CN104519693B - 电子部件用壳体和电子部件装置 - Google Patents
电子部件用壳体和电子部件装置 Download PDFInfo
- Publication number
- CN104519693B CN104519693B CN201410432760.XA CN201410432760A CN104519693B CN 104519693 B CN104519693 B CN 104519693B CN 201410432760 A CN201410432760 A CN 201410432760A CN 104519693 B CN104519693 B CN 104519693B
- Authority
- CN
- China
- Prior art keywords
- upper body
- lower case
- side wall
- protrusion
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/13—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013201828A JP6122372B2 (ja) | 2013-09-27 | 2013-09-27 | 電子部品用ケース及び電子部品装置 |
| JP2013-201828 | 2013-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104519693A CN104519693A (zh) | 2015-04-15 |
| CN104519693B true CN104519693B (zh) | 2019-01-01 |
Family
ID=52739941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410432760.XA Active CN104519693B (zh) | 2013-09-27 | 2014-08-28 | 电子部件用壳体和电子部件装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9332659B2 (enExample) |
| JP (1) | JP6122372B2 (enExample) |
| CN (1) | CN104519693B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3352542A4 (en) * | 2015-09-18 | 2019-05-08 | Toray Industries, Inc. | CASING |
| US10227808B2 (en) | 2015-11-20 | 2019-03-12 | Microsoft Technology Licensing, Llc | Hinged device |
| CN108886879B (zh) * | 2016-03-31 | 2020-11-24 | 索尼互动娱乐股份有限公司 | 电子设备 |
| KR102406829B1 (ko) * | 2016-04-20 | 2022-06-10 | 삼성전자주식회사 | 에스에스디 하우징 및 에스에스디 하우징 어셈블리 |
| US10474203B2 (en) | 2016-09-01 | 2019-11-12 | Microsoft Technology Licensing, Llc | Hinged device |
| US10364598B2 (en) | 2016-09-02 | 2019-07-30 | Microsoft Technology Licensing, Llc | Hinged device |
| US10641318B2 (en) | 2016-12-09 | 2020-05-05 | Microsoft Technology Licensing, Llc | Hinged device |
| US10241548B2 (en) | 2016-12-09 | 2019-03-26 | Microsoft Technology Licensing, Llc | Computing device employing a self-spacing hinge assembly |
| US10253804B2 (en) * | 2017-01-24 | 2019-04-09 | Microsoft Technology Licensing, Llc | Hinged device |
| US10296044B2 (en) | 2017-06-08 | 2019-05-21 | Microsoft Technology Licensing, Llc | Hinged device |
| US10344510B2 (en) | 2017-06-16 | 2019-07-09 | Microsoft Technology Licensing, Llc | Hinged device |
| CN107278075B (zh) * | 2017-08-01 | 2022-10-18 | 浙江佳乐科仪股份有限公司 | 一种物联网用dtu盒 |
| KR102530066B1 (ko) * | 2017-12-08 | 2023-05-09 | 삼성전자주식회사 | 솔리드 스테이트 드라이브 장치 |
| CN113618338B (zh) * | 2018-02-05 | 2023-08-11 | Oppo广东移动通信有限公司 | 中框组件、中框组件加工方法及电子装置 |
| TWI651999B (zh) * | 2018-03-08 | 2019-02-21 | 群光電能科技股份有限公司 | 固定結構及包括此固定結構的電子裝置 |
| CN208113175U (zh) * | 2018-05-03 | 2018-11-16 | 中磊电子(苏州)有限公司 | 便于组装/拆卸的卡合结构 |
| KR102615769B1 (ko) * | 2018-05-18 | 2023-12-20 | 삼성전자주식회사 | 메모리 장치 |
| US10474206B1 (en) * | 2018-08-13 | 2019-11-12 | Baidu Usa Llc | Retaining tray for retaining an M.2 compatible device used in autonomous driving vehicles |
| US10729030B1 (en) * | 2018-08-28 | 2020-07-28 | Facebook, Inc. | Apparatuses, systems, and methods for integrating hardware accelerators into computing systems |
| US10346735B1 (en) * | 2018-09-29 | 2019-07-09 | Wen-Yi Lee | Assembling buckle structure for memory circuit board |
| US11346524B2 (en) * | 2018-10-11 | 2022-05-31 | Nitto Denko Corporation | Ventilation housing |
| US10349548B1 (en) * | 2018-10-19 | 2019-07-09 | Getac Technology Corporation | Casing and electronic device using the same |
| CN208969557U (zh) * | 2018-12-18 | 2019-06-11 | 京东方科技集团股份有限公司 | 显示面板、显示组件 |
| CN111667852B (zh) * | 2019-03-07 | 2021-11-30 | 上海宝存信息科技有限公司 | 固态存储装置 |
