CN104342747B - 用于在镍电镀槽液中保持pH值的装置和方法 - Google Patents
用于在镍电镀槽液中保持pH值的装置和方法 Download PDFInfo
- Publication number
- CN104342747B CN104342747B CN201410382721.3A CN201410382721A CN104342747B CN 104342747 B CN104342747 B CN 104342747B CN 201410382721 A CN201410382721 A CN 201410382721A CN 104342747 B CN104342747 B CN 104342747B
- Authority
- CN
- China
- Prior art keywords
- electrolyte solution
- electroplating
- anode
- anode chamber
- oxygen concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 208
- 238000000034 method Methods 0.000 title claims abstract description 146
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 99
- 238000009713 electroplating Methods 0.000 claims abstract description 452
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 216
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 140
- 239000001301 oxygen Substances 0.000 claims abstract description 140
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 140
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 238000007747 plating Methods 0.000 claims abstract description 119
- 239000000243 solution Substances 0.000 claims abstract description 93
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 239000012530 fluid Substances 0.000 claims description 161
- 239000003792 electrolyte Substances 0.000 claims description 62
- 239000002253 acid Substances 0.000 claims description 53
- 230000005611 electricity Effects 0.000 claims description 43
- 239000007788 liquid Substances 0.000 claims description 35
- 230000002829 reductive effect Effects 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 230000004888 barrier function Effects 0.000 claims description 26
- 239000007789 gas Substances 0.000 claims description 25
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 238000011144 upstream manufacturing Methods 0.000 claims description 16
- 238000005868 electrolysis reaction Methods 0.000 claims description 15
- 230000001965 increasing effect Effects 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000007872 degassing Methods 0.000 claims description 9
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 229910052758 niobium Inorganic materials 0.000 claims description 7
- 239000010955 niobium Substances 0.000 claims description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910001453 nickel ion Inorganic materials 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 239000012982 microporous membrane Substances 0.000 claims description 2
- 229940021013 electrolyte solution Drugs 0.000 description 157
- 241000196324 Embryophyta Species 0.000 description 78
- 230000008569 process Effects 0.000 description 60
- 229910052751 metal Inorganic materials 0.000 description 51
- 239000002184 metal Substances 0.000 description 51
- 235000012431 wafers Nutrition 0.000 description 47
- 238000006243 chemical reaction Methods 0.000 description 26
- 230000007246 mechanism Effects 0.000 description 22
- 239000004615 ingredient Substances 0.000 description 20
- 229910021645 metal ion Inorganic materials 0.000 description 20
- 238000012545 processing Methods 0.000 description 20
- 238000006392 deoxygenation reaction Methods 0.000 description 19
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- 230000004087 circulation Effects 0.000 description 16
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 16
- 238000007789 sealing Methods 0.000 description 15
- 150000002500 ions Chemical class 0.000 description 14
- 239000012528 membrane Substances 0.000 description 14
- 230000009467 reduction Effects 0.000 description 13
- 238000006722 reduction reaction Methods 0.000 description 13
- 230000006870 function Effects 0.000 description 12
- 238000004090 dissolution Methods 0.000 description 11
- 238000010979 pH adjustment Methods 0.000 description 11
- 238000002474 experimental method Methods 0.000 description 10
- 238000011049 filling Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 230000004913 activation Effects 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- WURBVZBTWMNKQT-UHFFFAOYSA-N 1-(4-chlorophenoxy)-3,3-dimethyl-1-(1,2,4-triazol-1-yl)butan-2-one Chemical compound C1=NC=NN1C(C(=O)C(C)(C)C)OC1=CC=C(Cl)C=C1 WURBVZBTWMNKQT-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 239000005864 Sulphur Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 5
- -1 hydrogen ions Chemical class 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005086 pumping Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 241000478345 Afer Species 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- NYNKCGWJPNZJMI-UHFFFAOYSA-N Clebopride malate Chemical compound [O-]C(=O)C(O)CC(O)=O.COC1=CC(N)=C(Cl)C=C1C(=O)NC1CC[NH+](CC=2C=CC=CC=2)CC1 NYNKCGWJPNZJMI-UHFFFAOYSA-N 0.000 description 2
- 102100023774 Cold-inducible RNA-binding protein Human genes 0.000 description 2
- 101000906744 Homo sapiens Cold-inducible RNA-binding protein Proteins 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- YWMAPNNZOCSAPF-UHFFFAOYSA-N Nickel(1+) Chemical compound [Ni+] YWMAPNNZOCSAPF-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 229940081974 saccharin Drugs 0.000 description 2
- 235000019204 saccharin Nutrition 0.000 description 2
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- BCSZNBYWPPFADT-UHFFFAOYSA-N 4-(1,2,4-triazol-4-ylmethyl)benzonitrile Chemical compound C1=CC(C#N)=CC=C1CN1C=NN=C1 BCSZNBYWPPFADT-UHFFFAOYSA-N 0.000 description 1
- NPBDXRJVJGAEPO-UHFFFAOYSA-N B(O)O.[F] Chemical compound B(O)O.[F] NPBDXRJVJGAEPO-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 240000008067 Cucumis sativus Species 0.000 description 1
- 235000010799 Cucumis sativus var sativus Nutrition 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- BIGPRXCJEDHCLP-UHFFFAOYSA-N ammonium bisulfate Chemical compound [NH4+].OS([O-])(=O)=O BIGPRXCJEDHCLP-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012527 feed solution Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000004401 flow injection analysis Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229940006444 nickel cation Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 210000000952 spleen Anatomy 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/960,624 US10190232B2 (en) | 2013-08-06 | 2013-08-06 | Apparatuses and methods for maintaining pH in nickel electroplating baths |
| US13/960,624 | 2013-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104342747A CN104342747A (zh) | 2015-02-11 |
| CN104342747B true CN104342747B (zh) | 2019-04-16 |
Family
ID=52447682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410382721.3A Active CN104342747B (zh) | 2013-08-06 | 2014-08-06 | 用于在镍电镀槽液中保持pH值的装置和方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10190232B2 (https=) |
| JP (1) | JP6502628B2 (https=) |
| KR (1) | KR102303998B1 (https=) |
| CN (1) | CN104342747B (https=) |
| SG (2) | SG10201800707SA (https=) |
| TW (2) | TW201843356A (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9732434B2 (en) | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
| CN107075683A (zh) * | 2014-05-27 | 2017-08-18 | 奥克兰联合服务公司 | 于基材上产生金属‑陶瓷覆层的镀覆或涂覆方法 |
| CN104947173A (zh) * | 2015-05-22 | 2015-09-30 | 北京中冶设备研究设计总院有限公司 | 一种提高连续电镀镍镀液pH值的装置与方法 |
| CN104894633A (zh) * | 2015-05-22 | 2015-09-09 | 北京中冶设备研究设计总院有限公司 | 一种连续电镀镍溶液供给装置 |
| KR101667291B1 (ko) * | 2015-06-30 | 2016-10-18 | 주식회사 포스코 | 전착도장 장치 및 방법 |
| US10227707B2 (en) * | 2015-07-17 | 2019-03-12 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher |
| CN105025198B (zh) * | 2015-07-22 | 2019-01-01 | 东方网力科技股份有限公司 | 一种基于时空因素的视频运动目标的分组方法 |
| KR102723647B1 (ko) * | 2016-10-12 | 2024-10-29 | 램 리써치 코포레이션 | 반도체 프로세싱용 웨이퍼 포지셔닝 페데스탈의 패드 상승 메커니즘 |
| JP6696462B2 (ja) * | 2017-03-09 | 2020-05-20 | トヨタ自動車株式会社 | 金属皮膜の成膜装置 |
| US10240245B2 (en) | 2017-06-28 | 2019-03-26 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
| KR101872734B1 (ko) * | 2017-07-20 | 2018-06-29 | 주식회사 익스톨 | 니켈 전기 도금액 및 이를 이용한 전기 도금 방법 |
| US10781527B2 (en) * | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| WO2019089282A1 (en) * | 2017-11-01 | 2019-05-09 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
| CN107672066A (zh) * | 2017-11-09 | 2018-02-09 | 华晶精密制造股份有限公司 | 一种单线生产金刚石切割线设备用立式悬浮上砂装置 |
| US10494731B2 (en) * | 2017-12-11 | 2019-12-03 | Applied Materials, Inc. | Electroplating dynamic edge control |
| US10655240B2 (en) * | 2018-05-01 | 2020-05-19 | Lam Research Corporation | Removing bubbles from plating cells |
| CN110047735A (zh) * | 2019-04-02 | 2019-07-23 | 深圳市华星光电技术有限公司 | 金属结构湿制程处理方法、tft制备方法、tft及显示装置 |
