JP2015195240A5 - - Google Patents
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- Publication number
- JP2015195240A5 JP2015195240A5 JP2014071458A JP2014071458A JP2015195240A5 JP 2015195240 A5 JP2015195240 A5 JP 2015195240A5 JP 2014071458 A JP2014071458 A JP 2014071458A JP 2014071458 A JP2014071458 A JP 2014071458A JP 2015195240 A5 JP2015195240 A5 JP 2015195240A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- electrode
- semiconductor device
- semiconductor element
- metal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 40
- 239000002184 metal Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000011347 resin Substances 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 10
- 238000007747 plating Methods 0.000 claims 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 125000000962 organic group Chemical group 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000002131 composite material Substances 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 229910007637 SnAg Inorganic materials 0.000 claims 3
- 238000001459 lithography Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 3
- 239000002253 acid Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000003431 cross linking reagent Substances 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- -1 methylol groups Chemical group 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 150000002989 phenols Chemical class 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014071458A JP6031060B2 (ja) | 2014-03-31 | 2014-03-31 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
| CN201580018116.0A CN106165086B (zh) | 2014-03-31 | 2015-03-12 | 半导体装置、积层型半导体装置、密封后积层型半导体装置以及这些装置的制造方法 |
| US15/126,172 US10319653B2 (en) | 2014-03-31 | 2015-03-12 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same |
| KR1020167027164A KR102338029B1 (ko) | 2014-03-31 | 2015-03-12 | 반도체장치, 적층형 반도체장치, 봉지후 적층형 반도체장치, 및 이들의 제조방법 |
| PCT/JP2015/001367 WO2015151417A1 (ja) | 2014-03-31 | 2015-03-12 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
| EP15773072.2A EP3128549B1 (en) | 2014-03-31 | 2015-03-12 | Semiconductor device, layered semiconductor device, sealed-then-layered semiconductor device, and manufacturing methods therefor |
| CN201910491197.6A CN110176432B (zh) | 2014-03-31 | 2015-03-12 | 半导体装置、积层型半导体装置、密封后积层型半导体装置 |
| TW104110258A TWI648439B (zh) | 2014-03-31 | 2015-03-30 | 半導體裝置、層合型半導體裝置、密封後層合型半導體裝置、及此等之製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014071458A JP6031060B2 (ja) | 2014-03-31 | 2014-03-31 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015195240A JP2015195240A (ja) | 2015-11-05 |
| JP2015195240A5 true JP2015195240A5 (enExample) | 2016-10-27 |
| JP6031060B2 JP6031060B2 (ja) | 2016-11-24 |
Family
ID=54239769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014071458A Active JP6031060B2 (ja) | 2014-03-31 | 2014-03-31 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10319653B2 (enExample) |
| EP (1) | EP3128549B1 (enExample) |
| JP (1) | JP6031060B2 (enExample) |
| KR (1) | KR102338029B1 (enExample) |
| CN (2) | CN110176432B (enExample) |
| TW (1) | TWI648439B (enExample) |
| WO (1) | WO2015151417A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10727082B2 (en) * | 2015-08-28 | 2020-07-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
| JP6534948B2 (ja) * | 2016-02-26 | 2019-06-26 | 信越化学工業株式会社 | 半導体装置の製造方法、フリップチップ型半導体装置の製造方法、半導体装置及びフリップチップ型半導体装置 |
| JP6753743B2 (ja) | 2016-09-09 | 2020-09-09 | キオクシア株式会社 | 半導体装置の製造方法 |
| JP7205787B2 (ja) * | 2017-07-31 | 2023-01-17 | 大日本印刷株式会社 | 電子部品搭載基板およびその製造方法 |
| FR3070090B1 (fr) * | 2017-08-08 | 2020-02-07 | 3Dis Technologies | Systeme electronique et procede de fabrication d'un systeme electronique par utilisation d'un element sacrificiel |
| US10695875B2 (en) * | 2018-03-19 | 2020-06-30 | Asia Vital Components Co., Ltd. | Soldering method of soldering jig |
| KR102464066B1 (ko) * | 2018-04-30 | 2022-11-07 | 에스케이하이닉스 주식회사 | 쓰루 몰드 비아를 포함하는 스택 패키지 |
| WO2020129808A1 (ja) * | 2018-12-21 | 2020-06-25 | 株式会社村田製作所 | 電子部品モジュールの製造方法及び電子部品モジュール |
| KR102599631B1 (ko) | 2020-06-08 | 2023-11-06 | 삼성전자주식회사 | 반도체 칩, 반도체 장치, 및 이를 포함하는 반도체 패키지 |
| KR102830541B1 (ko) | 2020-09-23 | 2025-07-07 | 삼성전자주식회사 | 반도체 칩의 접속 구조물 및 접속 구조물을 포함하는 반도체 패키지 |
| CN116964727A (zh) * | 2021-03-09 | 2023-10-27 | 索尼半导体解决方案公司 | 半导体装置、用于制造半导体装置的方法和电子装置 |
| JP7728154B2 (ja) * | 2021-11-18 | 2025-08-22 | イビデン株式会社 | プリント配線板の製造方法 |
| JP2023074860A (ja) * | 2021-11-18 | 2023-05-30 | イビデン株式会社 | プリント配線板の製造方法 |
| JP7728155B2 (ja) * | 2021-11-18 | 2025-08-22 | イビデン株式会社 | プリント配線板の製造方法 |
| CN118943027B (zh) * | 2023-05-11 | 2025-12-09 | 中国科学院微电子研究所 | 一种内埋芯片基板的制造方法及临时键合结构 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040134875A1 (en) * | 2002-11-22 | 2004-07-15 | Kyocera Corporation | Circuit-parts sheet and method of producing a multi-layer circuit board |
| JP5001542B2 (ja) * | 2005-03-17 | 2012-08-15 | 日立電線株式会社 | 電子装置用基板およびその製造方法、ならびに電子装置の製造方法 |
| JP4533283B2 (ja) | 2005-08-29 | 2010-09-01 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| US20080246126A1 (en) * | 2007-04-04 | 2008-10-09 | Freescale Semiconductor, Inc. | Stacked and shielded die packages with interconnects |
| US8441133B2 (en) | 2009-03-31 | 2013-05-14 | Ibiden Co., Ltd. | Semiconductor device |
| JP5459196B2 (ja) | 2009-12-15 | 2014-04-02 | 信越化学工業株式会社 | 光硬化性ドライフィルム、その製造方法、パターン形成方法及び電気・電子部品保護用皮膜 |
| WO2011122228A1 (ja) * | 2010-03-31 | 2011-10-06 | 日本電気株式会社 | 半導体内蔵基板 |
| WO2011125380A1 (ja) | 2010-04-08 | 2011-10-13 | 日本電気株式会社 | 半導体素子内蔵配線基板 |
| US8236617B2 (en) * | 2010-06-04 | 2012-08-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure |
| JP2012256675A (ja) | 2011-06-08 | 2012-12-27 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及びその製造方法 |
| JP2013004576A (ja) * | 2011-06-13 | 2013-01-07 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP2013030593A (ja) * | 2011-07-28 | 2013-02-07 | J Devices:Kk | 半導体装置、該半導体装置を垂直に積層した半導体モジュール構造及びその製造方法 |
| JP5977051B2 (ja) | 2012-03-21 | 2016-08-24 | 新光電気工業株式会社 | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
| US8878360B2 (en) * | 2012-07-13 | 2014-11-04 | Intel Mobile Communications GmbH | Stacked fan-out semiconductor chip |
-
2014
- 2014-03-31 JP JP2014071458A patent/JP6031060B2/ja active Active
-
2015
- 2015-03-12 WO PCT/JP2015/001367 patent/WO2015151417A1/ja not_active Ceased
- 2015-03-12 CN CN201910491197.6A patent/CN110176432B/zh active Active
- 2015-03-12 CN CN201580018116.0A patent/CN106165086B/zh active Active
- 2015-03-12 KR KR1020167027164A patent/KR102338029B1/ko active Active
- 2015-03-12 EP EP15773072.2A patent/EP3128549B1/en active Active
- 2015-03-12 US US15/126,172 patent/US10319653B2/en active Active
- 2015-03-30 TW TW104110258A patent/TWI648439B/zh active
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