TW201843356A - 用以保持鎳電鍍浴中之ph值的設備與方法 - Google Patents

用以保持鎳電鍍浴中之ph值的設備與方法 Download PDF

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Publication number
TW201843356A
TW201843356A TW107132345A TW107132345A TW201843356A TW 201843356 A TW201843356 A TW 201843356A TW 107132345 A TW107132345 A TW 107132345A TW 107132345 A TW107132345 A TW 107132345A TW 201843356 A TW201843356 A TW 201843356A
Authority
TW
Taiwan
Prior art keywords
electroplating
electrolyte solution
bath
plating
anode
Prior art date
Application number
TW107132345A
Other languages
English (en)
Chinese (zh)
Inventor
L 巴克羅布萊恩
A 波努斯瓦彌湯瑪斯
佛利班
T 邁爾史蒂芬
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201843356A publication Critical patent/TW201843356A/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
TW107132345A 2013-08-06 2014-08-05 用以保持鎳電鍍浴中之ph值的設備與方法 TW201843356A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/960,624 US10190232B2 (en) 2013-08-06 2013-08-06 Apparatuses and methods for maintaining pH in nickel electroplating baths
US13/960,624 2013-08-06

Publications (1)

Publication Number Publication Date
TW201843356A true TW201843356A (zh) 2018-12-16

Family

ID=52447682

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107132345A TW201843356A (zh) 2013-08-06 2014-08-05 用以保持鎳電鍍浴中之ph值的設備與方法
TW103126801A TWI657168B (zh) 2013-08-06 2014-08-05 用以保持鎳電鍍浴中之ｐｈ値的設備與方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103126801A TWI657168B (zh) 2013-08-06 2014-08-05 用以保持鎳電鍍浴中之ｐｈ値的設備與方法

Country Status (6)

Country Link
US (1) US10190232B2 (https=)
JP (1) JP6502628B2 (https=)
KR (1) KR102303998B1 (https=)
CN (1) CN104342747B (https=)
SG (2) SG10201800707SA (https=)
TW (2) TW201843356A (https=)

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TWI789175B (zh) * 2021-12-23 2023-01-01 日商荏原製作所股份有限公司 鍍覆裝置之維護方法

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Publication number Priority date Publication date Assignee Title
TWI789175B (zh) * 2021-12-23 2023-01-01 日商荏原製作所股份有限公司 鍍覆裝置之維護方法

Also Published As

Publication number Publication date
CN104342747B (zh) 2019-04-16
TW201527605A (zh) 2015-07-16
KR102303998B1 (ko) 2021-09-23
KR20150017315A (ko) 2015-02-16
CN104342747A (zh) 2015-02-11
US20150041327A1 (en) 2015-02-12
JP2015030919A (ja) 2015-02-16
US10190232B2 (en) 2019-01-29
SG10201800707SA (en) 2018-02-27
SG10201404510YA (en) 2015-03-30
TWI657168B (zh) 2019-04-21
JP6502628B2 (ja) 2019-04-17

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