connector, an LC type optical fiber connector or an MT-RJ type connector.
可选地,上述散热装置为金属或硅制导热板或散热片,或热电制冷装置。Optionally, the above heat dissipation device is a metal or silicon heat conducting plate or heat sink, or a thermoelectric cooling device.
可选地,上述光子器件为电吸收调制器、MZM调制器、直接调制激光器或者光发射接收器件。Optionally, the aforementioned photonic device is an electroabsorption modulator, an MZM modulator, a directly modulated laser, or a light emitting and receiving device.
可选地,上述电子器件为所述光子器件的驱动或放大电路。Optionally, the above-mentioned electronic device is a driving or amplifying circuit of the photonic device.
可选地,上述光子器件和所述电子器件通过倒装焊芯片工艺键合到所述基板上,并通过所述平面光子回路载板表面的互连线互连。Optionally, the above-mentioned photonic device and the electronic device are bonded to the substrate by a flip-chip process, and are interconnected through interconnection lines on the surface of the planar photonic circuit carrier.
本发明实施例提供的基于光电混合集成的光电模块封装结构,适合于板载光模块以及光收发组件,该封装结构支持光学密封封装,采用低损耗材料作为封装材料,支持高频信号传输。同时该封装结构将电子芯片和光子芯片靠近组装,减小了互连损耗。该封装结构集成平面光波导材料,比如玻璃,能够实现波分复用(WDM)功能,拓展光电混合集成模块的通道数以及波长。The photoelectric module packaging structure based on photoelectric hybrid integration provided by the embodiment of the present invention is suitable for on-board optical modules and optical transceiver components. The packaging structure supports optical sealing packaging, uses low-loss materials as packaging materials, and supports high-frequency signal transmission. At the same time, the packaging structure assembles the electronic chip and the photonic chip close to each other, which reduces the interconnection loss. The packaging structure integrates planar optical waveguide materials, such as glass, which can realize wavelength division multiplexing (WDM) function, and expand the channel number and wavelength of the photoelectric hybrid integrated module.
附图说明Description of drawings
图1示出了光电混合集成结构的示意图;Figure 1 shows a schematic diagram of an optoelectronic hybrid integrated structure;
图2示出了仅对光子芯片进行封装的光电混合集成结构的示意图;Figure 2 shows a schematic diagram of an optoelectronic hybrid integrated structure in which only photonic chips are packaged;
图3示出了对光子器件和电子器件进行三维封装的光电混合集成结构示意图;Figure 3 shows a schematic diagram of a photoelectric hybrid integrated structure for three-dimensional packaging of photonic devices and electronic devices;
图4示出了应用于晶体管外形罐式封装的光电混合集成结构的示意图;FIG. 4 shows a schematic diagram of an optoelectronic hybrid integrated structure applied to a transistor outer can package;
图5示出了形成板上光收发模块的光电混合集成结构的示意图;5 shows a schematic diagram of an optoelectronic hybrid integrated structure forming an on-board optical transceiver module;
图6示出了具有光子器件波导的光电混合集成结构的示意图;Figure 6 shows a schematic diagram of an optoelectronic hybrid integrated structure with a photonic device waveguide;
图7示出了对光子器件和电子器件进行三维封装的具有光子器件波导的光电混合集成结构的示意图;Fig. 7 shows a schematic diagram of an optoelectronic hybrid integrated structure with photonic device waveguides for three-dimensional packaging of photonic devices and electronic devices;
图8示出了应用于晶体管外形罐式封装的具有光子器件波导的光电混合集成结构的示意图;Fig. 8 shows a schematic diagram of an optoelectronic hybrid integrated structure with a photonic device waveguide applied to a transistor outline can package;
图9示出了形成板上光收发模块的具有光子器件波导的光电混合集成结构的示意图。FIG. 9 shows a schematic diagram of an optoelectronic hybrid integrated structure with photonic device waveguides forming an on-board optical transceiver module.
