GB2597179B - Optical engine - Google Patents

Optical engine Download PDF

Info

Publication number
GB2597179B
GB2597179B GB2115869.6A GB202115869A GB2597179B GB 2597179 B GB2597179 B GB 2597179B GB 202115869 A GB202115869 A GB 202115869A GB 2597179 B GB2597179 B GB 2597179B
Authority
GB
United Kingdom
Prior art keywords
optical engine
engine
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2115869.6A
Other versions
GB2597179A (en
Inventor
Sawyer Brett
Lee Seungjae
Chou Chia-Te
Raghunathan Vivek
Raghuraman Vivek
Muth Karlheinz
Arlo Nelson David
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rockley Photonics Ltd
Original Assignee
Rockley Photonics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/382,076 external-priority patent/US11054597B2/en
Application filed by Rockley Photonics Ltd filed Critical Rockley Photonics Ltd
Publication of GB2597179A publication Critical patent/GB2597179A/en
Application granted granted Critical
Publication of GB2597179B publication Critical patent/GB2597179B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
GB2115869.6A 2019-04-04 2020-04-03 Optical engine Active GB2597179B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962829519P 2019-04-04 2019-04-04
US16/382,076 US11054597B2 (en) 2018-04-12 2019-04-11 Electro-optical package and method of fabrication
PCT/EP2020/059637 WO2020201539A1 (en) 2019-04-04 2020-04-03 Optical engine

Publications (2)

Publication Number Publication Date
GB2597179A GB2597179A (en) 2022-01-19
GB2597179B true GB2597179B (en) 2023-07-05

Family

ID=72666515

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2115869.6A Active GB2597179B (en) 2019-04-04 2020-04-03 Optical engine

Country Status (3)

Country Link
CN (1) CN113811804A (en)
GB (1) GB2597179B (en)
WO (1) WO2020201539A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177173A1 (en) * 2005-02-04 2006-08-10 Sioptical, Inc. Vertical stacking of multiple integrated circuits including SOI-based optical components
EP2820461A2 (en) * 2012-03-01 2015-01-07 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
US20170186670A1 (en) * 2015-08-13 2017-06-29 International Business Machines Corporation Packaging optoelectronic components and cmos circuitry using silicon-on-insulator substrates for photonics applications

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1624919A (en) * 2003-12-05 2005-06-08 三星电子株式会社 Wafer-level electronic modules with integral connector contacts and methods of fabricating the same
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
US8971676B1 (en) * 2013-10-07 2015-03-03 Oracle International Corporation Hybrid-integrated photonic chip package
TW201717343A (en) * 2015-11-04 2017-05-16 華亞科技股份有限公司 Package-on-package assembly and method for manufacturing the same
US10672741B2 (en) * 2016-08-18 2020-06-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
KR20190093193A (en) * 2016-12-30 2019-08-08 인텔 아이피 코포레이션 Interconnect Structure for Stacked Dies in Microelectronic Devices
CN112368621A (en) * 2018-04-12 2021-02-12 洛克利光子有限公司 Electro-optic package and method of manufacture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177173A1 (en) * 2005-02-04 2006-08-10 Sioptical, Inc. Vertical stacking of multiple integrated circuits including SOI-based optical components
EP2820461A2 (en) * 2012-03-01 2015-01-07 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
US20170186670A1 (en) * 2015-08-13 2017-06-29 International Business Machines Corporation Packaging optoelectronic components and cmos circuitry using silicon-on-insulator substrates for photonics applications

Also Published As

Publication number Publication date
WO2020201539A1 (en) 2020-10-08
CN113811804A (en) 2021-12-17
GB2597179A (en) 2022-01-19

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732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

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