JP7133134B2 - 共振装置 - Google Patents
共振装置 Download PDFInfo
- Publication number
- JP7133134B2 JP7133134B2 JP2020553283A JP2020553283A JP7133134B2 JP 7133134 B2 JP7133134 B2 JP 7133134B2 JP 2020553283 A JP2020553283 A JP 2020553283A JP 2020553283 A JP2020553283 A JP 2020553283A JP 7133134 B2 JP7133134 B2 JP 7133134B2
- Authority
- JP
- Japan
- Prior art keywords
- vibrating
- resonator
- substrate
- holding
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 4
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 description 103
- 239000010409 thin film Substances 0.000 description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- 229910052814 silicon oxide Inorganic materials 0.000 description 25
- 238000005530 etching Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 238000010884 ion-beam technique Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- -1 scandium aluminum Chemical compound 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000019687 Lamb Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
- H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02322—Material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H2009/155—Constructional features of resonators consisting of piezoelectric or electrostrictive material using MEMS techniques
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
まず、図1及び図2を参照しつつ、本発明の第1実施形態に係る共振装置の概略構成について説明する。図1は、本発明の第1実施形態に係る共振装置1の外観を概略的に示す斜視図である。図2は、図1に示した共振装置1の構造を概略的に示す分解斜視図である。
第2実施形態以降では第1の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。
Claims (9)
- 振動部と、前記振動部の周囲の少なくとも一部に配置され、前記振動部を振動可能に保持する保持体と該保持体の上に形成される絶縁膜とを含む保持部と、を含む共振子と、
前記振動部の振動空間の少なくとも一部を形成する凹部を含む第1基板であって、前記第1基板の上に前記共振子が積層された、第1基板と、を備え、
前記絶縁膜の内側面は、前記凹部を定める前記第1基板の材料で形成された側壁の内面よりも外側に第1距離を空けて配置される、
共振装置。 - 振動部と、前記振動部の周囲の少なくとも一部に配置され、前記振動部を振動可能に保持する保持体と該保持体の上に形成される絶縁膜とを含む保持部と、を含む共振子と、
前記振動部の振動空間の少なくとも一部を形成する凹部を含む第1基板であって、前記第1基板の上に前記共振子が積層された、第1基板と、を備え、
前記絶縁膜の内側面は、前記凹部を定める側壁の内面よりも外側に第1距離を空けて配置され、かつ、前記保持体の内側面から前記第1距離以上の第2距離を空けて配置される、
共振装置。 - 前記第1距離は、5μm以上50μm以下である、
請求項1又は2に記載の共振装置。 - 前記保持部は、前記共振子の主面を平面視したときに、枠形状を有する、
請求項1から3のいずれか一項に記載の共振装置。 - 前記振動部は、複数の振動腕を含み、
前記第1基板は、前記複数の振動腕のうちの隣り合う2つの間に配置され、前記凹部から突起する突起部を含む、
請求項1から4のいずれか一項に記載の共振装置。 - 前記振動部は、圧電膜を含み、
前記圧電膜は、ウルツ鉱型六方晶構造を有する圧電体を主成分とする、
請求項1から5のいずれか一項に記載の共振装置。 - 前記保持部は、圧電膜をさらに含み、
前記保持部の圧電膜と前記振動部の圧電膜とは、同一材料である、
請求項6に記載の共振装置。 - 前記振動部は、前記圧電膜を間に挟んで対向するように配置される第1電極及び第2電極をさらに含み、
前記第1電極及び前記第2電極の少なくとも一方は、体心立方構造を有する金属を主成分とする、
請求項6又は7に記載の共振装置。 - 前記共振子を間に挟んで前記第1基板と対向するように配置される第2基板をさらに備える、
請求項1から8のいずれか一項に記載の共振装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018200146 | 2018-10-24 | ||
JP2018200146 | 2018-10-24 | ||
PCT/JP2019/040867 WO2020085188A1 (ja) | 2018-10-24 | 2019-10-17 | 共振装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020085188A1 JPWO2020085188A1 (ja) | 2021-09-02 |
JP7133134B2 true JP7133134B2 (ja) | 2022-09-08 |
Family
ID=70330720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020553283A Active JP7133134B2 (ja) | 2018-10-24 | 2019-10-17 | 共振装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11909375B2 (ja) |
JP (1) | JP7133134B2 (ja) |
CN (1) | CN112740550B (ja) |
WO (1) | WO2020085188A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020049789A1 (ja) * | 2018-09-03 | 2020-03-12 | 株式会社村田製作所 | 共振子及びそれを備えた共振装置 |
