JP2015068800A - 圧力センサー、電子機器および移動体 - Google Patents

圧力センサー、電子機器および移動体 Download PDF

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Publication number
JP2015068800A
JP2015068800A JP2013205754A JP2013205754A JP2015068800A JP 2015068800 A JP2015068800 A JP 2015068800A JP 2013205754 A JP2013205754 A JP 2013205754A JP 2013205754 A JP2013205754 A JP 2013205754A JP 2015068800 A JP2015068800 A JP 2015068800A
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JP
Japan
Prior art keywords
pressure sensor
chip
sensor
package
sensor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013205754A
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English (en)
Japanese (ja)
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JP2015068800A5 (enExample
Inventor
今井　英生
Hideo Imai
英生 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013205754A priority Critical patent/JP2015068800A/ja
Priority to US14/497,787 priority patent/US9664581B2/en
Priority to CN201410520470.0A priority patent/CN104515638A/zh
Publication of JP2015068800A publication Critical patent/JP2015068800A/ja
Publication of JP2015068800A5 publication Critical patent/JP2015068800A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
  • Automation & Control Theory (AREA)
JP2013205754A 2013-09-30 2013-09-30 圧力センサー、電子機器および移動体 Pending JP2015068800A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013205754A JP2015068800A (ja) 2013-09-30 2013-09-30 圧力センサー、電子機器および移動体
US14/497,787 US9664581B2 (en) 2013-09-30 2014-09-26 Pressure sensor, electronic apparatus, and moving object
CN201410520470.0A CN104515638A (zh) 2013-09-30 2014-09-30 压力传感器、电子设备和移动体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013205754A JP2015068800A (ja) 2013-09-30 2013-09-30 圧力センサー、電子機器および移動体

Publications (2)

Publication Number Publication Date
JP2015068800A true JP2015068800A (ja) 2015-04-13
JP2015068800A5 JP2015068800A5 (enExample) 2016-11-10

Family

ID=52738790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013205754A Pending JP2015068800A (ja) 2013-09-30 2013-09-30 圧力センサー、電子機器および移動体

Country Status (3)

Country Link
US (1) US9664581B2 (enExample)
JP (1) JP2015068800A (enExample)
CN (1) CN104515638A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016095284A (ja) * 2014-11-17 2016-05-26 セイコーエプソン株式会社 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体
US9499393B2 (en) 2015-02-06 2016-11-22 Mks Instruments, Inc. Stress relief MEMS structure and package
FR3037397B1 (fr) 2015-06-12 2017-06-16 Sagem Defense Securite Dispositif de detection de pression a decouplage mecanique
US10060820B2 (en) * 2015-12-22 2018-08-28 Continental Automotive Systems, Inc. Stress-isolated absolute pressure sensor
US10800651B2 (en) * 2016-05-06 2020-10-13 Analog Devices, Inc. Low stress integrated device packages
US10132705B2 (en) * 2016-07-19 2018-11-20 Kulite Semiconductor Products, Inc. Low-stress floating-chip pressure sensors
US20190206752A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Integrated circuit packages with cavities and methods of manufacturing the same
CN110793706A (zh) * 2019-09-21 2020-02-14 蚌埠市力业传感器有限公司 压力传感器制作方法
US11702335B2 (en) 2020-12-04 2023-07-18 Analog Devices, Inc. Low stress integrated device package

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180738U (enExample) * 1986-05-06 1987-11-17
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
JPH05206354A (ja) * 1992-01-24 1993-08-13 Mitsubishi Electric Corp 半導体圧力センサおよびその製造方法
JP2001021431A (ja) * 1999-05-06 2001-01-26 Denso Corp 圧力センサ
JP2002168716A (ja) * 2000-11-30 2002-06-14 Matsushita Electric Works Ltd 圧力センサモジュール
JP2004311951A (ja) * 2003-03-27 2004-11-04 Denso Corp 半導体装置
JP2010243468A (ja) * 2009-04-10 2010-10-28 Seiko Epson Corp 圧力検出モジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6143236A (en) * 1994-02-09 2000-11-07 Radius Engineering, Inc. Method for manufacturing composite shafts with injection molded, rigidized bladder with varying wall thickness
JP3136087B2 (ja) 1995-10-26 2001-02-19 松下電工株式会社 半導体圧力センサ
JP3858577B2 (ja) 1999-09-17 2006-12-13 株式会社デンソー 半導体圧力センサ装置
US6512255B2 (en) 1999-09-17 2003-01-28 Denso Corporation Semiconductor pressure sensor device having sensor chip covered with protective member
JP3578347B2 (ja) 2002-03-29 2004-10-20 日本精機株式会社 圧力センサ及びその製造方法
US7077008B2 (en) * 2004-07-02 2006-07-18 Honeywell International Inc. Differential pressure measurement using backside sensing and a single ASIC
JP4568202B2 (ja) 2005-09-29 2010-10-27 Ｏｋｉセミコンダクタ株式会社 半導体装置
US8618620B2 (en) * 2010-07-13 2013-12-31 Infineon Technologies Ag Pressure sensor package systems and methods
CN201852672U (zh) * 2010-10-29 2011-06-01 刘胜 塑料封装的压力传感器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180738U (enExample) * 1986-05-06 1987-11-17
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
JPH05206354A (ja) * 1992-01-24 1993-08-13 Mitsubishi Electric Corp 半導体圧力センサおよびその製造方法
JP2001021431A (ja) * 1999-05-06 2001-01-26 Denso Corp 圧力センサ
JP2002168716A (ja) * 2000-11-30 2002-06-14 Matsushita Electric Works Ltd 圧力センサモジュール
JP2004311951A (ja) * 2003-03-27 2004-11-04 Denso Corp 半導体装置
JP2010243468A (ja) * 2009-04-10 2010-10-28 Seiko Epson Corp 圧力検出モジュール

Also Published As

Publication number Publication date
US9664581B2 (en) 2017-05-30
CN104515638A (zh) 2015-04-15
US20150090041A1 (en) 2015-04-02

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