JP2015128268A - 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法 - Google Patents

振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法 Download PDF

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Publication number
JP2015128268A
JP2015128268A JP2013273626A JP2013273626A JP2015128268A JP 2015128268 A JP2015128268 A JP 2015128268A JP 2013273626 A JP2013273626 A JP 2013273626A JP 2013273626 A JP2013273626 A JP 2013273626A JP 2015128268 A JP2015128268 A JP 2015128268A
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weight
vibration element
weight portion
vibrating arm
main surface
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Japanese (ja)
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JP2015128268A5 (https=
Inventor
明法 山田
Akinori Yamada
明法 山田
周平 吉田
Shuhei Yoshida
周平 吉田
高史 伊東
Takashi Ito
高史 伊東
啓史 中川
Hiroshi Nakagawa
啓史 中川
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2013273626A priority Critical patent/JP2015128268A/ja
Priority to CN201410806740.4A priority patent/CN104753494A/zh
Priority to US14/582,606 priority patent/US9255802B2/en
Publication of JP2015128268A publication Critical patent/JP2015128268A/ja
Publication of JP2015128268A5 publication Critical patent/JP2015128268A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0509—Holders or supports for bulk acoustic wave devices consisting of adhesive elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0414—Resonance frequency
    • H03H2003/0492—Resonance frequency during the manufacture of a tuning-fork
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H2009/02165—Tuning

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2013273626A 2013-12-27 2013-12-27 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法 Withdrawn JP2015128268A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013273626A JP2015128268A (ja) 2013-12-27 2013-12-27 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法
CN201410806740.4A CN104753494A (zh) 2013-12-27 2014-12-22 振动元件、振子、振荡器、电子设备、传感器及移动体
US14/582,606 US9255802B2 (en) 2013-12-27 2014-12-24 Resonator element, resonator, oscillator, electronic apparatus, physical quantity sensor, mobile object, and frequency adjustment method of resonator element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013273626A JP2015128268A (ja) 2013-12-27 2013-12-27 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法

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JP2015128268A true JP2015128268A (ja) 2015-07-09
JP2015128268A5 JP2015128268A5 (https=) 2017-02-16

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US (1) US9255802B2 (https=)
JP (1) JP2015128268A (https=)
CN (1) CN104753494A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150381143A1 (en) * 2014-06-30 2015-12-31 Seiko Epson Corporation Resonator element, method for manufacturing resonator element, resonator, gyro sensor, electronic apparatus, and moving object
JPWO2020085188A1 (ja) * 2018-10-24 2021-09-02 株式会社村田製作所 共振装置

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TWI634742B (zh) * 2013-11-16 2018-09-01 精工愛普生股份有限公司 振動片、振動子、振盪器、電子機器及移動體
US9887687B2 (en) 2015-01-28 2018-02-06 Analog Devices Global Method of trimming a component and a component trimmed by such a method
JP2019118073A (ja) * 2017-12-27 2019-07-18 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、電子機器および移動体
JP7079607B2 (ja) * 2018-01-16 2022-06-02 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片、圧電振動子、及び製造方法
JP7139610B2 (ja) * 2018-01-23 2022-09-21 セイコーエプソン株式会社 振動素子、振動素子の製造方法、物理量センサー、慣性計測装置、電子機器および移動体
JP2019176413A (ja) * 2018-03-29 2019-10-10 セイコーエプソン株式会社 振動素子の周波数調整方法、振動素子の製造方法、振動素子、物理量センサー、慣性計測装置、電子機器および移動体
JP2020101429A (ja) * 2018-12-21 2020-07-02 セイコーエプソン株式会社 振動素子、振動素子の製造方法、物理量センサー、慣性計測装置、電子機器および移動体
JP7528566B2 (ja) * 2020-06-30 2024-08-06 セイコーエプソン株式会社 振動素子の製造方法、振動素子および振動デバイス
JP7528565B2 (ja) * 2020-06-30 2024-08-06 セイコーエプソン株式会社 振動素子の製造方法、振動素子および振動デバイス
JP7689421B2 (ja) * 2020-11-30 2025-06-06 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片の製造方法
JP7587744B2 (ja) * 2021-01-26 2024-11-21 株式会社村田製作所 共振装置及びその製造方法
CN116762272A (zh) * 2021-02-25 2023-09-15 株式会社大真空 恒温槽型压电振荡器
JP7687073B2 (ja) * 2021-06-16 2025-06-03 セイコーエプソン株式会社 振動素子及び振動デバイス

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Publication number Priority date Publication date Assignee Title
US20150381143A1 (en) * 2014-06-30 2015-12-31 Seiko Epson Corporation Resonator element, method for manufacturing resonator element, resonator, gyro sensor, electronic apparatus, and moving object
US9793876B2 (en) * 2014-06-30 2017-10-17 Seiko Epson Corporation Resonator element, method for manufacturing resonator element, resonator, gyro sensor, electronic apparatus, and moving object
JPWO2020085188A1 (ja) * 2018-10-24 2021-09-02 株式会社村田製作所 共振装置
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Publication number Publication date
CN104753494A (zh) 2015-07-01
US20150188515A1 (en) 2015-07-02
US9255802B2 (en) 2016-02-09

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