| DE102019123858A1 (de) * | 2019-09-05 | 2021-03-11 | Thyssenkrupp Uhde Chlorine Engineers Gmbh | Kreuzflusswasserelektrolyse |
| EP3868923A1 (en) * | 2020-02-19 | 2021-08-25 | Semsysco GmbH | Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate |
| CN113311032B (zh) * | 2020-02-27 | 2024-05-31 | 芯恩（青岛）集成电路有限公司 | Ecp填充监测设备及监测方法 |
| CN112267143B (zh) * | 2020-09-29 | 2023-11-03 | 张家港扬子江冷轧板有限公司 | 一种消除助熔溶液添加斑的装置及其助熔方法 |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| WO2022144985A1 (ja) * | 2020-12-28 | 2022-07-07 | 株式会社荏原製作所 | めっき装置 |
| US12054846B2 (en) | 2021-09-15 | 2024-08-06 | Samsung Electronics Co., Ltd. | Electroplating apparatus and electroplating method |
| TWI789175B (zh) * | 2021-12-23 | 2023-01-01 | 日商荏原製作所股份有限公司 | 鍍覆裝置之維護方法 |
| US11686005B1 (en) * | 2022-01-28 | 2023-06-27 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
| TWI814308B (zh) * | 2022-03-28 | 2023-09-01 | 國立臺灣科技大學 | 增加電池電容量的連續製程設備 |
| US20240287702A1 (en) * | 2023-02-23 | 2024-08-29 | Applied Materials, Inc. | Methods of reducing or eliminating deposits in an electroplating system |
| CN116623266A (zh) * | 2023-06-14 | 2023-08-22 | 昆山一鼎工业科技有限公司 | 电镀模具、电镀模块、电镀装置、电镀方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4269669A (en) * | 1979-06-01 | 1981-05-26 | Emi Limited | High speed electroplating |
| CN101290879A (zh) * | 2007-04-17 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | 栅极的制造方法 |
| CN102766894A (zh) * | 2012-07-19 | 2012-11-07 | 上海杜行电镀有限公司 | 一种使用超耐腐多层镍电镀液的铝轮毂的电镀方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4554056A (en) | 1985-04-18 | 1985-11-19 | Eagle-Picher Industries, Inc. | Impregnation of nickel electrodes using electric pH control circuits |
| US4855020A (en) * | 1985-12-06 | 1989-08-08 | Microsurface Technology Corp. | Apparatus and method for the electrolytic plating of layers onto computer memory hard discs |
| US4715938A (en) | 1986-03-27 | 1987-12-29 | Billings Roger E | Method and apparatus for electrolyzing water |
| US4726888A (en) | 1986-12-04 | 1988-02-23 | Mccambridge Michael | Electrolysis of water |
| US4778572A (en) | 1987-09-08 | 1988-10-18 | Eco-Tec Limited | Process for electroplating metals |
| US4832812A (en) | 1987-09-08 | 1989-05-23 | Eco-Tec Limited | Apparatus for electroplating metals |
| ATE184923T1 (de) * | 1996-04-01 | 1999-10-15 | Sonopress Prod | Galvanische abscheidungszelle mit einem trägerhalter |
| US6406611B1 (en) | 1999-12-08 | 2002-06-18 | University Of Alabama In Huntsville | Nickel cobalt phosphorous low stress electroplating |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| EP1229154A4 (en) * | 2000-03-17 | 2006-12-13 | Ebara Corp | METHOD AND DEVICE FOR ELECTROPLATING |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US6527920B1 (en) | 2000-05-10 | 2003-03-04 | Novellus Systems, Inc. | Copper electroplating apparatus |
| US6821407B1 (en) * | 2000-05-10 | 2004-11-23 | Novellus Systems, Inc. | Anode and anode chamber for copper electroplating |
| US7628898B2 (en) | 2001-03-12 | 2009-12-08 | Semitool, Inc. | Method and system for idle state operation |
| US6458696B1 (en) * | 2001-04-11 | 2002-10-01 | Agere Systems Guardian Corp | Plated through hole interconnections |
| US6551487B1 (en) | 2001-05-31 | 2003-04-22 | Novellus Systems, Inc. | Methods and apparatus for controlled-angle wafer immersion |
| US6800187B1 (en) | 2001-05-31 | 2004-10-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating wafers |
| EP1308541A1 (en) * | 2001-10-04 | 2003-05-07 | Shipley Company LLC | Plating bath and method for depositing a metal layer on a substrate |
| US6750144B2 (en) | 2002-02-15 | 2004-06-15 | Faraday Technology Marketing Group, Llc | Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes |
| US7128823B2 (en) * | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
| US20040026255A1 (en) * | 2002-08-06 | 2004-02-12 | Applied Materials, Inc | Insoluble anode loop in copper electrodeposition cell for interconnect formation |
| US7794573B2 (en) | 2003-12-05 | 2010-09-14 | Semitool, Inc. | Systems and methods for electrochemically processing microfeature workpieces |
| US20050230262A1 (en) | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