| CN114067853B (zh) | 2020-08-05 | 2024-04-12 | 美光科技公司 | 存储器装置、用于存储器装置的载体和相关计算系统和方法 |
| US20240049402A1 (en) * | 2022-08-02 | 2024-02-08 | Abesta International Co., Ltd. | Structural improvement for solid state discs |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386398A (zh) * | 2000-05-09 | 2002-12-18 | 索尼电脑娱乐公司 | 电子装置 |
| CN200947705Y (zh) * | 2006-09-01 | 2007-09-12 | 中兴通讯股份有限公司 | 一种可快速拆装的无铰链盒体 |
| CN101394725A (zh) * | 2007-09-19 | 2009-03-25 | 阿尔卑斯电气株式会社 | 电子电路模块 |
| CN101902890A (zh) * | 2009-04-21 | 2010-12-01 | 新光电气工业株式会社 | 用于容纳电子电路板的容纳壳体和电子设备 |
| CN102469739A (zh) * | 2010-11-08 | 2012-05-23 | 松下电器产业株式会社 | 电子电路装置 |
Family Cites Families (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3668476A (en) * | 1970-09-11 | 1972-06-06 | Seeburg Corp | Self-locking enclosure for electronic circuitry and method of assembling the same |
| US4346952A (en) * | 1980-06-16 | 1982-08-31 | Amp Incorporated | Connector for a ceramic substrate |
| US5066235A (en) * | 1989-07-21 | 1991-11-19 | Nec Corporation | Connector assembly for electronic devices |
| US5124888A (en) * | 1990-01-25 | 1992-06-23 | Tokyo Electric Co., Ltd. | Electric circuit apparatus |
| US5144533A (en) * | 1991-06-27 | 1992-09-01 | Motorola, Inc. | Self-locking housing assembly |
| US5383098A (en) * | 1991-09-19 | 1995-01-17 | Motorola, Inc. | Shield assembly |
| JP2501638Y2 (ja) * | 1991-11-25 | 1996-06-19 | 船井電機株式会社 | プリント基板装着用シ―ルド板 |
| US5477426A (en) * | 1993-12-15 | 1995-12-19 | Itt Corporation | IC card with board positioning means |
| US5477421A (en) * | 1993-11-18 | 1995-12-19 | Itt Corporation | Shielded IC card |
| US5563770A (en) * | 1994-02-25 | 1996-10-08 | Itt Corporation | IC card with board positioning means |
| US5548483A (en) * | 1995-01-24 | 1996-08-20 | Elco Corporation | Frameless IC card and housing therefor |
| CA2160854A1 (en) * | 1995-10-18 | 1997-04-19 | Robert L. Romerein | Top exit coupler |
| JP2752946B2 (ja) * | 1996-02-26 | 1998-05-18 | 埼玉日本電気株式会社 | ケースとラックとの組立て構造 |
| US6091605A (en) * | 1996-04-26 | 2000-07-18 | Ramey; Samuel C. | Memory card connector and cover apparatus and method |
| US5848718A (en) * | 1997-12-15 | 1998-12-15 | Motorola, Inc. | Apparatus for fastening a housing assembly |
| US5964513A (en) * | 1998-05-28 | 1999-10-12 | Intel Corporation | Chassis for electronic components |
| US6111760A (en) * | 1998-12-30 | 2000-08-29 | Ericsson, Inc. | Simple enclosure for electronic components |
| US7517231B2 (en) * | 2004-11-16 | 2009-04-14 | Super Talent Electronics, Inc. | Solid state drive (SSD) with open top and bottom covers |
| US7301776B1 (en) * | 2004-11-16 | 2007-11-27 | Super Talent Electronics, Inc. | Light-weight flash hard drive with plastic frame |
| JP3807192B2 (ja) | 2000-05-17 | 2006-08-09 | セイコーエプソン株式会社 | 部品取付軸の製造方法 |
| US6711859B2 (en) * | 2001-06-01 | 2004-03-30 | Michael Ray Bell | System and method for fixing a first component with a second component |
| KR100471064B1 (ko) * | 2002-06-11 | 2005-03-10 | 삼성전자주식회사 | 디스플레이장치 |
| JP3861791B2 (ja) * | 2002-10-11 | 2006-12-20 | ソニー株式会社 | 緩衝材及びこれを用いた情報記憶装置 |
| TW587731U (en) * | 2002-11-29 | 2004-05-11 | Hon Hai Prec Ind Co Ltd | Mounting apparatus for data storage device |
| TW572220U (en) * | 2003-01-08 | 2004-01-11 | Hannstar Display Corp | Liquid crystal display module and its fixing structure |
| TW557090U (en) * | 2003-01-29 | 2003-10-01 | Hon Hai Prec Ind Co Ltd | Portable electronic device and fastener mudule of printed circuit board tehrfor |
| CN2636368Y (zh) * | 2003-05-24 | 2004-08-25 | 鸿富锦精密工业(深圳)有限公司 | 光盘驱动器壳体 |
