JP2015090980A - 複合金属フィルムおよびこれを用いるプリント回路基板の回路パターン形成方法 - Google Patents

複合金属フィルムおよびこれを用いるプリント回路基板の回路パターン形成方法 Download PDF

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Publication number
JP2015090980A
JP2015090980A JP2014170373A JP2014170373A JP2015090980A JP 2015090980 A JP2015090980 A JP 2015090980A JP 2014170373 A JP2014170373 A JP 2014170373A JP 2014170373 A JP2014170373 A JP 2014170373A JP 2015090980 A JP2015090980 A JP 2015090980A
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JP
Japan
Prior art keywords
layer
metal film
nodule
circuit pattern
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014170373A
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English (en)
Japanese (ja)
Inventor
イ・ジェ・ソク
Jae Seok Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2015090980A publication Critical patent/JP2015090980A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
JP2014170373A 2013-11-04 2014-08-25 複合金属フィルムおよびこれを用いるプリント回路基板の回路パターン形成方法 Pending JP2015090980A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130132906A KR20150051440A (ko) 2013-11-04 2013-11-04 복합 금속 필름 및 이를 이용한 인쇄회로기판의 회로패턴 형성 방법
KR10-2013-0132906 2013-11-04

Publications (1)

Publication Number Publication Date
JP2015090980A true JP2015090980A (ja) 2015-05-11

Family

ID=53194347

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Application Number Title Priority Date Filing Date
JP2014170373A Pending JP2015090980A (ja) 2013-11-04 2014-08-25 複合金属フィルムおよびこれを用いるプリント回路基板の回路パターン形成方法

Country Status (2)

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JP (1) JP2015090980A (ko)
KR (1) KR20150051440A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017022807A1 (ja) * 2015-08-03 2017-02-09 Ｊｘ金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
WO2017051908A1 (ja) * 2015-09-25 2017-03-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2755058B2 (ja) * 1991-11-14 1998-05-20 日立化成工業株式会社 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法
JPH1187910A (ja) * 1997-09-09 1999-03-30 Ibiden Co Ltd プリント配線板およびその製造方法
JPH1187931A (ja) * 1997-09-11 1999-03-30 Ngk Spark Plug Co Ltd プリント配線板の製造方法
JP2001308477A (ja) * 2000-04-26 2001-11-02 Mitsui Mining & Smelting Co Ltd 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2755058B2 (ja) * 1991-11-14 1998-05-20 日立化成工業株式会社 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法
JPH1187910A (ja) * 1997-09-09 1999-03-30 Ibiden Co Ltd プリント配線板およびその製造方法
JPH1187931A (ja) * 1997-09-11 1999-03-30 Ngk Spark Plug Co Ltd プリント配線板の製造方法
JP2001308477A (ja) * 2000-04-26 2001-11-02 Mitsui Mining & Smelting Co Ltd 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017022807A1 (ja) * 2015-08-03 2017-02-09 Ｊｘ金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
WO2017051908A1 (ja) * 2015-09-25 2017-03-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP2017063114A (ja) * 2015-09-25 2017-03-30 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法

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Publication number Publication date
KR20150051440A (ko) 2015-05-13

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