JP2015153806A5 - - Google Patents
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- Publication number
- JP2015153806A5 JP2015153806A5 JP2014024149A JP2014024149A JP2015153806A5 JP 2015153806 A5 JP2015153806 A5 JP 2015153806A5 JP 2014024149 A JP2014024149 A JP 2014024149A JP 2014024149 A JP2014024149 A JP 2014024149A JP 2015153806 A5 JP2015153806 A5 JP 2015153806A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- wiring board
- manufacturing
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 claims 25
- 239000002184 metal Substances 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 239000000919 ceramic Substances 0.000 claims 6
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 230000000737 periodic effect Effects 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024149A JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024149A JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015153806A JP2015153806A (ja) | 2015-08-24 |
| JP2015153806A5 true JP2015153806A5 (enExample) | 2017-02-09 |
Family
ID=53895798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014024149A Withdrawn JP2015153806A (ja) | 2014-02-12 | 2014-02-12 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015153806A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6869016B2 (ja) * | 2016-11-30 | 2021-05-12 | Koa株式会社 | セラミック配線基板 |
| WO2024203649A1 (ja) * | 2023-03-31 | 2024-10-03 | 日亜化学工業株式会社 | 焼結体基板、発光装置及びそれらの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0619211Y2 (ja) * | 1987-12-09 | 1994-05-18 | 東洋通信機株式会社 | 表面実装用電子部品の電極構造 |
| JPH05198700A (ja) * | 1992-01-23 | 1993-08-06 | Fujitsu Ltd | セラミック基板およびその製造方法 |
| US5368220A (en) * | 1992-08-04 | 1994-11-29 | Morgan Crucible Company Plc | Sealed conductive active alloy feedthroughs |
| JP4331830B2 (ja) * | 1999-08-24 | 2009-09-16 | 京セラ株式会社 | セラミック回路基板 |
| JP5780777B2 (ja) * | 2010-02-24 | 2015-09-16 | 京セラ株式会社 | セラミック回路基板およびそれを用いた電子装置 |
-
2014
- 2014-02-12 JP JP2014024149A patent/JP2015153806A/ja not_active Withdrawn
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