具体实施方式detailed description
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
图1示出了光电混合集成结构的示意图。其中,1为光纤耦合接头,或者光纤连接器,即接入光模块的光纤接头,可选使用FC型光纤连接器、SC型光纤连接器、ST型光纤连接器、LC型光纤连接器或者MT-RJ型连接器。2为密封材料,用于保护模块中较为敏感的光子器件,可以根据光子器件的使用情况选择使用。该密封材料具有较好的对上部和下部材料良好的粘合性、优良的柔性和优良的耐久性,可以使用紫外线固化或者热固化乙酸乙烯酯含量较高的乙烯-乙酸乙烯酯共聚物,或者由热固性环氧树脂、玻璃浆料等材料而形成。302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,诸如基于硅、砷化镓、玻璃等基片制成的平面介质光波导、薄膜或带状波导、波导阵列、阵列波导光栅(AWG)或稀疏波分复用器(CWDM)等波导器件。4为散热装置,例如通过增加铜箔层或是散热通孔来增强效果的金属或硅制导热板或散热片,或热电制冷(TEC)装置等。5为透镜,特别是利用半导体器件本身形成的集成透镜,用于镜片准直、聚焦和模场匹配,从而在光电模块和光纤之间获得最大耦合。6为光子器件,例如电吸收调制器(EAM)、MZM调制器、直接调制激光器(DML)或者光发射接收器件。在光电混合集成结构中,光子器件6的波导端面经过透镜5和PLC光波导器件耦合,尺寸和光纤模场匹配的PLC光波导器件可以集成光波分复用/解复用的功能,也可以是平行的波导阵列,与外界通过耦合接头与光纤进行耦合。7为电子器件,如光子器件的驱动或者接收的放大电路。光子器件6和电子器件7可以通过倒装焊芯片工艺键合到玻璃基板上,而且可以通过玻璃基板上表面的互连线互连。8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过键合的层801键合,801可以为胶水,9为垂直互连结构以及相连接的焊盘。Figure 1 shows a schematic diagram of an optoelectronic hybrid integrated structure. Among them, 1 is an optical fiber coupling connector, or an optical fiber connector, that is, an optical fiber connector connected to an optical module, and FC type optical fiber connector, SC type optical fiber connector, ST type optical fiber connector, LC type optical fiber connector or MT type are optional. - RJ type connector. 2 is a sealing material, which is used to protect the more sensitive photonic devices in the module, and can be selected according to the usage of the photonic devices. The sealing material has good adhesion to the upper and lower materials, excellent flexibility and excellent durability, and can use ultraviolet curing or heat curing ethylene-vinyl acetate copolymer with high vinyl acetate content, or Formed from materials such as thermosetting epoxy resin and glass paste. 302 is a planar photonic circuit (PLC) carrier, and 301 is an optical waveguide in a planar photonic circuit carrier, such as a planar dielectric optical waveguide, a thin film or a strip waveguide, and a waveguide based on substrates such as silicon, gallium arsenide, and glass. Waveguide devices such as arrays, arrayed waveguide gratings (AWGs), or sparse wavelength division multiplexers (CWDMs). 4 is a heat dissipation device, such as a metal or silicon heat conduction plate or heat sink, or a thermoelectric cooling (TEC) device, etc., which enhance the effect by adding a copper foil layer or a heat dissipation through hole. 5 is the lens, especially the integrated lens formed by the semiconductor device itself, which is used for lens collimation, focusing and mode field matching, so as to obtain the maximum coupling between the photoelectric module and the optical fiber. 6 is a photonic device, such as an electroabsorption modulator (EAM), a MZM modulator, a directly modulated laser (DML) or a light emitting and receiving device. In the photoelectric hybrid integrated structure, the waveguide end face of the photonic device 6 is coupled with the PLC optical waveguide device through the lens 5, and the PLC optical waveguide device whose size matches the optical fiber mode field can integrate the function of optical wavelength division multiplexing/demultiplexing, or can be The parallel waveguide array is coupled with the outside world through the coupling joint and the optical fiber. 7 is an electronic device, such as a driving or receiving amplifying circuit of a photonic device. The photonic device 6 and the electronic device 7 can be bonded to the glass substrate by a flip-chip process, and can be interconnected through interconnection lines on the upper surface of the glass substrate. 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through a bonding layer 801, 801 may be glue, and 9 is a vertical interconnection structure and connected pads.
进一步地,如图2所示,光电混合集成结构可以仅对光子芯片进行封装,用于和电子器件灵活集成。2为密封材料,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过胶水层801键合,9为垂直互连结构以及相连接的焊盘。Further, as shown in FIG. 2 , the optoelectronic hybrid integrated structure can only package the photonic chip for flexible integration with electronic devices. 2 is a sealing material, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in the planar photonic circuit carrier, 4 is a heat dissipation device, 5 is a lens, 6 is a photonic device, 8 is a glass substrate, and a planar photonic circuit (PLC) carrier board 302 and glass substrate 8 are bonded through glue layer 801 , and 9 is a vertical interconnection structure and connected pads.