| US6894891B2 (en) * | 2003-06-30 | 2005-05-17 | Lear Corporation | Smart junction box for automobile |
| JP2005030847A (ja) * | 2003-07-10 | 2005-02-03 | Sysmex Corp | 電子機器および分析システム |
| US7869218B2 (en) * | 2004-11-16 | 2011-01-11 | Super Talent Electronics, Inc. | Light-weight solid state drive with rivet sets |
| CN2770278Y (zh) * | 2005-01-07 | 2006-04-05 | 鸿富锦精密工业(深圳)有限公司 | 电子装置壳体 |
| TWI335481B (en) * | 2006-06-23 | 2011-01-01 | Chimei Innolux Corp | Liquid crystal display device |
| US7688574B2 (en) * | 2007-01-05 | 2010-03-30 | Apple Inc. | Cold worked metal housing for a portable electronic device |
| JP4302743B2 (ja) * | 2007-01-31 | 2009-07-29 | 三菱電機株式会社 | 電子機器及び筐体 |
| JP2008216347A (ja) * | 2007-02-28 | 2008-09-18 | Sony Corp | 表示装置 |
| TWM323132U (en) * | 2007-04-23 | 2007-12-01 | Hon Hai Prec Ind Co Ltd | Electronic card connector |
| US20090086448A1 (en) * | 2007-09-27 | 2009-04-02 | Hiew Siew S | Solid state drive with coverless casing |
| US8101859B2 (en) * | 2008-01-03 | 2012-01-24 | Apple Inc. | Metal retaining features for handheld electronic device casing |
| JP5107750B2 (ja) * | 2008-03-03 | 2012-12-26 | 日本圧着端子製造株式会社 | 電子カード |
| CN101666896B (zh) * | 2008-09-05 | 2014-04-30 | 深圳富泰宏精密工业有限公司 | 具有视窗镜片的壳体组件 |
| KR101539769B1 (ko) * | 2008-10-14 | 2015-07-27 | 삼성전자주식회사 | 휴대용 통신 장치의 엘씨디 모듈 고정 장치 |
| JP2010165311A (ja) * | 2009-01-19 | 2010-07-29 | Jst Mfg Co Ltd | Icカード |
| CN201594955U (zh) * | 2009-04-30 | 2010-09-29 | 比亚迪股份有限公司 | 壳体装配结构以及采用该装配结构的壳体 |
| JP5371709B2 (ja) * | 2009-11-20 | 2013-12-18 | 株式会社バッファロー | 外部記憶装置およびそのケース |
| JP2011170566A (ja) * | 2010-02-17 | 2011-09-01 | Toshiba Corp | 半導体記憶装置および電子機器 |
| US8363417B2 (en) * | 2010-03-04 | 2013-01-29 | Seagate Technology Llc | PCBA low cost snap-on frame mount |
| CN102316683B (zh) * | 2010-06-30 | 2014-10-22 | 赛恩倍吉科技顾问(深圳)有限公司 | 固定结构及应用该固定结构的便携式电子装置 |
| US8422220B2 (en) * | 2010-10-29 | 2013-04-16 | Research In Motion Limited | Latch mechanism for portable electronic device |
| JP5345181B2 (ja) * | 2011-06-03 | 2013-11-20 | 株式会社ソニー・コンピュータエンタテインメント | 電気装置及びその製造方法 |
| JP5933981B2 (ja) * | 2012-01-24 | 2016-06-15 | クラリオン株式会社 | 筐体 |
| US8559174B2 (en) * | 2012-03-06 | 2013-10-15 | Aopen Incorporated | Computer case |
| JP5439577B2 (ja) * | 2012-12-11 | 2014-03-12 | 株式会社東芝 | 電子機器 |
| US9510474B2 (en) * | 2013-11-26 | 2016-11-29 | Kingston Technology Company | Solid state drive (SSD) assembly method |
| CN204463819U (zh) * | 2015-01-20 | 2015-07-08 | 环旭电子股份有限公司 | 一种组合式外壳及固态硬盘 |
-
2013
- 2013-09-27 JP JP2013201828A patent/JP6122372B2/ja active Active
-
2014
- 2014-08-28 CN CN201410432760.XA patent/CN104519693B/zh active Active
- 2014-09-04 US US14/477,156 patent/US9332659B2/en active Active
-
2016
- 2016-03-29 US US15/083,396 patent/US9933822B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386398A (zh) * | 2000-05-09 | 2002-12-18 | 索尼电脑娱乐公司 | 电子装置 |
| CN200947705Y (zh) * | 2006-09-01 | 2007-09-12 | 中兴通讯股份有限公司 | 一种可快速拆装的无铰链盒体 |
| CN101394725A (zh) * | 2007-09-19 | 2009-03-25 | 阿尔卑斯电气株式会社 | 电子电路模块 |
| CN101902890A (zh) * | 2009-04-21 | 2010-12-01 | 新光电气工业株式会社 | 用于容纳电子电路板的容纳壳体和电子设备 |
| CN102469739A (zh) * | 2010-11-08 | 2012-05-23 | 松下电器产业株式会社 | 电子电路装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150092337A1 (en) | 2015-04-02 |
| JP6122372B2 (ja) | 2017-04-26 |
| US9933822B2 (en) | 2018-04-03 |
| CN104519693A (zh) | 2015-04-15 |
| JP2015070056A (ja) | 2015-04-13 |
| US9332659B2 (en) | 2016-05-03 |
| US20160209888A1 (en) | 2016-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |