JP2018064059A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 117
- 239000011229 interlayer Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000010410 layer Substances 0.000 claims abstract description 37
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 34
- 230000001939 inductive effect Effects 0.000 claims description 18
- 238000010292 electrical insulation Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 7
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 7
- 230000002457 bidirectional effect Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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Abstract
【解決手段】半導体装置10は、SOI基板12、層間絶縁膜14、パッド部20、配線層16、及び、表面保護膜22を備えている。SOI基板12は、一面に形成された半導体素子30を有している。層間絶縁膜14は、SOI基板12の一面上に配置されている。配線層16は、層間絶縁膜14内に配置されている。硬質膜18は、層間絶縁膜14に対してSOI基板12と反対側に配置され、層間絶縁膜14よりも硬質にされている。パッド部20は、硬質膜18に対して層間絶縁膜14と反対側に配置されている。表面保護膜22は、少なくともパッド部20同士の対向領域Sbに配置されている。表面保護膜22は、シリコン窒化膜又はシリコン酸化膜とされている。
【選択図】図2
Description
一面に形成された半導体素子(30)を有する半導体基板(12)と、
半導体基板の一面上に配置された層間絶縁膜(14)と、
層間絶縁膜内に配置された配線層(16)と、
層間絶縁膜に対して半導体基板と反対側に配置され、層間絶縁膜よりも硬質な硬質膜(18)と、
硬質膜に対して層間絶縁膜と反対側に配置され、配線層を介して半導体素子と接続された外部接続用の複数のパッド部(20)と、
電気的な絶縁性を有し、少なくともパッド部同士の対向領域(Sb)に配置された表面保護膜(22)と、を備え、
表面保護膜は、シリコン窒化膜又はシリコン酸化膜とされている。
一面に形成された半導体素子(30)を有する半導体基板(12)と、
半導体基板の一面上に配置された層間絶縁膜(14)と、
層間絶縁膜内に配置された配線層(16)と、
層間絶縁膜に対して半導体基板と反対側に配置され、層間絶縁膜よりも硬質な硬質膜(18)と、
硬質膜に対して層間絶縁膜と反対側に配置され、配線層を介して半導体素子と接続された外部接続用の複数のパッド部(20)と、
電気的な絶縁性を有し、少なくともパッド部同士の対向領域(Sb)に配置された表面保護膜(22)と、を備え、
表面保護膜は、内側膜(22a)と、内側膜に対してパッド部と反対側に配置された外側膜(22b)と、を有し、
内側膜は、外側膜よりも硬質にされている。
先ず、図1〜図3に基づき、半導体装置10の概略構成について説明する。
本実施形態において、第1実施形態に示した半導体装置10と共通する部分についての説明は第1実施形態の説明を参照する。
以上、本発明の好ましい実施形態について説明したが、本発明は上記実施形態になんら制限されることなく、本発明の主旨を逸脱しない範囲において、種々変形して実施することが可能である。
Claims (5)
- 一面に形成された半導体素子(30)を有する半導体基板(12)と、
前記半導体基板の前記一面上に配置された層間絶縁膜(14)と、
前記層間絶縁膜内に配置された配線層(16)と、
前記層間絶縁膜に対して前記半導体基板と反対側に配置され、前記層間絶縁膜よりも硬質な硬質膜(18)と、
前記硬質膜に対して前記層間絶縁膜と反対側に配置され、前記配線層を介して前記半導体素子と接続された外部接続用の複数のパッド部(20)と、
電気的な絶縁性を有し、少なくとも前記パッド部同士の対向領域(Sb)に配置された表面保護膜(22)と、を備え、
前記表面保護膜は、シリコン窒化膜又はシリコン酸化膜とされている半導体装置。 - 一面に形成された半導体素子(30)を有する半導体基板(12)と、
前記半導体基板の前記一面上に配置された層間絶縁膜(14)と、
前記層間絶縁膜内に配置された配線層(16)と、
前記層間絶縁膜に対して前記半導体基板と反対側に配置され、前記層間絶縁膜よりも硬質な硬質膜(18)と、
前記硬質膜に対して前記層間絶縁膜と反対側に配置され、前記配線層を介して前記半導体素子と接続された外部接続用の複数のパッド部(20)と、
電気的な絶縁性を有し、少なくとも前記パッド部同士の対向領域(Sb)に配置された表面保護膜(22)と、を備え、
前記表面保護膜は、内側膜(22a)と、前記内側膜に対して前記パッド部と反対側に配置された外側膜(22b)と、を有し、
前記内側膜は、前記外側膜よりも硬質にされている半導体装置。 - 前記内側膜は、シリコン窒化膜又はシリコン酸化膜とされている請求項2に記載の半導体装置。
- 前記半導体基板の厚さ方向の投影視において、前記パッド部の前記表面保護膜から露出する領域は、前記半導体素子が形成された領域の少なくとも一部と重なっている請求項1〜3のいずれか1項に記載の半導体装置。
- 前記パッド部は、誘導負荷(100)と電気的に接続され、
前記半導体素子は、オンオフ動作することによって、前記誘導負荷に流れる電流を制御する請求項1〜4のいずれか1項に記載の半導体装置。
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PCT/JP2017/030227 WO2018070111A1 (ja) | 2016-10-14 | 2017-08-24 | 半導体装置 |
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JP2008091454A (ja) * | 2006-09-29 | 2008-04-17 | Rohm Co Ltd | 半導体装置及び半導体装置の製造方法 |
JP2008147786A (ja) * | 2006-12-06 | 2008-06-26 | Denso Corp | 絶縁ゲートトランジスタの駆動回路 |
JP2011216771A (ja) * | 2010-04-01 | 2011-10-27 | Rohm Co Ltd | 半導体装置およびその製造方法 |
JP2016115892A (ja) * | 2014-12-17 | 2016-06-23 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
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