进一步地,如图3所示,光电混合集成结构可以对光子器件和电子器件进行3D封装,3D封装能够使得该光电混合集成电路小型化。302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过胶水层801键合,9为垂直互连的结构以及相连接的焊盘。优选的,电子器件7和光子器件6封装于玻璃基板的z轴方向,且在z轴方向电子器件封装于光子器件上方。另外,可以根据集成结构的功能需求决定是否需要进行光子器件6和电子器件7进行密封操作。优选的,可以通过玻璃通孔技术(TGV)或者硅通孔技术(TSV)实现光子器件和电子器件在垂直方向上的堆叠。Further, as shown in FIG. 3 , the optoelectronic hybrid integrated circuit can perform 3D packaging on photonic devices and electronic devices, and 3D packaging can make the optoelectronic hybrid integrated circuit miniaturized. 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in the planar photonic circuit carrier, 4 is a cooling device, 5 is a lens, 6 is a photonic device, 7 is an electronic device, and 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and glass substrate 8 are bonded through glue layer 801 , and 9 is a vertical interconnection structure and connected pads. Preferably, the electronic device 7 and the photonic device 6 are packaged in the z-axis direction of the glass substrate, and the electronic device is packaged above the photonic device in the z-axis direction. In addition, it may be determined whether the photonic device 6 and the electronic device 7 need to be sealed according to the functional requirements of the integrated structure. Preferably, the stacking of photonic devices and electronic devices in the vertical direction can be realized through glass via technology (TGV) or through silicon via technology (TSV).
进一步地,如图4所示,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过胶水层801键合,9为垂直互连的结构以及相连接的焊盘。该光电混合集成结构可以应用在TO-CAN封装中,需要和挠性印刷电路板(FPCB)10集成。FPCB可以是S/sFPCB、D/sFPCB、MLFPCB、RIGID-FPC等。Further, as shown in Figure 4, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in the planar photonic circuit carrier, 4 is a heat sink, 5 is a lens, 6 is a photonic device, and 7 is an electronic device , 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through the glue layer 801, and 9 is a vertical interconnection structure and connected pads. The optoelectronic hybrid integrated structure can be applied in TO-CAN packaging, and needs to be integrated with a flexible printed circuit board (FPCB) 10 . The FPCB can be S/sFPCB, D/sFPCB, MLFPCB, RIGID-FPC, etc.
进一步地,如图5所示,2为密封材料,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过胶水层801键合,9为垂直互连的结构以及相连接的焊盘。该光电混合集成模块中的电子器件7和光子器件6可集成接收与发送功能,该光电混合集成模块可以结合基板的栅格阵列(LGA)封装以及母板11的socket封装,形成板上光收发模块。Further, as shown in Figure 5, 2 is a sealing material, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in a planar photonic circuit carrier, 4 is a heat sink, 5 is a lens, and 6 is a photonic device , 7 is an electronic device, 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through the glue layer 801, and 9 is a vertical interconnection structure and connected pads. The electronic device 7 and the photonic device 6 in the optoelectronic hybrid integrated module can integrate receiving and transmitting functions, and the optoelectronic hybrid integrated module can combine the grid array (LGA) package of the substrate and the socket package of the motherboard 11 to form an on-board optical transceiver module.
图6所示,1为光纤耦合接头,或者光纤连接器,即接入光模块的光纤接头,可选使用FC型光纤连接器、SC型光纤连接器、ST型光纤连接器、LC型光纤连接器或者MT-RJ型连接器。20为光子器件波导;302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,诸如基于硅、砷化镓、玻璃等基片制成的平面介质光波导、薄膜或带状波导、波导阵列、阵列波导光栅(AWG)或稀疏波分复用器(CWDM)等波导器件。4为散热装置,例如通过增加铜箔层或是散热通孔来增强效果的金属或硅制导热板或散热片,或热电制冷(TEC)装置等。5为透镜,特别是利用半导体器件本身形成的集成透镜,用于模场匹配,从而在光电模块和光纤之间获得最大耦合。6为光子器件,例如电吸收调制器(EAM)、MZM调制器、直接调制激光器(DML)或者光发射接收器件。在光电混合集成结构中,光子器件6的波导端面经过消逝波耦合到平面光子回路(PLC)载板302内的光波导301。PLC光波导301可以集成光波分复用/解复用的功能,也可以是平行的波导阵列,与外界通过耦合接头与光纤进行耦合。根据光子器件6的特性,或者后续使用需求,可以选择对光子器件6进行密封或者非密封,密封材料应具有较好的对上部和下部材料良好的粘合性、优良的柔性和优良的耐久性,可以使用紫外线固化或者热固化乙酸乙烯酯含量较高的乙烯-乙酸乙烯酯共聚物,或者由热固性环氧树脂、玻璃浆料等材料而形成。7为电子器件,如光子器件的驱动或者接收的放大电路。光子器件6和电子器件7可以通过倒装焊芯片工艺键合到玻璃基板上,而且可以通过玻璃基板上表面的互连线互连。8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过键合的层801键合,801可以为胶水,9为垂直互连的结构以及相连接的焊盘。As shown in Figure 6, 1 is an optical fiber coupling connector, or an optical fiber connector, that is, an optical fiber connector connected to an optical module. FC type optical fiber connector, SC type optical fiber connector, ST type optical fiber connector, and LC type optical fiber connection are optional. Connector or MT-RJ type connector. 20 is a photonic device waveguide; 302 is a planar photonic circuit (PLC) carrier, and 301 is an optical waveguide in a planar photonic circuit carrier, such as a planar dielectric optical waveguide and film made based on substrates such as silicon, gallium arsenide, and glass. Or waveguide devices such as strip waveguides, waveguide arrays, arrayed waveguide gratings (AWG) or sparse wavelength division multiplexers (CWDM). 4 is a heat dissipation device, such as a metal or silicon heat conduction plate or heat sink, or a thermoelectric cooling (TEC) device, etc., which enhance the effect by adding a copper foil layer or a heat dissipation through hole. 5 is a lens, especially an integrated lens formed by the semiconductor device itself, which is used for mode field matching, so as to obtain the maximum coupling between the photoelectric module and the optical fiber. 6 is a photonic device, such as an electroabsorption modulator (EAM), a MZM modulator, a directly modulated laser (DML) or a light emitting and receiving device. In the optoelectronic hybrid integrated structure, the waveguide end face of the photonic device 6 is coupled to the optical waveguide 301 in the planar photonic circuit (PLC) carrier 302 through the evanescent wave. The PLC optical waveguide 301 can integrate the function of optical wavelength division multiplexing/demultiplexing, or can be a parallel waveguide array, which is coupled with the outside world through a coupling joint and an optical fiber. According to the characteristics of the photonic device 6 or the subsequent use requirements, the photonic device 6 can be sealed or unsealed, and the sealing material should have good adhesion to the upper and lower materials, excellent flexibility and excellent durability , UV curing or heat curing ethylene-vinyl acetate copolymer with higher vinyl acetate content can be used, or it can be formed from thermosetting epoxy resin, glass paste and other materials. 7 is an electronic device, such as a driving or receiving amplifying circuit of a photonic device. The photonic device 6 and the electronic device 7 can be bonded to the glass substrate by a flip-chip process, and can be interconnected through interconnection lines on the upper surface of the glass substrate. 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through a bonding layer 801, 801 may be glue, and 9 is a vertical interconnection structure and connected pads.
进一步地,如图7所示,可以对光子器件和电子器件进行3D封装,3D封装能够使得该光电混合集成电路小型化。20为光子器件波导,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过键合的层801键合,801可以为胶水,9为垂直互连的结构以及相连接的焊盘。优选的,电子器件7和光子器件6封装于玻璃基板的z轴方向,且在z轴方向电子器件7封装于光子器件6下方。另外,可以根据集成结构的功能需求决定是否需要进行光子器件6和电子器件7进行密封操作。优选的,可以通过玻璃通孔技术(TGV)或者硅通孔技术(TSV)实现光子器件和电子器件在垂直方向上的堆叠。Further, as shown in FIG. 7 , photonic devices and electronic devices can be packaged in 3D, and 3D packaging can make the optoelectronic hybrid integrated circuit miniaturized. 20 is a photonic device waveguide, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in a planar photonic circuit carrier, 4 is a cooling device, 5 is a lens, 6 is a photonic device, 7 is an electronic device, and 8 is a The glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through a bonding layer 801, 801 may be glue, and 9 is a vertical interconnection structure and connected pads. Preferably, the electronic device 7 and the photonic device 6 are packaged in the z-axis direction of the glass substrate, and the electronic device 7 is packaged under the photonic device 6 in the z-axis direction. In addition, it may be determined whether the photonic device 6 and the electronic device 7 need to be sealed according to the functional requirements of the integrated structure. Preferably, the stacking of photonic devices and electronic devices in the vertical direction can be realized through glass via technology (TGV) or through silicon via technology (TSV).
