JP2015138874A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP2015138874A JP2015138874A JP2014009403A JP2014009403A JP2015138874A JP 2015138874 A JP2015138874 A JP 2015138874A JP 2014009403 A JP2014009403 A JP 2014009403A JP 2014009403 A JP2014009403 A JP 2014009403A JP 2015138874 A JP2015138874 A JP 2015138874A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 668
- 238000004519 manufacturing process Methods 0.000 title claims description 117
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 321
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 319
- 239000011347 resin Substances 0.000 claims abstract description 307
- 229920005989 resin Polymers 0.000 claims abstract description 307
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 195
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 195
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000000034 method Methods 0.000 claims description 291
- 230000008569 process Effects 0.000 claims description 195
- 238000012360 testing method Methods 0.000 claims description 117
- 239000004020 conductor Substances 0.000 claims description 79
- 238000005530 etching Methods 0.000 claims description 56
- 238000010438 heat treatment Methods 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000000523 sample Substances 0.000 claims description 27
- 238000005229 chemical vapour deposition Methods 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 174
- 239000011229 interlayer Substances 0.000 description 94
- 239000010949 copper Substances 0.000 description 76
- 230000001681 protective effect Effects 0.000 description 67
- 230000005540 biological transmission Effects 0.000 description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 60
- 229910052802 copper Inorganic materials 0.000 description 60
- 229910052782 aluminium Inorganic materials 0.000 description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 58
- 230000015572 biosynthetic process Effects 0.000 description 54
- 230000002093 peripheral effect Effects 0.000 description 37
- 230000004888 barrier function Effects 0.000 description 35
- 229920001721 polyimide Polymers 0.000 description 30
- 238000007789 sealing Methods 0.000 description 28
- 239000000463 material Substances 0.000 description 26
- 229920002120 photoresistant polymer Polymers 0.000 description 23
- 239000010953 base metal Substances 0.000 description 21
- 238000000206 photolithography Methods 0.000 description 21
- 239000010931 gold Substances 0.000 description 19
- 230000001965 increasing effect Effects 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 18
- 239000010703 silicon Substances 0.000 description 18
- 230000004907 flux Effects 0.000 description 17
- 238000007363 ring formation reaction Methods 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000011161 development Methods 0.000 description 14
- 230000018109 developmental process Effects 0.000 description 14
- 230000006870 function Effects 0.000 description 13
- 238000000059 patterning Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 239000011651 chromium Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 229910052719 titanium Inorganic materials 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 7
- 229910021332 silicide Inorganic materials 0.000 description 7
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 238000011049 filling Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000008186 active pharmaceutical agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005674 electromagnetic induction Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0233—Structure of the redistribution layers
- H01L2224/02331—Multilayer structure
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0235—Shape of the redistribution layers
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
- H01L2224/0346—Plating
- H01L2224/03462—Electroplating
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Abstract
【解決手段】半導体基板SB上に第1絶縁膜を介してコイルCL1が形成され、第1絶縁膜およびコイルCL1を覆うように第2絶縁膜が形成され、第2絶縁膜上にパッドPD1が形成されている。第2絶縁膜上には、パッドPD1の一部を露出する開口部OP1を有する積層膜LFが形成され、前記積層絶縁膜上にコイルCL2が形成されている。コイルCL2はコイルCL1の上方に配置され、コイルCL2とコイルCL1とは磁気的に結合されている。積層膜LFは、酸化シリコン膜LF1と、その上の窒化シリコン膜LF2と、その上の樹脂膜LF3とからなる。
【選択図】図3
Description
<回路構成について>
図1は、一実施の形態の半導体装置(半導体チップ)を用いた電子装置(半導体装置)の一例を示す回路図である。なお、図1において、点線で囲まれた部分が、半導体チップCP1内に形成され、一点鎖線で囲まれた部分が半導体チップCP2内に形成され、二点鎖線で囲まれた部分が半導体パッケージPKG内に形成されている。
図2は、信号の伝送例を示す説明図である。
図3は、本実施の形態の半導体装置の断面構造を示す要部断面図である。図3に示される半導体装置は、上記半導体チップCP1または上記半導体チップCP2に対応する半導体装置(半導体チップ)である。また、図4は、本実施の形態の半導体装置の要部断面図であるが、周辺回路形成領域1Aの層間絶縁膜IL2よりも上層の構造を示す断面図が示されている。また、図5は、パッドPD1の平面図であるが、理解を簡単にするために、酸化シリコン膜LF1の開口部OP1aの位置を一点鎖線で示し、窒化シリコン膜LF2の開口部OP1bの位置を点線で示し、樹脂膜LF3の開口部OP1cの位置を二点鎖線で示している。また、図6は、パッドPD1の下層を示す平面図であり、理解を簡単にするために、パッドPD1の外周位置を点線で示してある。図7は、本実施の形態の半導体装置の要部断面図であるが、半導体装置の外周部近傍の断面図が示されている。図8は、本実施の形態の半導体装置の全体平面図であり、シールリングSRが形成されている位置を透視して示してある。
次に、本実施の形態の半導体装置の製造工程について説明する。以下の製造工程により、上記図3〜図8の半導体装置が製造される。
本実施の形態では、半導体装置(半導体チップ)は、半導体基板SB上に第1絶縁膜(ここでは層間絶縁膜IL1,IL2)を介して形成されたコイルCL1と、半導体基板SB上に第1絶縁膜およびコイルCL1を覆うように形成された第2絶縁膜(ここでは層間絶縁膜IL3)と、第2絶縁膜上に形成されかつコイルCL1とは平面視で重ならない位置に配置されたパッドPD1とを有している。更に、第2絶縁膜上に形成された積層膜LFであって、パッドPD1を露出する開口部OP1を有する積層膜LFと、積層膜LF上に形成されかつコイルCL1の上方に配置されたコイルCL2と、開口部OP1から露出されたパッドPD1上を含む積層膜LF上に形成されかつパッドPD1と電気的に接続された再配線RW(第1配線)とを有している。コイルCL1とコイルCL2とは、導体では接続されずに磁気的に結合されている。
次に、本実施の形態の半導体装置の製造上のその他の工夫点(第1〜第4の工夫点)について説明する。
まず、第1の工夫点について説明する。第1の工夫点は、樹脂膜LF3に関連するものである。
次に、第2の工夫点について説明する。
次に、第3の工夫点について説明する。
次に、第4の工夫点について説明する。
次に、半導体チップCP1内に形成されたトランスTR1を構成するコイルの構成について説明する。
次に、半導体チップ内に形成されたトランスを構成するコイルの構成の変形例について説明する。図88および図89は、半導体チップCP1(または半導体チップCP2)の変形例の要部平面図であり、上記トランス形成領域1Bに形成されたコイルの平面図が示されている。図88は、上記図84に相当する図であり、半導体チップCP1(または半導体チップCP2)に形成されたトランスの二次側のコイル(コイルCL5,CL6)が示され、図89は上記図85に相当する図であり、そのトランスの一次側のコイル(コイルCL7,CL8)が示されている。また、一次側のコイル(CL7,CL8)とその引き出し用の配線(引出配線HW1,HW2)との相対的な位置関係が分かりやすいように、図89では引出配線HW1,HW2を点線で示してある。
次に、本実施の形態の半導体パッケージの構成例について説明する。なお、半導体パッケージは半導体装置とみなすこともできる。
図94は、本実施の形態2の半導体装置の断面構造を示す要部断面図であり、上記実施の形態1の上記図3に相当するものである。
1B トランス形成領域
1C シールリング形成領域
1D スクライブ領域
4,4a,4b,5,5a,5b 開口部(溝)
11a HDP酸化膜
11b PTEOS膜
ALM アルミニウム膜
BW,BW8,BW9 ボンディングワイヤ
BR1,BR2 バリア導体膜
CC 制御回路
CD1,CD2 導電膜
CF 銅膜
CL1,CL1a,CL1b,CL2,CL2a,CL2b コイル
CL5,CL6,CL7,CL8 コイル
CP1,CP2 半導体チップ
CW5,CW6,CW7,CW8 コイル配線
DB ダイボンド材
DP1,DP2 ダイパッド
DR 駆動回路
DS 段差部
FM1,FM2 フォトマスク
G1,G2 ゲート電極
GF ゲート絶縁膜
HM1,HM2 平坦面
HW1,HW2,HW3a 引出配線
HW3 接続配線
JT 上面端部
K1,K2 境界
KD 端部(角部)
KM1,KM2 傾斜面
IL1,IL2,IL3 層間絶縁膜
LD リード
LF 積層膜
LF1 酸化シリコン膜
LF1a 酸化シリコン膜部分
LF2 窒化シリコン膜
LF3 樹脂膜
LOD 負荷
M1,M2,M3 配線
M1a,M2a,M3a 配線(シールリング用の配線)
MR 封止樹脂部
NS n型半導体領域
NW n型ウエル
OP1,OP1a,OP1b,OP1c,OP2,OP3,OPTa 開口部
PA 保護膜
PD1,PD2,PD3,PD5,PD5a,PD5b パッド
PD6,PD6a,PD6b,PD7,PD7a,PD7b パッド
PD8,PD9,PD10,PD11 パッド
PDT パッド(テスト用のパッド)
PKG 半導体パッケージ
PS p型半導体領域
PW p型ウエル
RG1 領域
RP1,RP2,RP3,RP4,RP5 レジストパターン(フォトレジストパターン)
RP1a,RP1b 開口部
RP4a レジスト膜(フォトレジスト膜)
RW 再配線
RX1,RX2 受信回路
SB 半導体基板
SE シード膜
SG1,SG2,SG3,SG4 信号
SR シールリング
ST 素子分離領域
SW,SW2 側壁
TB1 凸部
TB2 突起部
TE 側面
TE1 端部
TR1,TR2 トランス
TX1,TX2 送信回路
UM 下地金属膜
V1 プラグ
V1a プラグ(シールリング用のプラグ)
V2,V3 ビア部
V2a,V3a ビア部(シールリング用のビア部)
Claims (18)
- (a)半導体基板上に第1絶縁膜を形成する工程、
(b)前記第1絶縁膜上に第1コイルを形成する工程、
(c)前記第1絶縁膜上に、前記第1コイルを覆うように、第2絶縁膜を形成する工程、
(d)前記第2絶縁膜上に、前記第1コイルとは平面視で重ならない位置に、第1パッドを形成し、スクライブ領域における前記第2絶縁膜上に、テスト用パッドを形成する工程、
(e)前記第1絶縁膜上に、前記第1パッドを露出する第1開口部を有する積層絶縁膜を形成する工程、
(f)前記テスト用パッドを用いてプローブテストを行う工程、
(g)前記(e)工程後、前記積層絶縁膜上に、第2コイルと第1配線を形成する工程、
を有し、
前記第2コイルは、前記第1コイルの上方に配置され、
前記第1コイルと前記第2コイルとは、導体では接続されずに磁気的に結合され、
前記第1配線は、前記第1パッド上から前記積層絶縁膜上にわたって形成され、かつ、前記第1パッドと電気的に接続され、
前記積層絶縁膜は、酸化シリコン膜と、前記酸化シリコン膜上の窒化シリコン膜と、前記窒化シリコン膜上の樹脂膜とからなり、
前記(e)工程は、
(e1)前記第1絶縁膜上に、前記第1パッドおよび前記テスト用パッドを覆うように、前記酸化シリコン膜を形成する工程、
(e2)前記酸化シリコン膜上に第1レジストパターンを形成する工程、
(e3)前記第1レジストパターンをエッチングマスクとして用いて前記酸化シリコン膜をエッチングすることにより、前記酸化シリコン膜に、前記第1パッドを露出する第2開口部と前記テスト用パッドを露出する第3開口部とを形成する工程、
(e4)前記(e3)工程後、前記第1レジストパターンを除去する工程、
(e5)前記(e4)工程後、前記酸化シリコン膜上に、前記第1パッドおよび前記テスト用パッドを覆うように、前記窒化シリコン膜を形成する工程、
(e6)前記窒化シリコン膜上に第2レジストパターンを形成する工程、
(e7)前記第2レジストパターンをエッチングマスクとして用いて前記窒化シリコン膜をエッチングすることにより、前記窒化シリコン膜に、前記第1パッドを露出する第4開口部を形成し、かつ、前記スクライブ領域の前記窒化シリコン膜を除去する工程、
(e8)前記(e7)工程後、前記第2レジストパターンを除去する工程、
(e9)前記(e8)工程後、前記窒化シリコン膜上に、前記第1パッドおよび前記テスト用パッドを覆うように、前記樹脂膜を形成する工程、
(e10)前記(e9)工程後、前記樹脂膜に、前記第1パッドを露出する第5開口部を形成し、かつ、前記スクライブ領域の前記樹脂膜を除去する工程、
を有する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(e1)工程で形成された前記酸化シリコン膜の厚みは、前記テスト用パッドの厚みよりも大きい、半導体装置の製造方法。 - 請求項2記載の半導体装置の製造方法において、
前記(e1)工程では、HDP−CVD法により、前記酸化シリコン膜が形成される、半導体装置の製造方法。 - 請求項2記載の半導体装置の製造方法において、
前記(e1)工程で形成された前記酸化シリコン膜は、HDP−CVD法により形成された第1酸化シリコン膜と、前記第1酸化シリコン膜上にプラズマCVD法により形成された第2酸化シリコン膜との積層膜からなる、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(e2)工程で形成された前記第1レジストパターンは、前記第2開口部を形成するための第6開口部と、前記第3開口部を形成するための第7開口部とを有し、前記第1レジストパターンの前記第7開口部の内壁は、前記テスト用パッド上の前記酸化シリコン膜の平坦面上に位置している、半導体装置の製造方法。 - 請求項5記載の半導体装置の製造方法において、
前記(e1)工程で形成された前記酸化シリコン膜は、HDP酸化膜からなるか、あるいは、HDP酸化膜を含む積層膜からなる、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(e7)工程では、前記スクライブ領域の前記窒化シリコン膜上には、前記第2レジストパターンは形成されていない、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(g)工程後に、
(h)前記スクライブ領域で前記半導体基板を切断する工程、
を更に有する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第1配線と前記第2コイルとは、導体では繋がっておらず、
前記(g)工程では、前記積層絶縁膜上に、前記第1配線が接続された第2パッドと、前記第2コイルが接続された第3パッドも形成される、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第4開口部は、平面視で前記第2開口部に内包され、
前記(e7)工程で前記第3開口部が形成された前記窒化シリコン膜は、前記酸化シリコン膜の前記第2開口部の内壁を覆う、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(d)工程では、前記第1パッドと同層に、シールリング用の金属パターンも形成され、
前記(e9)工程で形成された前記樹脂膜は、感光性樹脂膜からなり、
前記(e10)工程は、
(e11)前記樹脂膜上に第3レジストパターンを形成する工程、
(e12)前記(e11)工程後、前記樹脂膜を露光する工程、
(e13)前記(e12)工程後、前記第3レジストパターンを除去する工程、
(e14)前記(e13)工程後、前記樹脂膜を現像処理して、前記樹脂膜に、前記第1パッドを露出する前記第5開口部を形成し、かつ、前記スクライブ領域の前記樹脂膜を除去する工程、
(e15)前記(e14)工程後、熱処理により前記樹脂膜を硬化させる工程、
を有し、
前記(e15)工程で熱処理により前記樹脂膜を硬化させた後の前記樹脂膜の外周を構成する側壁は、前記シールリング用の前記金属パターンよりも内側に位置する、半導体装置の製造方法。 - 請求項11記載の半導体装置の製造方法において、
前記(e5)で形成された前記窒化シリコン膜の表面には、前記金属パターンに起因した凸部が形成され、
前記(e14)工程で現像処理を行った段階の前記樹脂膜の外周を構成する前記側壁は、前記凸部より内側に位置する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(g)工程は、
(g1)前記第1開口部から露出する前記第1パッド上を含む前記積層絶縁膜上に、シード膜を形成する工程、
(g2)前記シード膜上にレジスト層を形成する工程、
(g3)前記レジスト層に第1露光処理を施す工程、
(g4)前記レジスト層に第2露光処理を施す工程、
(g5)前記(g3)および(g4)工程後、前記レジスト層を現像処理してレジストパターンを形成する工程、
(g6)前記レジストパターンから露出される前記シード膜上に、前記第2コイルおよび前記第1配線用の導電膜を電解メッキ法により形成する工程、
を含み、
前記第1露光処理では、前記第1配線のパターンが露光され、
前記第2露光処理では、前記第2コイルのパターンが露光され、
前記第1露光処理の露光量は、前記第2露光処理の露光量よりも大きい、半導体装置の製造方法。 - 請求項13記載の半導体装置の製造方法において、
前記第1露光処理では、g線とh線とi線との混線が用いられ、
前記第2露光処理では、i線の単線が用いられる、半導体装置の製造方法。 - (a)半導体基板上に第1絶縁膜を形成する工程、
(b)前記第1絶縁膜上に第1コイルを形成する工程、
(c)前記第1絶縁膜上に、前記第1コイルを覆うように、第2絶縁膜を形成する工程、
(d)前記第2絶縁膜上に、前記第1コイルとは平面視で重ならない位置に、第1パッドを形成する工程、
(e)前記第1絶縁膜上に、前記第1パッドを露出する第1開口部を有する第3絶縁膜を形成する工程、
(f)前記第3絶縁膜上に、第2コイルと第1配線を形成する工程、
を有し、
前記第2コイルは、前記第1コイルの上方に配置され、
前記第1コイルと前記第2コイルとは、導体では接続されずに磁気的に結合され、
前記第1配線は、前記第1パッド上から前記第3絶縁膜上にわたって形成され、かつ、前記第1パッドと電気的に接続され、
前記(f)工程は、
(f1)前記第1開口部から露出する前記第1パッド上を含む前記第3絶縁膜上に、シード膜を形成する工程、
(f2)前記シード膜上にレジスト層を形成する工程、
(f3)前記レジスト層に第1露光処理を施す工程、
(f4)前記レジスト層に第2露光処理を施す工程、
(f5)前記(f3)および(f4)工程後、前記レジスト層を現像処理してレジストパターンを形成する工程、
(f6)前記レジストパターンから露出される前記シード膜上に、前記第2コイルおよび前記第1配線用の導電膜を電解メッキ法により形成する工程、
を含み、
前記第1露光処理では、前記第1配線のパターンが露光され、
前記第2露光処理では、前記第2コイルのパターンが露光され、
前記第1露光処理の露光量は、前記第2露光処理の露光量よりも大きい、半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、
前記第1露光処理では、g線とh線とi線との混線が用いられ、
前記第2露光処理では、i線の単線が用いられる、半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、
前記第3絶縁膜は、酸化シリコン膜と、前記酸化シリコン膜上の窒化シリコン膜と、前記窒化シリコン膜上の樹脂膜との積層絶縁膜からなる、半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、
前記第1配線と前記第2コイルとは、導体では繋がっておらず、
前記(f)工程では、前記第3絶縁膜上に、前記第1配線が接続された第2パッドと、前記第2コイルが接続された第3パッドも形成される、半導体装置の製造方法。
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Also Published As
Publication number | Publication date |
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US9502489B2 (en) | 2016-11-22 |
US20150206934A1 (en) | 2015-07-23 |
EP2899750A3 (en) | 2015-10-14 |
EP2899750A2 (en) | 2015-07-29 |
JP6235353B2 (ja) | 2017-11-22 |
CN104795357B (zh) | 2019-03-19 |
CN104795357A (zh) | 2015-07-22 |
HK1212101A1 (en) | 2016-06-03 |
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