JP2015070056A5 - - Google Patents

Download PDF

Info

Publication number
JP2015070056A5
JP2015070056A5 JP2013201828A JP2013201828A JP2015070056A5 JP 2015070056 A5 JP2015070056 A5 JP 2015070056A5 JP 2013201828 A JP2013201828 A JP 2013201828A JP 2013201828 A JP2013201828 A JP 2013201828A JP 2015070056 A5 JP2015070056 A5 JP 2015070056A5
Authority
JP
Japan
Prior art keywords
case
lower case
side wall
electronic component
upper case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013201828A
Other languages
English (en)
Japanese (ja)
Other versions
JP6122372B2 (ja
JP2015070056A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013201828A priority Critical patent/JP6122372B2/ja
Priority claimed from JP2013201828A external-priority patent/JP6122372B2/ja
Priority to CN201410432760.XA priority patent/CN104519693B/zh
Priority to US14/477,156 priority patent/US9332659B2/en
Publication of JP2015070056A publication Critical patent/JP2015070056A/ja
Priority to US15/083,396 priority patent/US9933822B2/en
Publication of JP2015070056A5 publication Critical patent/JP2015070056A5/ja
Application granted granted Critical
Publication of JP6122372B2 publication Critical patent/JP6122372B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2013201828A 2013-09-27 2013-09-27 電子部品用ケース及び電子部品装置 Active JP6122372B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013201828A JP6122372B2 (ja) 2013-09-27 2013-09-27 電子部品用ケース及び電子部品装置
CN201410432760.XA CN104519693B (zh) 2013-09-27 2014-08-28 电子部件用壳体和电子部件装置
US14/477,156 US9332659B2 (en) 2013-09-27 2014-09-04 Electronic component case and electronic component device
US15/083,396 US9933822B2 (en) 2013-09-27 2016-03-29 Electronic component case and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013201828A JP6122372B2 (ja) 2013-09-27 2013-09-27 電子部品用ケース及び電子部品装置

Publications (3)

Publication Number Publication Date
JP2015070056A JP2015070056A (ja) 2015-04-13
JP2015070056A5 true JP2015070056A5 (enExample) 2016-08-04
JP6122372B2 JP6122372B2 (ja) 2017-04-26

Family

ID=52739941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013201828A Active JP6122372B2 (ja) 2013-09-27 2013-09-27 電子部品用ケース及び電子部品装置

Country Status (3)

Country Link
US (2) US9332659B2 (enExample)
JP (1) JP6122372B2 (enExample)
CN (1) CN104519693B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3352542A4 (en) * 2015-09-18 2019-05-08 Toray Industries, Inc. CASING
US10227808B2 (en) 2015-11-20 2019-03-12 Microsoft Technology Licensing, Llc Hinged device
CN108886879B (zh) * 2016-03-31 2020-11-24 索尼互动娱乐股份有限公司 电子设备
KR102406829B1 (ko) * 2016-04-20 2022-06-10 삼성전자주식회사 에스에스디 하우징 및 에스에스디 하우징 어셈블리
US10474203B2 (en) 2016-09-01 2019-11-12 Microsoft Technology Licensing, Llc Hinged device
US10364598B2 (en) 2016-09-02 2019-07-30 Microsoft Technology Licensing, Llc Hinged device
US10641318B2 (en) 2016-12-09 2020-05-05 Microsoft Technology Licensing, Llc Hinged device
US10241548B2 (en) 2016-12-09 2019-03-26 Microsoft Technology Licensing, Llc Computing device employing a self-spacing hinge assembly
US10253804B2 (en) * 2017-01-24 2019-04-09 Microsoft Technology Licensing, Llc Hinged device
US10296044B2 (en) 2017-06-08 2019-05-21 Microsoft Technology Licensing, Llc Hinged device
US10344510B2 (en) 2017-06-16 2019-07-09 Microsoft Technology Licensing, Llc Hinged device
CN107278075B (zh) * 2017-08-01 2022-10-18 浙江佳乐科仪股份有限公司 一种物联网用dtu盒
KR102530066B1 (ko) * 2017-12-08 2023-05-09 삼성전자주식회사 솔리드 스테이트 드라이브 장치
CN113618338B (zh) * 2018-02-05 2023-08-11 Oppo广东移动通信有限公司 中框组件、中框组件加工方法及电子装置
TWI651999B (zh) * 2018-03-08 2019-02-21 群光電能科技股份有限公司 固定結構及包括此固定結構的電子裝置
CN208113175U (zh) * 2018-05-03 2018-11-16 中磊电子(苏州)有限公司 便于组装/拆卸的卡合结构
KR102615769B1 (ko) * 2018-05-18 2023-12-20 삼성전자주식회사 메모리 장치
US10474206B1 (en) * 2018-08-13 2019-11-12 Baidu Usa Llc Retaining tray for retaining an M.2 compatible device used in autonomous driving vehicles
US10729030B1 (en) * 2018-08-28 2020-07-28 Facebook, Inc. Apparatuses, systems, and methods for integrating hardware accelerators into computing systems
US10346735B1 (en) * 2018-09-29 2019-07-09 Wen-Yi Lee Assembling buckle structure for memory circuit board
US11346524B2 (en) * 2018-10-11 2022-05-31 Nitto Denko Corporation Ventilation housing
US10349548B1 (en) * 2018-10-19 2019-07-09 Getac Technology Corporation Casing and electronic device using the same
CN208969557U (zh) * 2018-12-18 2019-06-11 京东方科技集团股份有限公司 显示面板、显示组件
CN111667852B (zh) * 2019-03-07 2021-11-30 上海宝存信息科技有限公司 固态存储装置
CN114067853B (zh) 2020-08-05 2024-04-12 美光科技公司 存储器装置、用于存储器装置的载体和相关计算系统和方法
US20240049402A1 (en) * 2022-08-02 2024-02-08 Abesta International Co., Ltd. Structural improvement for solid state discs

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668476A (en) * 1970-09-11 1972-06-06 Seeburg Corp Self-locking enclosure for electronic circuitry and method of assembling the same
US4346952A (en) * 1980-06-16 1982-08-31 Amp Incorporated Connector for a ceramic substrate
US5066235A (en) * 1989-07-21 1991-11-19 Nec Corporation Connector assembly for electronic devices
US5124888A (en) * 1990-01-25 1992-06-23 Tokyo Electric Co., Ltd. Electric circuit apparatus
US5144533A (en) * 1991-06-27 1992-09-01 Motorola, Inc. Self-locking housing assembly
US5383098A (en) * 1991-09-19 1995-01-17 Motorola, Inc. Shield assembly
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
US5477426A (en) * 1993-12-15 1995-12-19 Itt Corporation IC card with board positioning means
US5477421A (en) * 1993-11-18 1995-12-19 Itt Corporation Shielded IC card
US5563770A (en) * 1994-02-25 1996-10-08 Itt Corporation IC card with board positioning means
US5548483A (en) * 1995-01-24 1996-08-20 Elco Corporation Frameless IC card and housing therefor
CA2160854A1 (en) * 1995-10-18 1997-04-19 Robert L. Romerein Top exit coupler
JP2752946B2 (ja) * 1996-02-26 1998-05-18 埼玉日本電気株式会社 ケースとラックとの組立て構造
US6091605A (en) * 1996-04-26 2000-07-18 Ramey; Samuel C. Memory card connector and cover apparatus and method
US5848718A (en) * 1997-12-15 1998-12-15 Motorola, Inc. Apparatus for fastening a housing assembly
US5964513A (en) * 1998-05-28 1999-10-12 Intel Corporation Chassis for electronic components
US6111760A (en) * 1998-12-30 2000-08-29 Ericsson, Inc. Simple enclosure for electronic components
US7517231B2 (en) * 2004-11-16 2009-04-14 Super Talent Electronics, Inc. Solid state drive (SSD) with open top and bottom covers
US7301776B1 (en) * 2004-11-16 2007-11-27 Super Talent Electronics, Inc. Light-weight flash hard drive with plastic frame
JP2001320181A (ja) * 2000-05-09 2001-11-16 Sony Computer Entertainment Inc 電子機器
JP3807192B2 (ja) 2000-05-17 2006-08-09 セイコーエプソン株式会社 部品取付軸の製造方法
US6711859B2 (en) * 2001-06-01 2004-03-30 Michael Ray Bell System and method for fixing a first component with a second component
KR100471064B1 (ko) * 2002-06-11 2005-03-10 삼성전자주식회사 디스플레이장치
JP3861791B2 (ja) * 2002-10-11 2006-12-20 ソニー株式会社 緩衝材及びこれを用いた情報記憶装置
TW587731U (en) * 2002-11-29 2004-05-11 Hon Hai Prec Ind Co Ltd Mounting apparatus for data storage device
TW572220U (en) * 2003-01-08 2004-01-11 Hannstar Display Corp Liquid crystal display module and its fixing structure
TW557090U (en) * 2003-01-29 2003-10-01 Hon Hai Prec Ind Co Ltd Portable electronic device and fastener mudule of printed circuit board tehrfor
CN2636368Y (zh) * 2003-05-24 2004-08-25 鸿富锦精密工业(深圳)有限公司 光盘驱动器壳体
US6894891B2 (en) * 2003-06-30 2005-05-17 Lear Corporation Smart junction box for automobile
JP2005030847A (ja) * 2003-07-10 2005-02-03 Sysmex Corp 電子機器および分析システム
US7869218B2 (en) * 2004-11-16 2011-01-11 Super Talent Electronics, Inc. Light-weight solid state drive with rivet sets
CN2770278Y (zh) * 2005-01-07 2006-04-05 鸿富锦精密工业(深圳)有限公司 电子装置壳体
TWI335481B (en) * 2006-06-23 2011-01-01 Chimei Innolux Corp Liquid crystal display device
CN200947705Y (zh) * 2006-09-01 2007-09-12 中兴通讯股份有限公司 一种可快速拆装的无铰链盒体
US7688574B2 (en) * 2007-01-05 2010-03-30 Apple Inc. Cold worked metal housing for a portable electronic device
JP4302743B2 (ja) * 2007-01-31 2009-07-29 三菱電機株式会社 電子機器及び筐体
JP2008216347A (ja) * 2007-02-28 2008-09-18 Sony Corp 表示装置
TWM323132U (en) * 2007-04-23 2007-12-01 Hon Hai Prec Ind Co Ltd Electronic card connector
JP4890400B2 (ja) * 2007-09-19 2012-03-07 アルプス電気株式会社 電子回路モジュール
US20090086448A1 (en) * 2007-09-27 2009-04-02 Hiew Siew S Solid state drive with coverless casing
US8101859B2 (en) * 2008-01-03 2012-01-24 Apple Inc. Metal retaining features for handheld electronic device casing
JP5107750B2 (ja) * 2008-03-03 2012-12-26 日本圧着端子製造株式会社 電子カード
CN101666896B (zh) * 2008-09-05 2014-04-30 深圳富泰宏精密工业有限公司 具有视窗镜片的壳体组件
KR101539769B1 (ko) * 2008-10-14 2015-07-27 삼성전자주식회사 휴대용 통신 장치의 엘씨디 모듈 고정 장치
JP2010165311A (ja) * 2009-01-19 2010-07-29 Jst Mfg Co Ltd Icカード
JP4364939B1 (ja) * 2009-04-21 2009-11-18 新光電気工業株式会社 電子装置
CN201594955U (zh) * 2009-04-30 2010-09-29 比亚迪股份有限公司 壳体装配结构以及采用该装配结构的壳体
JP5371709B2 (ja) * 2009-11-20 2013-12-18 株式会社バッファロー 外部記憶装置およびそのケース
JP2011170566A (ja) * 2010-02-17 2011-09-01 Toshiba Corp 半導体記憶装置および電子機器
US8363417B2 (en) * 2010-03-04 2013-01-29 Seagate Technology Llc PCBA low cost snap-on frame mount
CN102316683B (zh) * 2010-06-30 2014-10-22 赛恩倍吉科技顾问(深圳)有限公司 固定结构及应用该固定结构的便携式电子装置
US8422220B2 (en) * 2010-10-29 2013-04-16 Research In Motion Limited Latch mechanism for portable electronic device
JP2012104527A (ja) * 2010-11-08 2012-05-31 Panasonic Corp 電子回路装置
JP5345181B2 (ja) * 2011-06-03 2013-11-20 株式会社ソニー・コンピュータエンタテインメント 電気装置及びその製造方法
JP5933981B2 (ja) * 2012-01-24 2016-06-15 クラリオン株式会社 筐体
US8559174B2 (en) * 2012-03-06 2013-10-15 Aopen Incorporated Computer case
JP5439577B2 (ja) * 2012-12-11 2014-03-12 株式会社東芝 電子機器
US9510474B2 (en) * 2013-11-26 2016-11-29 Kingston Technology Company Solid state drive (SSD) assembly method
CN204463819U (zh) * 2015-01-20 2015-07-08 环旭电子股份有限公司 一种组合式外壳及固态硬盘

Similar Documents

Publication Publication Date Title
JP2015070056A5 (enExample)
TWI540302B (zh) 金屬散熱板與熱導管的嵌合組成及其製法
US8760876B2 (en) USB memory stick
USD804434S1 (en) Electronic component heatsink assembly
TWI540950B (zh) 固定機構及具有固定機構的電子裝置
JP2013520834A5 (enExample)
TW201531214A (zh) 攜帶式電子裝置之散熱裝置
USD704762S1 (en) Mounting and positioning unit for electronic recording device
JP2014149822A (ja) 拡張ボード固定装置
JP5813076B2 (ja) ケースモールド型コンデンサ
TWI625084B (zh) 提把組件、其製造方法、其取置方法、載置提把組件之提把組件載體及提把組合件
TWI546007B (zh) 電子裝置
JP6208858B2 (ja) 液晶表示器及びその外枠部品
JP2017220598A5 (enExample)
JP2013140905A5 (enExample)
JP2015161780A (ja) 防水ケース
TW201332229A (zh) 固定座
JP2014127676A5 (enExample)
TWM507411U (zh) 容置盒
JP2015142108A5 (enExample)
TWI536373B (zh) 硬碟固定裝置
TWM524048U (zh) 提把組件、載置提把組件之提把組件載體及提把組合件
CN104571369B (zh) 硬盘固定装置
JP2013243278A5 (enExample)
JP3177648U (ja) オープンエンドレンチ