JP2015510532A5 - - Google Patents

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Publication number
JP2015510532A5
JP2015510532A5 JP2014554939A JP2014554939A JP2015510532A5 JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5 JP 2014554939 A JP2014554939 A JP 2014554939A JP 2014554939 A JP2014554939 A JP 2014554939A JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5
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JP
Japan
Prior art keywords
mixture
carbon black
silane
less
dbp
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Granted
Application number
JP2014554939A
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English (en)
Japanese (ja)
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JP2015510532A (ja
JP6294236B2 (ja
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Priority claimed from PCT/US2013/023588 external-priority patent/WO2013116196A1/en
Publication of JP2015510532A publication Critical patent/JP2015510532A/ja
Publication of JP2015510532A5 publication Critical patent/JP2015510532A5/ja
Application granted granted Critical
Publication of JP6294236B2 publication Critical patent/JP6294236B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014554939A 2012-01-31 2013-01-29 熱可塑性の半導性組成物 Active JP6294236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
US61/592,700 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (3)

Publication Number Publication Date
JP2015510532A JP2015510532A (ja) 2015-04-09
JP2015510532A5 true JP2015510532A5 (https=) 2016-03-03
JP6294236B2 JP6294236B2 (ja) 2018-03-14

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014554939A Active JP6294236B2 (ja) 2012-01-31 2013-01-29 熱可塑性の半導性組成物

Country Status (10)

Country Link
US (1) US9595365B2 (https=)
EP (1) EP2809731B1 (https=)
JP (1) JP6294236B2 (https=)
KR (1) KR102012805B1 (https=)
CN (1) CN104159978B (https=)
BR (1) BR112014017195B1 (https=)
CA (1) CA2861113C (https=)
MX (1) MX346691B (https=)
TW (1) TWI576382B (https=)
WO (1) WO2013116196A1 (https=)

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JP6472879B2 (ja) 2014-06-27 2019-02-20 ダウ グローバル テクノロジーズ エルエルシー 電気装置のための常温収縮物品
CA2964346C (en) * 2014-10-24 2020-07-21 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
US10755833B2 (en) 2015-01-09 2020-08-25 Momentive Performance Materials Gmbh Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
MX2017013605A (es) * 2015-04-30 2018-03-07 Dow Global Technologies Llc Polidimetilsiloxano (pdms) terminado con hidroxilo como aditivo de control de curado para la reticulacion de silano de poliolefinas.
US10954410B2 (en) 2017-07-31 2021-03-23 Dow Global Technologies Llc Moisture curable composition for wire and cable insulation and jacket layers
US11361879B2 (en) 2017-07-31 2022-06-14 Dow Global Technologies Llc Moisture curable composition for wire and cable insulation and jacket layers
EP3746505B1 (en) 2018-02-01 2024-06-26 Dow Silicones Corporation Composition, polymer composite article formed therewith, and method of preparing same
US11753521B2 (en) * 2018-02-14 2023-09-12 Dow Global Technologies Llc Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
KR102743541B1 (ko) * 2019-05-24 2024-12-18 다우 글로벌 테크놀로지스 엘엘씨 가교결합된 중합체 조성물 및 코팅된 전도체
WO2021025773A1 (en) 2019-08-07 2021-02-11 Dow Silicones Corporation Solid carrier component including a liquid polydiorganosiloxane and methods for preparation and use of the solid carrier component
EP3802704B1 (en) 2019-08-07 2022-06-15 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
JP7092894B2 (ja) 2019-08-07 2022-06-28 ダウ シリコーンズ コーポレーション 液状ポリオルガノシロキサンを含む固体担体成分、並びに該固体担体成分の調製及び使用方法
TW202239854A (zh) 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物
CA3213523A1 (en) * 2021-03-31 2022-10-06 Paul J. Caronia Moisture-curable semiconductive formulation

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