进一步地,如图8所示,20为光子器件波导,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过键合的层801键合,801可以为胶水,9为垂直互连的结构以及相连接的焊盘。该光电混合集成结构可以应用在TO-CAN封装中,需要和挠性印刷电路板(FPCB)10集成。FPCB可以是S/sFPCB、D/sFPCB、MLFPCB、RIGID-FPC等。Further, as shown in Figure 8, 20 is a photonic device waveguide, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in a planar photonic circuit carrier, 4 is a heat sink, 5 is a lens, and 6 is a photon Device, 7 is an electronic device, 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through a bonding layer 801, 801 can be glue, and 9 is a vertically interconnected structure and connected pad. The optoelectronic hybrid integrated structure can be applied in TO-CAN packaging, and needs to be integrated with a flexible printed circuit board (FPCB) 10 . The FPCB can be S/sFPCB, D/sFPCB, MLFPCB, RIGID-FPC, etc.
进一步地,如图9所示,20为光子器件波导,302为平面光子回路(PLC)载板,301为平面光子回路载板内的光波导,4为散热装置,5为透镜,6为光子器件,7为电子器件,8为玻璃基板,平面光子回路(PLC)载板302和玻璃基板8通过键合的层801键合,801可以为胶水,9为垂直互连的结构以及相连接的焊盘。该光电混合集成模块中的电子器件7和光子器件6可集成接收与发送功能,该光电混合集成模块可以结合基板的栅格阵列(LGA)封装以及母板11的socket封装,形成板上光收发模块。Further, as shown in Figure 9, 20 is a photonic device waveguide, 302 is a planar photonic circuit (PLC) carrier, 301 is an optical waveguide in a planar photonic circuit carrier, 4 is a heat sink, 5 is a lens, and 6 is a photon Device, 7 is an electronic device, 8 is a glass substrate, the planar photonic circuit (PLC) carrier 302 and the glass substrate 8 are bonded through a bonding layer 801, 801 can be glue, and 9 is a vertically interconnected structure and connected pad. The electronic device 7 and the photonic device 6 in the optoelectronic hybrid integrated module can integrate receiving and transmitting functions, and the optoelectronic hybrid integrated module can combine the grid array (LGA) package of the substrate and the socket package of the motherboard 11 to form an on-board optical transceiver module.
本发明的实施例所提供的基于光电混合集成的光电模块封装结构,适合于板载光模块以及光收发组件,该封装结构支持光学密封封装,采用低损耗材料作为封装材料,支持高频信号传输。同时该封装结构将电子芯片和光子芯片靠近组装,减小了互连损耗。该封装结构集成平面光波导材料,比如玻璃,能够实现波分复用(WDM)功能,拓展光电混合集成模块的通道数以及波长。The photoelectric module packaging structure based on photoelectric hybrid integration provided by the embodiments of the present invention is suitable for on-board optical modules and optical transceiver components. The packaging structure supports optical sealing packaging, uses low-loss materials as packaging materials, and supports high-frequency signal transmission. . At the same time, the packaging structure assembles the electronic chip and the photonic chip close to each other, which reduces the interconnection loss. The packaging structure integrates planar optical waveguide materials, such as glass, which can realize wavelength division multiplexing (WDM) function, and expand the channel number and wavelength of the photoelectric hybrid integrated module.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应该以权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
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Application publication date: 20170725 Assignee: Beijing Aijie Kexin Technology Co.,Ltd. Assignor: Institute of Microelectronics of the Chinese Academy of Sciences Contract record no.: X2025990000125 Denomination of invention: Optoelectronic module packaging structure based on optoelectronic hybrid integration Granted publication date: 20190122 License type: Common License Record date: 20250324 |
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