JP2015153806A - 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 - Google Patents
配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 Download PDFInfo
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- JP2015153806A JP2015153806A JP2014024149A JP2014024149A JP2015153806A JP 2015153806 A JP2015153806 A JP 2015153806A JP 2014024149 A JP2014024149 A JP 2014024149A JP 2014024149 A JP2014024149 A JP 2014024149A JP 2015153806 A JP2015153806 A JP 2015153806A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 56
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- 239000000758 substrate Substances 0.000 claims abstract description 237
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- 239000000956 alloy Substances 0.000 claims abstract description 25
- 238000010304 firing Methods 0.000 claims abstract description 25
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- 230000008569 process Effects 0.000 claims description 23
- 239000010936 titanium Substances 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 18
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- 229910052719 titanium Inorganic materials 0.000 claims description 13
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- 230000002093 peripheral effect Effects 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
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- 239000002245 particle Substances 0.000 abstract description 62
- 239000007769 metal material Substances 0.000 abstract description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 2
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- 239000011230 binding agent Substances 0.000 description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 238000005245 sintering Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
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- 229910052721 tungsten Inorganic materials 0.000 description 10
- 239000010937 tungsten Substances 0.000 description 10
- 239000011651 chromium Substances 0.000 description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
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- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 3
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- 229910052786 argon Inorganic materials 0.000 description 2
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- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
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- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
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- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 238000005121 nitriding Methods 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
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- 239000003870 refractory metal Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024149A JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024149A JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015153806A true JP2015153806A (ja) | 2015-08-24 |
| JP2015153806A5 JP2015153806A5 (enExample) | 2017-02-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014024149A Withdrawn JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015153806A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018093006A (ja) * | 2016-11-30 | 2018-06-14 | Koa株式会社 | セラミック配線基板 |
| WO2024203649A1 (ja) * | 2023-03-31 | 2024-10-03 | 日亜化学工業株式会社 | 焼結体基板、発光装置及びそれらの製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0191320U (enExample) * | 1987-12-09 | 1989-06-15 | ||
| JPH05198700A (ja) * | 1992-01-23 | 1993-08-06 | Fujitsu Ltd | セラミック基板およびその製造方法 |
| JPH07509435A (ja) * | 1992-08-04 | 1995-10-19 | ザ・モーガン・クルーシブル・カンパニー・ピーエルシー | シールされた導電性活性合金フィードスルー |
| JP2001068808A (ja) * | 1999-08-24 | 2001-03-16 | Kyocera Corp | セラミック回路基板 |
| JP2011199275A (ja) * | 2010-02-24 | 2011-10-06 | Kyocera Corp | セラミック回路基板およびそれを用いた電子装置 |
-
2014
- 2014-02-12 JP JP2014024149A patent/JP2015153806A/ja not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0191320U (enExample) * | 1987-12-09 | 1989-06-15 | ||
| JPH05198700A (ja) * | 1992-01-23 | 1993-08-06 | Fujitsu Ltd | セラミック基板およびその製造方法 |
| JPH07509435A (ja) * | 1992-08-04 | 1995-10-19 | ザ・モーガン・クルーシブル・カンパニー・ピーエルシー | シールされた導電性活性合金フィードスルー |
| JP2001068808A (ja) * | 1999-08-24 | 2001-03-16 | Kyocera Corp | セラミック回路基板 |
| JP2011199275A (ja) * | 2010-02-24 | 2011-10-06 | Kyocera Corp | セラミック回路基板およびそれを用いた電子装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018093006A (ja) * | 2016-11-30 | 2018-06-14 | Koa株式会社 | セラミック配線基板 |
| WO2024203649A1 (ja) * | 2023-03-31 | 2024-10-03 | 日亜化学工業株式会社 | 焼結体基板、発光装置及びそれらの製造方法 |
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