SG11201402261SA - Packaging compatible wafer level capping of mems devices - Google Patents

Packaging compatible wafer level capping of mems devices

Info

Publication number
SG11201402261SA
SG11201402261SA SG11201402261SA SG11201402261SA SG11201402261SA SG 11201402261S A SG11201402261S A SG 11201402261SA SG 11201402261S A SG11201402261S A SG 11201402261SA SG 11201402261S A SG11201402261S A SG 11201402261SA SG 11201402261S A SG11201402261S A SG 11201402261SA
Authority
SG
Singapore
Prior art keywords
wafer level
mems devices
compatible wafer
level capping
packaging compatible
Prior art date
Application number
SG11201402261SA
Other languages
English (en)
Inventor
Paul A Kohl
Rajarshi Saha
Nathan Fritz
Original Assignee
Georgia Tech Res Inst
Paul A Kohl
Rajarshi Saha
Nathan Fritz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Res Inst, Paul A Kohl, Rajarshi Saha, Nathan Fritz filed Critical Georgia Tech Res Inst
Publication of SG11201402261SA publication Critical patent/SG11201402261SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
SG11201402261SA 2011-12-07 2012-12-06 Packaging compatible wafer level capping of mems devices SG11201402261SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161567877P 2011-12-07 2011-12-07
PCT/US2012/068092 WO2013086083A1 (en) 2011-12-07 2012-12-06 Packaging compatible wafer level capping of mems devices

Publications (1)

Publication Number Publication Date
SG11201402261SA true SG11201402261SA (en) 2014-08-28

Family

ID=47505302

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402261SA SG11201402261SA (en) 2011-12-07 2012-12-06 Packaging compatible wafer level capping of mems devices

Country Status (8)

Country Link
US (1) US8765512B2 (enExample)
EP (1) EP2788280B1 (enExample)
JP (1) JP6063475B2 (enExample)
KR (1) KR101583498B1 (enExample)
CN (1) CN104093662B (enExample)
SG (1) SG11201402261SA (enExample)
TW (1) TWI600609B (enExample)
WO (1) WO2013086083A1 (enExample)

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US9416003B2 (en) * 2014-02-24 2016-08-16 Freescale Semiconductor, Inc. Semiconductor die with high pressure cavity
KR102353651B1 (ko) * 2014-03-24 2022-01-21 인텔 코포레이션 반도체 다이 내에 스루 바디 비아 및 스루 바디 비아를 포함하는 집적회로를 형성하는 방법
JP6469960B2 (ja) * 2014-03-31 2019-02-13 住友精化株式会社 ポジ型フォトレジスト
TWI590735B (zh) 2014-12-15 2017-07-01 財團法人工業技術研究院 訊號傳輸板及其製作方法
JP2016163917A (ja) * 2015-03-06 2016-09-08 株式会社東芝 Ｍｅｍｓ装置
CN104985241B (zh) * 2015-05-16 2017-04-05 哈尔滨工业大学 一种基于压电陶瓷片逆压电效应的一维振动装置
TWI576026B (zh) 2015-07-17 2017-03-21 財團法人工業技術研究院 電路結構
US9845235B2 (en) * 2015-09-03 2017-12-19 General Electric Company Refractory seed metal for electroplated MEMS structures
DE112015007070T5 (de) * 2015-10-29 2018-09-13 Intel Corporation Metallfreie Rahmengestaltung für Siliziumbrücken für Halbleitergehäuse
WO2017078716A1 (en) 2015-11-05 2017-05-11 Hewlett-Packard Development Company, L.P. Three-dimensional features formed in molded panel
WO2017094176A1 (ja) * 2015-12-04 2017-06-08 株式会社日立製作所 断面観察試料作製装置及び断面観察試料作製方法
JP2017208417A (ja) * 2016-05-17 2017-11-24 住友ベークライト株式会社 中空構造体の製造方法
KR102512186B1 (ko) 2016-12-22 2023-03-20 일루미나, 인코포레이티드 수지 필름 및 패턴화된 중합체층을 포함하는 어레이
CN106788306A (zh) * 2017-03-07 2017-05-31 杭州左蓝微电子技术有限公司 一种薄膜体声波谐振器及其制备方法
KR102369434B1 (ko) 2017-04-19 2022-03-03 삼성전기주식회사 체적 음향 공진기 및 이의 제조방법
US11235328B2 (en) * 2017-04-21 2022-02-01 Hewlett-Packard Development Company, L.P. Coplanar microfluidic manipulation
US10269587B2 (en) 2017-06-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages and methods of forming same
US10584027B2 (en) * 2017-12-01 2020-03-10 Elbit Systems Of America, Llc Method for forming hermetic seals in MEMS devices
JP7164773B2 (ja) * 2018-03-02 2022-11-02 東京エレクトロン株式会社 パターンを層に転写する方法
KR20190111743A (ko) * 2018-03-22 2019-10-02 스미토모 세이카 가부시키가이샤 복합부재 및 그 제조방법
CN108507558B (zh) * 2018-03-28 2024-04-30 株洲菲斯罗克光电科技股份有限公司 一种轻量化三轴一体光纤陀螺仪
CN108878370A (zh) * 2018-06-27 2018-11-23 深圳市华星光电技术有限公司 一种透明导电电极及其制备方法、显示装置
US20200115224A1 (en) 2018-10-12 2020-04-16 Stmicroelectronics S.R.L. Mems device having a rugged package and fabrication process thereof
CN111039254A (zh) * 2018-10-15 2020-04-21 无锡华润上华科技有限公司 Mems样品纵向截面的制备方法及形貌观察方法
CN114477073B (zh) * 2021-12-08 2024-05-03 江苏普诺威电子股份有限公司 改善mems载板边缘掉屑的制作方法

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US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
EP1567580A4 (en) 2002-11-01 2008-04-30 Georgia Tech Res Inst OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME
EP1758814A4 (en) * 2004-03-15 2010-12-15 Georgia Tech Res Inst CAPACITY FOR ELECTRO-MECHANICAL MICROSYSTEMS AND MANUFACTURING METHOD THEREFOR
JP4426413B2 (ja) 2004-09-24 2010-03-03 日本電信電話株式会社 半導体装置の製造方法
CN101283042A (zh) * 2005-08-09 2008-10-08 查珀尔希尔北卡罗来纳大学 制造微流体器件的方法和材料
US7635606B2 (en) 2006-08-02 2009-12-22 Skyworks Solutions, Inc. Wafer level package with cavities for active devices
JP5110575B2 (ja) * 2007-08-24 2012-12-26 エムテックスマツムラ株式会社 中空パッケージ及び半導体装置
CN101554987B (zh) * 2009-04-30 2011-04-20 华中科技大学 一种微机电系统的圆片级真空封装工艺
CN102001616A (zh) * 2009-08-31 2011-04-06 上海丽恒光微电子科技有限公司 装配和封装微型机电系统装置的方法
JP2011142229A (ja) * 2010-01-07 2011-07-21 Toyota Motor Corp 電子部品用パッケージ、電子部品装置、及び電子部品装置の製造方法

Also Published As

Publication number Publication date
US8765512B2 (en) 2014-07-01
EP2788280A1 (en) 2014-10-15
TW201336775A (zh) 2013-09-16
CN104093662A (zh) 2014-10-08
KR20140126696A (ko) 2014-10-31
KR101583498B1 (ko) 2016-01-08
WO2013086083A1 (en) 2013-06-13
EP2788280B1 (en) 2018-06-20
CN104093662B (zh) 2015-11-25
JP2015501734A (ja) 2015-01-19
JP6063475B2 (ja) 2017-01-18
US20130341736A1 (en) 2013-12-26
TWI600609B (zh) 2017-10-01

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