KR102303998B1 - 니켈 전기도금 욕 내의 ｐｈ 를 유지하기 위한 장치 및 방법 - Google Patents

니켈 전기도금 욕 내의 ｐｈ 를 유지하기 위한 장치 및 방법 Download PDF

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KR102303998B1
KR102303998B1 KR1020140101331A KR20140101331A KR102303998B1 KR 102303998 B1 KR102303998 B1 KR 102303998B1 KR 1020140101331 A KR1020140101331 A KR 1020140101331A KR 20140101331 A KR20140101331 A KR 20140101331A KR 102303998 B1 KR102303998 B1 KR 102303998B1
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electroplating
electrolyte solution
anode
anode chamber
nickel
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KR20150017315A (ko
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브라이언 엘. 부캘루
토마스 에이. 폰누스와미
벤 폴리
스티븐 티. 메이어
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램 리써치 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020140101331A 2013-08-06 2014-08-06 니켈 전기도금 욕 내의 ｐｈ 를 유지하기 위한 장치 및 방법 Active KR102303998B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/960,624 US10190232B2 (en) 2013-08-06 2013-08-06 Apparatuses and methods for maintaining pH in nickel electroplating baths
US13/960,624 2013-08-06

Publications (2)

Publication Number Publication Date
KR20150017315A KR20150017315A (ko) 2015-02-16
KR102303998B1 true KR102303998B1 (ko) 2021-09-23

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KR1020140101331A Active KR102303998B1 (ko) 2013-08-06 2014-08-06 니켈 전기도금 욕 내의 ｐｈ 를 유지하기 위한 장치 및 방법

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US (1) US10190232B2 (https=)
JP (1) JP6502628B2 (https=)
KR (1) KR102303998B1 (https=)
CN (1) CN104342747B (https=)
SG (2) SG10201800707SA (https=)
TW (2) TW201843356A (https=)

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CN104947173A (zh) * 2015-05-22 2015-09-30 北京中冶设备研究设计总院有限公司 一种提高连续电镀镍镀液pH值的装置与方法
CN104894633A (zh) * 2015-05-22 2015-09-09 北京中冶设备研究设计总院有限公司 一种连续电镀镍溶液供给装置
KR101667291B1 (ko) * 2015-06-30 2016-10-18 주식회사 포스코 전착도장 장치 및 방법
US10227707B2 (en) * 2015-07-17 2019-03-12 Applied Materials, Inc. Inert anode electroplating processor and replenisher
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KR102723647B1 (ko) * 2016-10-12 2024-10-29 램 리써치 코포레이션 반도체 프로세싱용 웨이퍼 포지셔닝 페데스탈의 패드 상승 메커니즘
JP6696462B2 (ja) * 2017-03-09 2020-05-20 トヨタ自動車株式会社 金属皮膜の成膜装置
US10240245B2 (en) 2017-06-28 2019-03-26 Honeywell International Inc. Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces
KR101872734B1 (ko) * 2017-07-20 2018-06-29 주식회사 익스톨 니켈 전기 도금액 및 이를 이용한 전기 도금 방법
US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
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CN107672066A (zh) * 2017-11-09 2018-02-09 华晶精密制造股份有限公司 一种单线生产金刚石切割线设备用立式悬浮上砂装置
US10494731B2 (en) * 2017-12-11 2019-12-03 Applied Materials, Inc. Electroplating dynamic edge control
US10655240B2 (en) * 2018-05-01 2020-05-19 Lam Research Corporation Removing bubbles from plating cells
CN110047735A (zh) * 2019-04-02 2019-07-23 深圳市华星光电技术有限公司 金属结构湿制程处理方法、tft制备方法、tft及显示装置
DE102019123858A1 (de) * 2019-09-05 2021-03-11 Thyssenkrupp Uhde Chlorine Engineers Gmbh Kreuzflusswasserelektrolyse
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CN113311032B (zh) * 2020-02-27 2024-05-31 芯恩（青岛）集成电路有限公司 Ecp填充监测设备及监测方法
CN112267143B (zh) * 2020-09-29 2023-11-03 张家港扬子江冷轧板有限公司 一种消除助熔溶液添加斑的装置及其助熔方法
US11542626B2 (en) * 2020-10-08 2023-01-03 Honeywell International Inc. Systems and methods for enclosed electroplating chambers
WO2022144985A1 (ja) * 2020-12-28 2022-07-07 株式会社荏原製作所 めっき装置
US12054846B2 (en) 2021-09-15 2024-08-06 Samsung Electronics Co., Ltd. Electroplating apparatus and electroplating method
TWI789175B (zh) * 2021-12-23 2023-01-01 日商荏原製作所股份有限公司 鍍覆裝置之維護方法
US11686005B1 (en) * 2022-01-28 2023-06-27 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
TWI814308B (zh) * 2022-03-28 2023-09-01 國立臺灣科技大學 增加電池電容量的連續製程設備
US20240287702A1 (en) * 2023-02-23 2024-08-29 Applied Materials, Inc. Methods of reducing or eliminating deposits in an electroplating system
CN116623266A (zh) * 2023-06-14 2023-08-22 昆山一鼎工业科技有限公司 电镀模具、电镀模块、电镀装置、电镀方法

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Also Published As

Publication number Publication date
CN104342747B (zh) 2019-04-16
TW201527605A (zh) 2015-07-16
KR20150017315A (ko) 2015-02-16
CN104342747A (zh) 2015-02-11
US20150041327A1 (en) 2015-02-12
JP2015030919A (ja) 2015-02-16
US10190232B2 (en) 2019-01-29
TW201843356A (zh) 2018-12-16
SG10201800707SA (en) 2018-02-27
SG10201404510YA (en) 2015-03-30
TWI657168B (zh) 2019-04-21
JP6502628B2 (ja) 2019-04-17

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