| DE602005022650D1 (de) | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Verbessertes Plattierungsverfahren |
| JP4904933B2 (ja) | 2005-09-27 | 2012-03-28 | 日立電線株式会社 | ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔 |
| JP2007169700A (ja) | 2005-12-21 | 2007-07-05 | Victor Co Of Japan Ltd | 不溶性陽極を用いる電解銅めっき方法 |
| EP2107136B1 (en) | 2008-03-31 | 2014-12-31 | Permelec Electrode Ltd. | Manufacturing process of electrodes for electrolysis |
| US8262871B1 (en) | 2008-12-19 | 2012-09-11 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| US8962085B2 (en) | 2009-06-17 | 2015-02-24 | Novellus Systems, Inc. | Wetting pretreatment for enhanced damascene metal filling |
| JP5650899B2 (ja) | 2009-09-08 | 2015-01-07 | 上村工業株式会社 | 電気めっき装置 |
| US20110226613A1 (en) | 2010-03-19 | 2011-09-22 | Robert Rash | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
| US8912275B2 (en) | 2010-04-13 | 2014-12-16 | T.I.P. Ltd. | Continuous solution of polymer in liquid |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| TW201218277A (en) | 2010-09-09 | 2012-05-01 | Novellus Systems Inc | By-product mitigation in through-silicon-via plating |
| US9404194B2 (en) | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
| US9816193B2 (en) | 2011-01-07 | 2017-11-14 | Novellus Systems, Inc. | Configuration and method of operation of an electrodeposition system for improved process stability and performance |
| US20130095649A1 (en) * | 2011-10-17 | 2013-04-18 | International Business Machines Corporation | Chemical Bath Replenishment |
| US9816196B2 (en) | 2012-04-27 | 2017-11-14 | Novellus Systems, Inc. | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte |
| US9359688B1 (en) | 2012-12-05 | 2016-06-07 | Novellus Systems, Inc. | Apparatuses and methods for controlling PH in electroplating baths |
| US9732434B2 (en) | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
| US20150299882A1 (en) | 2014-04-18 | 2015-10-22 | Lam Research Corporation | Nickel electroplating systems having a grain refiner releasing device |
-
2013
- 2013-08-06 US US13/960,624 patent/US10190232B2/en active Active
-
2014
- 2014-07-31 SG SG10201800707SA patent/SG10201800707SA/en unknown
- 2014-07-31 SG SG10201404510YA patent/SG10201404510YA/en unknown
- 2014-08-04 JP JP2014158336A patent/JP6502628B2/ja active Active
- 2014-08-05 TW TW107132345A patent/TW201843356A/zh unknown
- 2014-08-05 TW TW103126801A patent/TWI657168B/zh active
- 2014-08-06 KR KR1020140101331A patent/KR102303998B1/ko active Active
- 2014-08-06 CN CN201410382721.3A patent/CN104342747B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4269669A (en) * | 1979-06-01 | 1981-05-26 | Emi Limited | High speed electroplating |
| CN101290879A (zh) * | 2007-04-17 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | 栅极的制造方法 |
| CN102766894A (zh) * | 2012-07-19 | 2012-11-07 | 上海杜行电镀有限公司 | 一种使用超耐腐多层镍电镀液的铝轮毂的电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201527605A (zh) | 2015-07-16 |
| KR102303998B1 (ko) | 2021-09-23 |
| KR20150017315A (ko) | 2015-02-16 |
| CN104342747A (zh) | 2015-02-11 |
| US20150041327A1 (en) | 2015-02-12 |
| JP2015030919A (ja) | 2015-02-16 |
| US10190232B2 (en) | 2019-01-29 |
| TW201843356A (zh) | 2018-12-16 |
| SG10201800707SA (en) | 2018-02-27 |
| SG10201404510YA (en) | 2015-03-30 |
| TWI657168B (zh) | 2019-04-21 |
| JP6502628B2 (ja) | 2019-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104342747B (zh) | 用于在镍电镀槽液中保持pH值的装置和方法 | |
| US10954604B2 (en) | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes | |
| TWI585823B (zh) | 電鍍裝置及晶圓級封裝製程 | |
| CN103608490B (zh) | 电化学沉积和补给设备 | |
| EP1052311A1 (en) | Plating machine | |
| CN111149198A (zh) | 通掩模互联制造中的电氧化金属去除 | |
| US9816196B2 (en) | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | |
| JP2014510842A5 (https=) | ||
| US20120298504A1 (en) | Electro chemical deposition and replenishment apparatus | |
| CN111630211B (zh) | 控制在电化学镀敷设备上的镀敷电解液浓度 | |
| US20150299882A1 (en) | Nickel electroplating systems having a grain refiner releasing device | |
| US9359688B1 (en) | Apparatuses and methods for controlling PH in electroplating baths | |
| US20130095649A1 (en) | Chemical Bath Replenishment | |
| CN111936675A (zh) | 具有惰性和活性阳极的电镀系统 | |
| TW202548097A (zh) | 鈍性陽極及電解質控制 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |