JP2007235015A5 - - Google Patents
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- Publication number
- JP2007235015A5 JP2007235015A5 JP2006057407A JP2006057407A JP2007235015A5 JP 2007235015 A5 JP2007235015 A5 JP 2007235015A5 JP 2006057407 A JP2006057407 A JP 2006057407A JP 2006057407 A JP2006057407 A JP 2006057407A JP 2007235015 A5 JP2007235015 A5 JP 2007235015A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- layer
- insulating layer
- resin insulating
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 70
- 229920005989 resin Polymers 0.000 claims description 70
- 238000007747 plating Methods 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000007788 roughening Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 118
- 238000000034 method Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000005755 formation reaction Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000003449 preventive Effects 0.000 description 4
- 230000001681 protective Effects 0.000 description 4
- 230000002829 reduced Effects 0.000 description 4
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 210000004940 Nucleus Anatomy 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002452 interceptive Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- -1 or printing Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NPDODHDPVPPRDJ-UHFFFAOYSA-N permanganate Chemical compound [O-][Mn](=O)(=O)=O NPDODHDPVPPRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006057407A JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006057407A JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007235015A JP2007235015A (ja) | 2007-09-13 |
| JP2007235015A5 true JP2007235015A5 (ko) | 2009-04-16 |
Family
ID=38555265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006057407A Pending JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007235015A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140077441A (ko) | 2012-12-14 | 2014-06-24 | 타이코에이엠피(유) | 인쇄회로기판 및 그 제조방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3476264B2 (ja) * | 1993-12-24 | 2003-12-10 | 三井金属鉱業株式会社 | プリント回路内層用銅箔およびその製造方法 |
| JP4127442B2 (ja) * | 1999-02-22 | 2008-07-30 | イビデン株式会社 | 多層ビルドアップ配線板及びその製造方法 |
| JP4087369B2 (ja) * | 2003-11-11 | 2008-05-21 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔、およびプリント配線板 |
| JP2005150447A (ja) * | 2003-11-17 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 配線基板とその製造方法 |
-
2006
- 2006-03-03 JP JP2006057407A patent/JP2007235015A/ja active Pending
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