JP2015173222A - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP2015173222A JP2015173222A JP2014049183A JP2014049183A JP2015173222A JP 2015173222 A JP2015173222 A JP 2015173222A JP 2014049183 A JP2014049183 A JP 2014049183A JP 2014049183 A JP2014049183 A JP 2014049183A JP 2015173222 A JP2015173222 A JP 2015173222A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 219
- 239000000758 substrate Substances 0.000 claims abstract description 46
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- 230000004048 modification Effects 0.000 description 21
- 238000012986 modification Methods 0.000 description 21
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 6
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- 229910052709 silver Inorganic materials 0.000 description 4
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- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 238000005530 etching Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
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- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
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- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
- F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
- F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
- F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Abstract
Description
11 搭載基板
12 p側配線(第1の配線、個別配線)
13 n側配線(第2の配線、共通配線)
20、20A、20B、20C、30、40 半導体発光素子
21 半導体構造層
22 p型半導体層(第1の半導体層)
23 発光層
24 n型半導体層(第2の半導体層)
25 p電極(第1の電極)
26 n電極(第2の電極)
20S、40S 側面
RC 遮光膜
PL 蛍光体層
PL1 第1の蛍光体層
PL2 第の蛍光体層
Claims (6)
- 搭載基板と、
前記搭載基板上にアレイ状に並置された複数の半導体発光素子と、
隣接する前記複数の半導体発光素子間において互いに対向する一方の半導体発光素子の側面及び他方の半導体発光素子の側面からなる側面対のうち、いずれか一方の側面を覆うように形成された遮光膜と、を有することを特徴とする半導体発光装置。 - 前記複数の半導体発光素子の各々は、
前記搭載基板上に、第1の導電型を有する第1の半導体層、発光層及び前記第1の導電型とは反対導電型の第2の導電型を有する第2の半導体層がこの順で順次積層された構造を有する半導体構造層を有し、
前記搭載基板上には、各々が前記第1の半導体層の各々に接続され、互いに電気的に分離された個別配線と、前記前記第2の半導体層の各々に接続された共通配線とが設けられていることを特徴とする請求項1に記載の半導体発光装置。 - 前記遮光膜は導電性を有し、
前記共通配線は、前記遮光膜を介して前記第2の半導体層に接続されていることを特徴とする請求項2に記載の半導体発光装置。 - 前記半導体発光素子は、その隣接する前記半導体発光素子に対向する側面が、隣接する前記半導体発光素子間の距離が前記搭載基板に向かって小さくなるように傾斜していることを特徴とする請求項1乃至3のいずれか1つに記載の半導体発光装置。
- 前記半導体発光素子は、その隣接する前記半導体発光素子に対向する側面が、隣接する前記半導体発光素子間の距離が前記搭載基板に向かって大きくなるように傾斜していることを特徴とする請求項1乃至3のいずれか1つに記載の半導体発光装置。
- 前記搭載基板上に前記複数の半導体発光素子の各々を埋設するように形成された蛍光体層を含み、
前記蛍光体層は、前記複数の半導体発光素子の隣接する前記半導体発光素子間に形成され、第1の蛍光体を含む第1の蛍光体層と、前記複数の半導体発光素子上及び前記第1の蛍光体層上に形成され、前記第1の蛍光体とは異なる第2の蛍光体を含む第2の蛍光体層と、を有することを特徴とする請求項1乃至5のいずれか1つに記載の半導体発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014049183A JP6282493B2 (ja) | 2014-03-12 | 2014-03-12 | 半導体発光装置 |
US14/645,316 US9599305B2 (en) | 2014-03-12 | 2015-03-11 | Semiconductor light-emitting device having matrix-arranged light-emitting elements |
Applications Claiming Priority (1)
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JP2014049183A JP6282493B2 (ja) | 2014-03-12 | 2014-03-12 | 半導体発光装置 |
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Publication Number | Publication Date |
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JP2015173222A true JP2015173222A (ja) | 2015-10-01 |
JP6282493B2 JP6282493B2 (ja) | 2018-02-21 |
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JP2014049183A Active JP6282493B2 (ja) | 2014-03-12 | 2014-03-12 | 半導体発光装置 |
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JP (1) | JP6282493B2 (ja) |
Cited By (6)
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WO2019045505A1 (ko) * | 2017-08-31 | 2019-03-07 | 엘지이노텍 주식회사 | 반도체 소자 및 이를 포함하는 헤드 램프 |
KR20190089389A (ko) * | 2018-01-22 | 2019-07-31 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
WO2019194618A1 (ko) * | 2018-04-05 | 2019-10-10 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
KR20190124961A (ko) * | 2018-04-27 | 2019-11-06 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
KR20200038488A (ko) * | 2017-08-03 | 2020-04-13 | 크리,인코포레이티드 | 고밀도 픽셀화된 led 칩 및 칩 어레이 장치, 그리고 그 제조 방법 |
US11682751B2 (en) | 2018-01-22 | 2023-06-20 | Suzhou Lekin Semiconductor Co., Ltd. | Display apparatus |
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US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
JP6537891B2 (ja) * | 2015-05-25 | 2019-07-03 | スタンレー電気株式会社 | 発光装置及びその製造方法 |
US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
US10886437B2 (en) * | 2016-11-03 | 2021-01-05 | Lumileds Llc | Devices and structures bonded by inorganic coating |
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CN111164753B (zh) * | 2017-08-31 | 2024-03-19 | 苏州立琻半导体有限公司 | 半导体装置及包括该半导体装置的前照灯 |
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US20150262978A1 (en) | 2015-09-17 |
US9599305B2 (en) | 2017-03-21 |
JP6282493B2 (ja) | 2018-02-21 |
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