JP2015030919A5 - - Google Patents
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- Publication number
- JP2015030919A5 JP2015030919A5 JP2014158336A JP2014158336A JP2015030919A5 JP 2015030919 A5 JP2015030919 A5 JP 2015030919A5 JP 2014158336 A JP2014158336 A JP 2014158336A JP 2014158336 A JP2014158336 A JP 2014158336A JP 2015030919 A5 JP2015030919 A5 JP 2015030919A5
- Authority
- JP
- Japan
- Prior art keywords
- electrolyte solution
- electroplating
- anode chamber
- electroplating system
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 claims description 116
- 239000008151 electrolyte solution Substances 0.000 claims description 99
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 60
- 239000001301 oxygen Substances 0.000 claims description 60
- 229910052760 oxygen Inorganic materials 0.000 claims description 60
- 239000012530 fluid Substances 0.000 claims description 59
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 34
- 239000002253 acid Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 24
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- -1 hydrogen ions Chemical class 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 238000011144 upstream manufacturing Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 5
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910001453 nickel ion Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 238000005342 ion exchange Methods 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 229940123973 Oxygen scavenger Drugs 0.000 claims 2
- 238000007872 degassing Methods 0.000 claims 2
- 229910000457 iridium oxide Inorganic materials 0.000 claims 1
- 229910000484 niobium oxide Inorganic materials 0.000 claims 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical class [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229910003446 platinum oxide Inorganic materials 0.000 claims 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims 1
- 230000002000 scavenging effect Effects 0.000 claims 1
- 229910001936 tantalum oxide Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/960,624 US10190232B2 (en) | 2013-08-06 | 2013-08-06 | Apparatuses and methods for maintaining pH in nickel electroplating baths |
| US13/960,624 | 2013-08-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015030919A JP2015030919A (ja) | 2015-02-16 |
| JP2015030919A5 true JP2015030919A5 (https=) | 2017-09-14 |
| JP6502628B2 JP6502628B2 (ja) | 2019-04-17 |
Family
ID=52447682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014158336A Active JP6502628B2 (ja) | 2013-08-06 | 2014-08-04 | 電気めっきシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10190232B2 (https=) |
| JP (1) | JP6502628B2 (https=) |
| KR (1) | KR102303998B1 (https=) |
| CN (1) | CN104342747B (https=) |
| SG (2) | SG10201800707SA (https=) |
| TW (2) | TW201843356A (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9732434B2 (en) | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
| CN107075683A (zh) * | 2014-05-27 | 2017-08-18 | 奥克兰联合服务公司 | 于基材上产生金属‑陶瓷覆层的镀覆或涂覆方法 |
| CN104947173A (zh) * | 2015-05-22 | 2015-09-30 | 北京中冶设备研究设计总院有限公司 | 一种提高连续电镀镍镀液pH值的装置与方法 |
| CN104894633A (zh) * | 2015-05-22 | 2015-09-09 | 北京中冶设备研究设计总院有限公司 | 一种连续电镀镍溶液供给装置 |
| KR101667291B1 (ko) * | 2015-06-30 | 2016-10-18 | 주식회사 포스코 | 전착도장 장치 및 방법 |
| US10227707B2 (en) * | 2015-07-17 | 2019-03-12 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher |
| CN105025198B (zh) * | 2015-07-22 | 2019-01-01 | 东方网力科技股份有限公司 | 一种基于时空因素的视频运动目标的分组方法 |
| KR102723647B1 (ko) * | 2016-10-12 | 2024-10-29 | 램 리써치 코포레이션 | 반도체 프로세싱용 웨이퍼 포지셔닝 페데스탈의 패드 상승 메커니즘 |
| JP6696462B2 (ja) * | 2017-03-09 | 2020-05-20 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| US10240245B2 (en) | 2017-06-28 | 2019-03-26 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
| KR101872734B1 (ko) * | 2017-07-20 | 2018-06-29 | 주식회사 익스톨 | 니켈 전기 도금액 및 이를 이용한 전기 도금 방법 |
| US10781527B2 (en) * | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| WO2019089282A1 (en) * | 2017-11-01 | 2019-05-09 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
| CN107672066A (zh) * | 2017-11-09 | 2018-02-09 | 华晶精密制造股份有限公司 | 一种单线生产金刚石切割线设备用立式悬浮上砂装置 |
| US10494731B2 (en) * | 2017-12-11 | 2019-12-03 | Applied Materials, Inc. | Electroplating dynamic edge control |
| US10655240B2 (en) * | 2018-05-01 | 2020-05-19 | Lam Research Corporation | Removing bubbles from plating cells |
| CN110047735A (zh) * | 2019-04-02 | 2019-07-23 | 深圳市华星光电技术有限公司 | 金属结构湿制程处理方法、tft制备方法、tft及显示装置 |
| DE102019123858A1 (de) * | 2019-09-05 | 2021-03-11 | Thyssenkrupp Uhde Chlorine Engineers Gmbh | Kreuzflusswasserelektrolyse |
| EP3868923A1 (en) * | 2020-02-19 | 2021-08-25 | Semsysco GmbH | Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate |
| CN113311032B (zh) * | 2020-02-27 | 2024-05-31 | 芯恩（青岛）集成电路有限公司 | Ecp填充监测设备及监测方法 |
| CN112267143B (zh) * | 2020-09-29 | 2023-11-03 | 张家港扬子江冷轧板有限公司 | 一种消除助熔溶液添加斑的装置及其助熔方法 |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| WO2022144985A1 (ja) * | 2020-12-28 | 2022-07-07 | 株式会社荏原製作所 | めっき装置 |
| US12054846B2 (en) | 2021-09-15 | 2024-08-06 | Samsung Electronics Co., Ltd. | Electroplating apparatus and electroplating method |
| TWI789175B (zh) * | 2021-12-23 | 2023-01-01 | 日商荏原製作所股份有限公司 | 鍍覆裝置之維護方法 |
| US11686005B1 (en) * | 2022-01-28 | 2023-06-27 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
| TWI814308B (zh) * | 2022-03-28 | 2023-09-01 | 國立臺灣科技大學 | 增加電池電容量的連續製程設備 |
| US20240287702A1 (en) * | 2023-02-23 | 2024-08-29 | Applied Materials, Inc. | Methods of reducing or eliminating deposits in an electroplating system |
| CN116623266A (zh) * | 2023-06-14 | 2023-08-22 | 昆山一鼎工业科技有限公司 | 电镀模具、电镀模块、电镀装置、电镀方法 |
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| US9359688B1 (en) | 2012-12-05 | 2016-06-07 | Novellus Systems, Inc. | Apparatuses and methods for controlling PH in electroplating baths |
| US9732434B2 (en) | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
| US20150299882A1 (en) | 2014-04-18 | 2015-10-22 | Lam Research Corporation | Nickel electroplating systems having a grain refiner releasing device |
-
2013
- 2013-08-06 US US13/960,624 patent/US10190232B2/en active Active
-
2014
- 2014-07-31 SG SG10201800707SA patent/SG10201800707SA/en unknown
- 2014-07-31 SG SG10201404510YA patent/SG10201404510YA/en unknown
- 2014-08-04 JP JP2014158336A patent/JP6502628B2/ja active Active
- 2014-08-05 TW TW107132345A patent/TW201843356A/zh unknown
- 2014-08-05 TW TW103126801A patent/TWI657168B/zh active
- 2014-08-06 KR KR1020140101331A patent/KR102303998B1/ko active Active
- 2014-08-06 CN CN201410382721.3A patent/CN104342747B/zh active Active
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