JP2015501734A5 - - Google Patents
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- Publication number
- JP2015501734A5 JP2015501734A5 JP2014546048A JP2014546048A JP2015501734A5 JP 2015501734 A5 JP2015501734 A5 JP 2015501734A5 JP 2014546048 A JP2014546048 A JP 2014546048A JP 2014546048 A JP2014546048 A JP 2014546048A JP 2015501734 A5 JP2015501734 A5 JP 2015501734A5
- Authority
- JP
- Japan
- Prior art keywords
- sacrificial layer
- layer
- overcoat layer
- carbonate
- patterning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 22
- -1 polypropylene carbonate Polymers 0.000 claims 6
- 238000000059 patterning Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000012778 molding material Substances 0.000 claims 4
- 229920000379 polypropylene carbonate Polymers 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 3
- 229920000636 poly(norbornene) polymer Polymers 0.000 claims 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920002577 polybenzoxazole Polymers 0.000 claims 2
- 229920000515 polycarbonate Polymers 0.000 claims 2
- 239000004417 polycarbonate Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 125000001207 fluorophenyl group Chemical group 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 claims 1
- ZMOJTPABCOWEOS-UHFFFAOYSA-N tris(4-tert-butylphenyl)sulfanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC(=CC=1)C(C)(C)C)C1=CC=C(C(C)(C)C)C=C1 ZMOJTPABCOWEOS-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161567877P | 2011-12-07 | 2011-12-07 | |
| US61/567,877 | 2011-12-07 | ||
| PCT/US2012/068092 WO2013086083A1 (en) | 2011-12-07 | 2012-12-06 | Packaging compatible wafer level capping of mems devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015501734A JP2015501734A (ja) | 2015-01-19 |
| JP2015501734A5 true JP2015501734A5 (enExample) | 2015-10-01 |
| JP6063475B2 JP6063475B2 (ja) | 2017-01-18 |
Family
ID=47505302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014546048A Expired - Fee Related JP6063475B2 (ja) | 2011-12-07 | 2012-12-06 | パッケージングに適合する、ｍｅｍｓデバイスのウェハレベルキャッピング |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8765512B2 (enExample) |
| EP (1) | EP2788280B1 (enExample) |
| JP (1) | JP6063475B2 (enExample) |
| KR (1) | KR101583498B1 (enExample) |
| CN (1) | CN104093662B (enExample) |
| SG (1) | SG11201402261SA (enExample) |
| TW (1) | TWI600609B (enExample) |
| WO (1) | WO2013086083A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9416003B2 (en) * | 2014-02-24 | 2016-08-16 | Freescale Semiconductor, Inc. | Semiconductor die with high pressure cavity |
| KR102353651B1 (ko) * | 2014-03-24 | 2022-01-21 | 인텔 코포레이션 | 반도체 다이 내에 스루 바디 비아 및 스루 바디 비아를 포함하는 집적회로를 형성하는 방법 |
| JP6469960B2 (ja) * | 2014-03-31 | 2019-02-13 | 住友精化株式会社 | ポジ型フォトレジスト |
| TWI590735B (zh) | 2014-12-15 | 2017-07-01 | 財團法人工業技術研究院 | 訊號傳輸板及其製作方法 |
| JP2016163917A (ja) * | 2015-03-06 | 2016-09-08 | 株式会社東芝 | Ｍｅｍｓ装置 |
| CN104985241B (zh) * | 2015-05-16 | 2017-04-05 | 哈尔滨工业大学 | 一种基于压电陶瓷片逆压电效应的一维振动装置 |
| TWI576026B (zh) | 2015-07-17 | 2017-03-21 | 財團法人工業技術研究院 | 電路結構 |
| US9845235B2 (en) * | 2015-09-03 | 2017-12-19 | General Electric Company | Refractory seed metal for electroplated MEMS structures |
| DE112015007070T5 (de) * | 2015-10-29 | 2018-09-13 | Intel Corporation | Metallfreie Rahmengestaltung für Siliziumbrücken für Halbleitergehäuse |
| WO2017078716A1 (en) | 2015-11-05 | 2017-05-11 | Hewlett-Packard Development Company, L.P. | Three-dimensional features formed in molded panel |
| WO2017094176A1 (ja) * | 2015-12-04 | 2017-06-08 | 株式会社日立製作所 | 断面観察試料作製装置及び断面観察試料作製方法 |
| JP2017208417A (ja) * | 2016-05-17 | 2017-11-24 | 住友ベークライト株式会社 | 中空構造体の製造方法 |
| KR102512186B1 (ko) | 2016-12-22 | 2023-03-20 | 일루미나, 인코포레이티드 | 수지 필름 및 패턴화된 중합체층을 포함하는 어레이 |
| CN106788306A (zh) * | 2017-03-07 | 2017-05-31 | 杭州左蓝微电子技术有限公司 | 一种薄膜体声波谐振器及其制备方法 |
| KR102369434B1 (ko) | 2017-04-19 | 2022-03-03 | 삼성전기주식회사 | 체적 음향 공진기 및 이의 제조방법 |
| US11235328B2 (en) * | 2017-04-21 | 2022-02-01 | Hewlett-Packard Development Company, L.P. | Coplanar microfluidic manipulation |
| US10269587B2 (en) | 2017-06-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit packages and methods of forming same |
| US10584027B2 (en) * | 2017-12-01 | 2020-03-10 | Elbit Systems Of America, Llc | Method for forming hermetic seals in MEMS devices |
| JP7164773B2 (ja) * | 2018-03-02 | 2022-11-02 | 東京エレクトロン株式会社 | パターンを層に転写する方法 |
| KR20190111743A (ko) * | 2018-03-22 | 2019-10-02 | 스미토모 세이카 가부시키가이샤 | 복합부재 및 그 제조방법 |
| CN108507558B (zh) * | 2018-03-28 | 2024-04-30 | 株洲菲斯罗克光电科技股份有限公司 | 一种轻量化三轴一体光纤陀螺仪 |
| CN108878370A (zh) * | 2018-06-27 | 2018-11-23 | 深圳市华星光电技术有限公司 | 一种透明导电电极及其制备方法、显示装置 |
| US20200115224A1 (en) | 2018-10-12 | 2020-04-16 | Stmicroelectronics S.R.L. | Mems device having a rugged package and fabrication process thereof |
| CN111039254A (zh) * | 2018-10-15 | 2020-04-21 | 无锡华润上华科技有限公司 | Mems样品纵向截面的制备方法及形貌观察方法 |
| CN114477073B (zh) * | 2021-12-08 | 2024-05-03 | 江苏普诺威电子股份有限公司 | 改善mems载板边缘掉屑的制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030183916A1 (en) * | 2002-03-27 | 2003-10-02 | John Heck | Packaging microelectromechanical systems |
| EP1567580A4 (en) | 2002-11-01 | 2008-04-30 | Georgia Tech Res Inst | OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME |
| EP1758814A4 (en) * | 2004-03-15 | 2010-12-15 | Georgia Tech Res Inst | CAPACITY FOR ELECTRO-MECHANICAL MICROSYSTEMS AND MANUFACTURING METHOD THEREFOR |
| JP4426413B2 (ja) | 2004-09-24 | 2010-03-03 | 日本電信電話株式会社 | 半導体装置の製造方法 |
| CN101283042A (zh) * | 2005-08-09 | 2008-10-08 | 查珀尔希尔北卡罗来纳大学 | 制造微流体器件的方法和材料 |
| US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| JP5110575B2 (ja) * | 2007-08-24 | 2012-12-26 | エムテックスマツムラ株式会社 | 中空パッケージ及び半導体装置 |
| CN101554987B (zh) * | 2009-04-30 | 2011-04-20 | 华中科技大学 | 一种微机电系统的圆片级真空封装工艺 |
| CN102001616A (zh) * | 2009-08-31 | 2011-04-06 | 上海丽恒光微电子科技有限公司 | 装配和封装微型机电系统装置的方法 |
| JP2011142229A (ja) * | 2010-01-07 | 2011-07-21 | Toyota Motor Corp | 電子部品用パッケージ、電子部品装置、及び電子部品装置の製造方法 |
-
2012
- 2012-12-06 SG SG11201402261SA patent/SG11201402261SA/en unknown
- 2012-12-06 EP EP12810454.4A patent/EP2788280B1/en not_active Not-in-force
- 2012-12-06 KR KR1020147018512A patent/KR101583498B1/ko not_active Expired - Fee Related
- 2012-12-06 CN CN201280060077.7A patent/CN104093662B/zh not_active Expired - Fee Related
- 2012-12-06 JP JP2014546048A patent/JP6063475B2/ja not_active Expired - Fee Related
- 2012-12-06 US US13/706,488 patent/US8765512B2/en not_active Expired - Fee Related
- 2012-12-06 WO PCT/US2012/068092 patent/WO2013086083A1/en not_active Ceased
- 2012-12-07 TW TW101146048A patent/TWI600609B/zh not_active IP Right Cessation
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