JP2015181142A - 配線基板及びその製造方法、絶縁層の表面改質方法 - Google Patents

配線基板及びその製造方法、絶縁層の表面改質方法 Download PDF

Info

Publication number
JP2015181142A
JP2015181142A JP2014105652A JP2014105652A JP2015181142A JP 2015181142 A JP2015181142 A JP 2015181142A JP 2014105652 A JP2014105652 A JP 2014105652A JP 2014105652 A JP2014105652 A JP 2014105652A JP 2015181142 A JP2015181142 A JP 2015181142A
Authority
JP
Japan
Prior art keywords
insulating layer
solder
wiring board
pad
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014105652A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015181142A5 (https=
Inventor
秀樹 湯本
Hideki Yumoto
秀樹 湯本
洋一 原山
Yoichi Harayama
洋一 原山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014105652A priority Critical patent/JP2015181142A/ja
Priority to US14/627,099 priority patent/US9538668B2/en
Publication of JP2015181142A publication Critical patent/JP2015181142A/ja
Publication of JP2015181142A5 publication Critical patent/JP2015181142A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2014105652A 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法 Pending JP2015181142A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014105652A JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法
US14/627,099 US9538668B2 (en) 2014-03-03 2015-02-20 Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014040864 2014-03-03
JP2014040864 2014-03-03
JP2014105652A JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法

Publications (2)

Publication Number Publication Date
JP2015181142A true JP2015181142A (ja) 2015-10-15
JP2015181142A5 JP2015181142A5 (https=) 2017-03-02

Family

ID=54007412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014105652A Pending JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法

Country Status (2)

Country Link
US (1) US9538668B2 (https=)
JP (1) JP2015181142A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185675A (ja) * 2014-03-24 2015-10-22 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法及び基板を製造する方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6086055B2 (ja) * 2013-11-26 2017-03-01 トヨタ自動車株式会社 半導体装置
US9978674B2 (en) * 2016-04-05 2018-05-22 Samsung Electronics Co., Ltd. Chip-on-film semiconductor packages and display apparatus including the same
US10403591B2 (en) * 2017-10-31 2019-09-03 Xilinx, Inc. Chip package assembly with enhanced interconnects and method for fabricating the same
US20190275600A1 (en) * 2018-03-07 2019-09-12 Powertech Technology Inc. Flux transfer tool and flux transfer method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152109A (ja) * 1992-11-02 1994-05-31 Matsushita Electric Ind Co Ltd プリント基板およびその製造方法
JP2004022713A (ja) * 2002-06-14 2004-01-22 Dainippon Printing Co Ltd 多層配線基板
JP2007012787A (ja) * 2005-06-29 2007-01-18 Mitsubishi Chemicals Corp パターン形成方法、電子部材および光学部材
JP2011053421A (ja) * 2009-09-01 2011-03-17 Taiyo Holdings Co Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8074350B2 (en) * 2007-12-11 2011-12-13 Palo Also Research Center Incorporated Method of printing electronic circuits
JP2009277838A (ja) 2008-05-14 2009-11-26 Fujitsu Microelectronics Ltd 半導体装置の製造方法、基板トレイ、及び基板収納装置
KR101109230B1 (ko) * 2009-10-20 2012-01-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5230578B2 (ja) * 2009-10-28 2013-07-10 京セラ株式会社 電子部品搭載用基板
JP2011199179A (ja) 2010-03-23 2011-10-06 Ngk Spark Plug Co Ltd はんだバンプを有する配線基板の製造方法
WO2013130145A2 (en) * 2011-11-30 2013-09-06 The Regents Of The University Of California Printed biofuel cells
TWI492111B (zh) * 2012-10-02 2015-07-11 傑聖科技股份有限公司 觸控面板及其製造方法
JP5886503B2 (ja) * 2013-01-11 2016-03-16 太陽誘電株式会社 積層セラミックコンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152109A (ja) * 1992-11-02 1994-05-31 Matsushita Electric Ind Co Ltd プリント基板およびその製造方法
JP2004022713A (ja) * 2002-06-14 2004-01-22 Dainippon Printing Co Ltd 多層配線基板
JP2007012787A (ja) * 2005-06-29 2007-01-18 Mitsubishi Chemicals Corp パターン形成方法、電子部材および光学部材
JP2011053421A (ja) * 2009-09-01 2011-03-17 Taiyo Holdings Co Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185675A (ja) * 2014-03-24 2015-10-22 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法及び基板を製造する方法

Also Published As

Publication number Publication date
US20150250051A1 (en) 2015-09-03
US9538668B2 (en) 2017-01-03

Similar Documents

Publication Publication Date Title
JP5510795B2 (ja) 電子部品の実装構造、電子部品の実装方法、並びに電子部品実装用基板
JP3056192B1 (ja) 電極パッド上にバンプを形成したソルダーレジスト層付実装基板の製造方法
JP4880006B2 (ja) 流れ防止用ダムを備えたプリント基板の製造方法
JP2861965B2 (ja) 突起電極の形成方法
US8033016B2 (en) Method for manufacturing an electrode and electrode component mounted body
KR101940237B1 (ko) 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
JP2015181142A (ja) 配線基板及びその製造方法、絶縁層の表面改質方法
JP4617978B2 (ja) 配線基板の製造方法
KR20120004423A (ko) 반도체 소자용 기판의 제조 방법 및 반도체 장치
TWI748418B (zh) 異向性導電膜
JP3871634B2 (ja) Ｃｏｆ半導体装置の製造方法
JP4729963B2 (ja) 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法
KR20130063984A (ko) 배선기판 및 그 제조방법
US6946601B1 (en) Electronic package with passive components
JP2022542011A (ja) 導電粒子の隔離距離が制御された異方性導電接着フィルムの製造方法
CN101835347A (zh) 印刷电路板装配体及其制造方法
TW202330281A (zh) 含填料膜
KR101069980B1 (ko) 솔더 범프 형성 방법
KR20110013902A (ko) 패키지 및 그 제조방법
JP2005011921A (ja) 電子装置、プリント基板、印刷マスクおよび電子装置の製造方法
JP2928755B2 (ja) 電子部品の製造方法
JP2022544451A (ja) 異方性導電接着フィルムの製造方法
CN103369823B (zh) 印刷电路板及其制造方法
JP2000174066A (ja) 半導体装置の実装方法
TW200919649A (en) Semiconductor device and method for manufacturing the same using anisotropic conductive film

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170125

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170125

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171030

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171205

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180605