JP2015201618A5 - - Google Patents

Download PDF

Info

Publication number
JP2015201618A5
JP2015201618A5 JP2014211142A JP2014211142A JP2015201618A5 JP 2015201618 A5 JP2015201618 A5 JP 2015201618A5 JP 2014211142 A JP2014211142 A JP 2014211142A JP 2014211142 A JP2014211142 A JP 2014211142A JP 2015201618 A5 JP2015201618 A5 JP 2015201618A5
Authority
JP
Japan
Prior art keywords
plasma
electrostatic chuck
containing material
processed
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014211142A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015201618A (ja
JP6273188B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014211142A priority Critical patent/JP6273188B2/ja
Priority claimed from JP2014211142A external-priority patent/JP6273188B2/ja
Priority to TW103137323A priority patent/TWI609994B/zh
Priority to US14/527,536 priority patent/US9330891B2/en
Publication of JP2015201618A publication Critical patent/JP2015201618A/ja
Publication of JP2015201618A5 publication Critical patent/JP2015201618A5/ja
Application granted granted Critical
Publication of JP6273188B2 publication Critical patent/JP6273188B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014211142A 2013-10-31 2014-10-15 プラズマ処理方法 Active JP6273188B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014211142A JP6273188B2 (ja) 2013-10-31 2014-10-15 プラズマ処理方法
TW103137323A TWI609994B (zh) 2013-10-31 2014-10-29 電漿處理方法及電漿處理裝置
US14/527,536 US9330891B2 (en) 2013-10-31 2014-10-29 Plasma processing method and plasma processing apparatus

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013227500 2013-10-31
JP2013227500 2013-10-31
JP2014078196 2014-04-04
JP2014078196 2014-04-04
JP2014211142A JP6273188B2 (ja) 2013-10-31 2014-10-15 プラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2015201618A JP2015201618A (ja) 2015-11-12
JP2015201618A5 true JP2015201618A5 (enExample) 2017-08-31
JP6273188B2 JP6273188B2 (ja) 2018-01-31

Family

ID=52994237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014211142A Active JP6273188B2 (ja) 2013-10-31 2014-10-15 プラズマ処理方法

Country Status (3)

Country Link
US (1) US9330891B2 (enExample)
JP (1) JP6273188B2 (enExample)
TW (1) TWI609994B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6423706B2 (ja) * 2014-12-16 2018-11-14 東京エレクトロン株式会社 プラズマ処理装置
US10892136B2 (en) * 2018-08-13 2021-01-12 Varian Semiconductor Equipment Associates, Inc. Ion source thermal gas bushing
JP7378276B2 (ja) * 2019-11-12 2023-11-13 東京エレクトロン株式会社 プラズマ処理装置
TWI748741B (zh) * 2020-11-11 2021-12-01 暉盛科技股份有限公司 電漿晶圓清潔機及使用其清潔晶圓的方法
CN114695234B (zh) * 2020-12-31 2025-06-13 拓荆科技股份有限公司 保护机构及保护晶圆和销的方法
CN115241034A (zh) * 2022-07-28 2022-10-25 北京北方华创微电子装备有限公司 半导体工艺方法及半导体工艺设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3271389B2 (ja) * 1993-09-06 2002-04-02 富士電機株式会社 静電チャックの使用方法
JP2971369B2 (ja) * 1995-08-31 1999-11-02 トーカロ株式会社 静電チャック部材およびその製造方法
US5812362A (en) * 1996-06-14 1998-09-22 Applied Materials, Inc. Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks
TW422892B (en) * 1997-03-27 2001-02-21 Applied Materials Inc Technique for improving chucking reproducibility
JP3657942B2 (ja) * 2003-01-16 2005-06-08 沖電気工業株式会社 半導体製造装置の洗浄方法、及び半導体装置の製造方法
US6944006B2 (en) * 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
KR100841148B1 (ko) * 2003-10-27 2008-06-24 교세라 가부시키가이샤 복합재료와 웨이퍼 유지부재 및 이들의 제조방법
US20060008676A1 (en) * 2004-07-07 2006-01-12 General Electric Company Protective coating on a substrate and method of making thereof
JP2006210461A (ja) 2005-01-26 2006-08-10 Tokyo Electron Ltd プロセス装置の洗浄方法、該方法を実行するためのプログラム、及び記憶媒体
US20070217119A1 (en) * 2006-03-17 2007-09-20 David Johnson Apparatus and Method for Carrying Substrates
JP2008160093A (ja) * 2006-11-29 2008-07-10 Toto Ltd 静電チャック、静電チャックの製造方法および基板処理装置
JP4469364B2 (ja) 2006-12-11 2010-05-26 キヤノンアネルバ株式会社 絶縁膜エッチング装置
JP5390846B2 (ja) * 2008-12-09 2014-01-15 東京エレクトロン株式会社 プラズマエッチング装置及びプラズマクリーニング方法
JP2010199475A (ja) * 2009-02-27 2010-09-09 Tokyo Electron Ltd プラズマ処理装置のクリーニング方法及び記憶媒体
JP5364514B2 (ja) * 2009-09-03 2013-12-11 東京エレクトロン株式会社 チャンバ内クリーニング方法
JP5450187B2 (ja) * 2010-03-16 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP5638405B2 (ja) * 2010-10-08 2014-12-10 パナソニック株式会社 基板のプラズマ処理方法
JP2012109472A (ja) 2010-11-19 2012-06-07 Hitachi High-Technologies Corp プラズマ処理方法
JP5719599B2 (ja) * 2011-01-07 2015-05-20 東京エレクトロン株式会社 基板処理装置
US20130247935A1 (en) * 2011-10-31 2013-09-26 Seh-Jin Park Getter reticle

Similar Documents

Publication Publication Date Title
JP2015201618A5 (enExample)
JP2015163573A5 (enExample)
IL277401A (en) Aerosol production facility from Aerosol medium, item of Aerosol medium and method for operating an Aerosol production facility
TW200701345A (en) Film-forming apparatus and film-forming method
JP2015138913A5 (enExample)
TW201611915A (en) Substrate cleaning method and substrate cleaning apparatus
PL3773033T3 (pl) Urządzenie do wytwarzania aerozolu z nośnika ulegającego aerozolowaniu, wyrób nośnika ulegającego aerozolowaniu i sposób obsługiwania urządzenia wytwarzającego aerozol
SG169306A1 (en) Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatus
JP2015193864A5 (ja) 半導体装置の製造方法、基板処理装置、およびプログラム
JP2014208883A5 (enExample)
JP2018157048A5 (enExample)
WO2017178831A3 (en) Method and apparatus for treating a substrate with solid particles
WO2015065658A8 (en) Methods and compositions for the treatment and recovery of purge solvent
JP2011168881A5 (enExample)
WO2005104186A3 (en) Method and processing system for plasma-enhanced cleaning of system components
JP2016122795A5 (enExample)
WO2013144782A3 (en) Apparatus and method for liquid treatment of wafer-shaped articles
JP2014045063A5 (enExample)
JP2018022756A5 (enExample)
MY188714A (en) Heater arrangement for tepsa system
GB201203870D0 (en) Plasma processing apparatus
JP2020177959A5 (ja) クリーニング方法及びプラズマ処理装置
JP2015159212A5 (enExample)
WO2013033428A3 (en) In situ process kit clean for mocvd chambers
JP2017130574A5 (enExample)