JP7493709B2 (ja) | 2020-11-06 | 2024-06-03 | 株式会社村田製作所 | 共振装置及び共振装置製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006191356A (ja) | 2005-01-06 | 2006-07-20 | Toshiba Corp | 薄膜圧電共振器及び薄膜圧電共振器の製造方法 |
JP2007036915A (ja) | 2005-07-29 | 2007-02-08 | Doshisha | 高次モード薄膜共振器 |
JP2015128268A (ja) | 2013-12-27 | 2015-07-09 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法 |
WO2017212677A1 (ja) | 2016-06-08 | 2017-12-14 | 株式会社村田製作所 | 共振装置製造方法 |
WO2018008198A1 (ja) | 2016-07-05 | 2018-01-11 | 株式会社村田製作所 | 共振子及び共振装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7323805B2 (en) | 2004-01-28 | 2008-01-29 | Kabushiki Kaisha Toshiba | Piezoelectric thin film device and method for manufacturing the same |
JP5581931B2 (ja) | 2010-09-17 | 2014-09-03 | セイコーエプソン株式会社 | 振動片、振動片の製造方法、振動子、振動デバイスおよび電子機器 |
CN105556840B (zh) * | 2013-09-20 | 2019-01-04 | 株式会社村田制作所 | 振动装置及其制造方法 |
WO2016052260A1 (ja) * | 2014-09-29 | 2016-04-07 | 株式会社村田製作所 | 共振装置 |
CN107925394B (zh) * | 2015-09-21 | 2021-03-02 | 株式会社村田制作所 | 谐振子和谐振装置 |
CN107644902A (zh) * | 2016-07-22 | 2018-01-30 | 三垦电气株式会社 | 半导体装置 |
JP6822118B2 (ja) * | 2016-12-19 | 2021-01-27 | セイコーエプソン株式会社 | 振動子、発振器、電子機器、および移動体 |
-
2019
- 2019-10-17 JP JP2020553283A patent/JP7133134B2/ja active Active
- 2019-10-17 WO PCT/JP2019/040867 patent/WO2020085188A1/ja active Application Filing
- 2019-10-17 CN CN201980061641.9A patent/CN112740550B/zh active Active
-
2021
- 2021-03-09 US US17/195,856 patent/US11909375B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006191356A (ja) | 2005-01-06 | 2006-07-20 | Toshiba Corp | 薄膜圧電共振器及び薄膜圧電共振器の製造方法 |
JP2007036915A (ja) | 2005-07-29 | 2007-02-08 | Doshisha | 高次モード薄膜共振器 |
JP2015128268A (ja) | 2013-12-27 | 2015-07-09 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器、物理量センサー、移動体および振動素子の周波数調整方法 |
WO2017212677A1 (ja) | 2016-06-08 | 2017-12-14 | 株式会社村田製作所 | 共振装置製造方法 |
WO2018008198A1 (ja) | 2016-07-05 | 2018-01-11 | 株式会社村田製作所 | 共振子及び共振装置 |
Also Published As
Publication number | Publication date |
---|---|
US11909375B2 (en) | 2024-02-20 |
CN112740550B (zh) | 2024-03-22 |
CN112740550A (zh) | 2021-04-30 |
JPWO2020085188A1 (ja) | 2021-09-02 |
US20210194454A1 (en) | 2021-06-24 |
WO2020085188A1 (ja) | 2020-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6768206B2 (ja) | 共振子及び共振装置 | |
JP6742601B2 (ja) | 共振子及び共振装置 | |
US10879873B2 (en) | Resonator and resonance device | |
CN109075766B (zh) | 谐振器和谐振装置 | |
JP7133134B2 (ja) | 共振装置 | |
CN112534719B (zh) | 谐振装置 | |
US20220029598A1 (en) | Resonance device | |
US11405016B2 (en) | Resonator and resonance device | |
JP7001983B2 (ja) | 共振子及び共振装置 | |
WO2020067484A1 (ja) | 共振子及び共振装置 | |
CN111989863B (zh) | 谐振器以及谐振装置 | |
WO2022130676A1 (ja) | 共振子及び共振装置 | |
JP7482402B2 (ja) | 共振子及び共振装置 | |
CN110663176A (zh) | 谐振器以及谐振装置 | |
US11283423B2 (en) | Resonator and resonance device | |
JP6856127B2 (ja) | 共振子及び共振装置 | |
CN115176415A (zh) | 集合基板的制造方法以及集合基板 | |
CN115398802A (zh) | 谐振子以及谐振装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210316 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210316 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211029 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220304 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220502 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220728 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220810 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7133134 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |