TWI600609B - Ｍｅｍｓ裝置之封裝相容晶圓級封蓋 - Google Patents
Ｍｅｍｓ裝置之封裝相容晶圓級封蓋 Download PDFInfo
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- TWI600609B TWI600609B TW101146048A TW101146048A TWI600609B TW I600609 B TWI600609 B TW I600609B TW 101146048 A TW101146048 A TW 101146048A TW 101146048 A TW101146048 A TW 101146048A TW I600609 B TWI600609 B TW I600609B
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- 238000005457 optimization Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003253 poly(benzobisoxazole) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0108—Sacrificial polymer, ashing of organics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161567877P | 2011-12-07 | 2011-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201336775A TW201336775A (zh) | 2013-09-16 |
| TWI600609B true TWI600609B (zh) | 2017-10-01 |
Family
ID=47505302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101146048A TWI600609B (zh) | 2011-12-07 | 2012-12-07 | Ｍｅｍｓ裝置之封裝相容晶圓級封蓋 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8765512B2 (enExample) |
| EP (1) | EP2788280B1 (enExample) |
| JP (1) | JP6063475B2 (enExample) |
| KR (1) | KR101583498B1 (enExample) |
| CN (1) | CN104093662B (enExample) |
| SG (1) | SG11201402261SA (enExample) |
| TW (1) | TWI600609B (enExample) |
| WO (1) | WO2013086083A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784128B (zh) * | 2018-03-22 | 2022-11-21 | 日商住友精化股份有限公司 | 複合構件及其製造方法 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9416003B2 (en) * | 2014-02-24 | 2016-08-16 | Freescale Semiconductor, Inc. | Semiconductor die with high pressure cavity |
| KR102353651B1 (ko) * | 2014-03-24 | 2022-01-21 | 인텔 코포레이션 | 반도체 다이 내에 스루 바디 비아 및 스루 바디 비아를 포함하는 집적회로를 형성하는 방법 |
| JP6469960B2 (ja) * | 2014-03-31 | 2019-02-13 | 住友精化株式会社 | ポジ型フォトレジスト |
| TWI590735B (zh) | 2014-12-15 | 2017-07-01 | 財團法人工業技術研究院 | 訊號傳輸板及其製作方法 |
| JP2016163917A (ja) * | 2015-03-06 | 2016-09-08 | 株式会社東芝 | Ｍｅｍｓ装置 |
| CN104985241B (zh) * | 2015-05-16 | 2017-04-05 | 哈尔滨工业大学 | 一种基于压电陶瓷片逆压电效应的一维振动装置 |
| TWI576026B (zh) | 2015-07-17 | 2017-03-21 | 財團法人工業技術研究院 | 電路結構 |
| US9845235B2 (en) * | 2015-09-03 | 2017-12-19 | General Electric Company | Refractory seed metal for electroplated MEMS structures |
| DE112015007070T5 (de) * | 2015-10-29 | 2018-09-13 | Intel Corporation | Metallfreie Rahmengestaltung für Siliziumbrücken für Halbleitergehäuse |
| WO2017078716A1 (en) | 2015-11-05 | 2017-05-11 | Hewlett-Packard Development Company, L.P. | Three-dimensional features formed in molded panel |
| WO2017094176A1 (ja) * | 2015-12-04 | 2017-06-08 | 株式会社日立製作所 | 断面観察試料作製装置及び断面観察試料作製方法 |
| JP2017208417A (ja) * | 2016-05-17 | 2017-11-24 | 住友ベークライト株式会社 | 中空構造体の製造方法 |
| KR102512186B1 (ko) | 2016-12-22 | 2023-03-20 | 일루미나, 인코포레이티드 | 수지 필름 및 패턴화된 중합체층을 포함하는 어레이 |
| CN106788306A (zh) * | 2017-03-07 | 2017-05-31 | 杭州左蓝微电子技术有限公司 | 一种薄膜体声波谐振器及其制备方法 |
| KR102369434B1 (ko) | 2017-04-19 | 2022-03-03 | 삼성전기주식회사 | 체적 음향 공진기 및 이의 제조방법 |
| US11235328B2 (en) * | 2017-04-21 | 2022-02-01 | Hewlett-Packard Development Company, L.P. | Coplanar microfluidic manipulation |
| US10269587B2 (en) | 2017-06-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit packages and methods of forming same |
| US10584027B2 (en) * | 2017-12-01 | 2020-03-10 | Elbit Systems Of America, Llc | Method for forming hermetic seals in MEMS devices |
| JP7164773B2 (ja) * | 2018-03-02 | 2022-11-02 | 東京エレクトロン株式会社 | パターンを層に転写する方法 |
| CN108507558B (zh) * | 2018-03-28 | 2024-04-30 | 株洲菲斯罗克光电科技股份有限公司 | 一种轻量化三轴一体光纤陀螺仪 |
| CN108878370A (zh) * | 2018-06-27 | 2018-11-23 | 深圳市华星光电技术有限公司 | 一种透明导电电极及其制备方法、显示装置 |
| US20200115224A1 (en) | 2018-10-12 | 2020-04-16 | Stmicroelectronics S.R.L. | Mems device having a rugged package and fabrication process thereof |
| CN111039254A (zh) * | 2018-10-15 | 2020-04-21 | 无锡华润上华科技有限公司 | Mems样品纵向截面的制备方法及形貌观察方法 |
| CN114477073B (zh) * | 2021-12-08 | 2024-05-03 | 江苏普诺威电子股份有限公司 | 改善mems载板边缘掉屑的制作方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW588441B (en) * | 2002-03-27 | 2004-05-21 | Intel Corp | Packaging microelectromechanical systems |
| US20070273013A1 (en) * | 2004-03-15 | 2007-11-29 | Kohl Paul A | Packaging for Micro Electro-Mechanical Systems and Methods of Fabricating Thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1567580A4 (en) | 2002-11-01 | 2008-04-30 | Georgia Tech Res Inst | OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME |
| JP4426413B2 (ja) | 2004-09-24 | 2010-03-03 | 日本電信電話株式会社 | 半導体装置の製造方法 |
| CN101283042A (zh) * | 2005-08-09 | 2008-10-08 | 查珀尔希尔北卡罗来纳大学 | 制造微流体器件的方法和材料 |
| US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| JP5110575B2 (ja) * | 2007-08-24 | 2012-12-26 | エムテックスマツムラ株式会社 | 中空パッケージ及び半導体装置 |
| CN101554987B (zh) * | 2009-04-30 | 2011-04-20 | 华中科技大学 | 一种微机电系统的圆片级真空封装工艺 |
| CN102001616A (zh) * | 2009-08-31 | 2011-04-06 | 上海丽恒光微电子科技有限公司 | 装配和封装微型机电系统装置的方法 |
| JP2011142229A (ja) * | 2010-01-07 | 2011-07-21 | Toyota Motor Corp | 電子部品用パッケージ、電子部品装置、及び電子部品装置の製造方法 |
-
2012
- 2012-12-06 SG SG11201402261SA patent/SG11201402261SA/en unknown
- 2012-12-06 EP EP12810454.4A patent/EP2788280B1/en not_active Not-in-force
- 2012-12-06 KR KR1020147018512A patent/KR101583498B1/ko not_active Expired - Fee Related
- 2012-12-06 CN CN201280060077.7A patent/CN104093662B/zh not_active Expired - Fee Related
- 2012-12-06 JP JP2014546048A patent/JP6063475B2/ja not_active Expired - Fee Related
- 2012-12-06 US US13/706,488 patent/US8765512B2/en not_active Expired - Fee Related
- 2012-12-06 WO PCT/US2012/068092 patent/WO2013086083A1/en not_active Ceased
- 2012-12-07 TW TW101146048A patent/TWI600609B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW588441B (en) * | 2002-03-27 | 2004-05-21 | Intel Corp | Packaging microelectromechanical systems |
| US20070273013A1 (en) * | 2004-03-15 | 2007-11-29 | Kohl Paul A | Packaging for Micro Electro-Mechanical Systems and Methods of Fabricating Thereof |
| CN101094804A (zh) * | 2004-03-15 | 2007-12-26 | 佐治亚技术研究公司 | 微机电系统封装件及其制造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784128B (zh) * | 2018-03-22 | 2022-11-21 | 日商住友精化股份有限公司 | 複合構件及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8765512B2 (en) | 2014-07-01 |
| EP2788280A1 (en) | 2014-10-15 |
| TW201336775A (zh) | 2013-09-16 |
| CN104093662A (zh) | 2014-10-08 |
| KR20140126696A (ko) | 2014-10-31 |
| KR101583498B1 (ko) | 2016-01-08 |
| WO2013086083A1 (en) | 2013-06-13 |
| EP2788280B1 (en) | 2018-06-20 |
| CN104093662B (zh) | 2015-11-25 |
| JP2015501734A (ja) | 2015-01-19 |
| JP6063475B2 (ja) | 2017-01-18 |
| US20130341736A1 (en) | 2013-12-26 |
| SG11201402261SA (en) | 2014-08-28 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |