JP2014534340A5 - - Google Patents
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- Publication number
- JP2014534340A5 JP2014534340A5 JP2014535817A JP2014535817A JP2014534340A5 JP 2014534340 A5 JP2014534340 A5 JP 2014534340A5 JP 2014535817 A JP2014535817 A JP 2014535817A JP 2014535817 A JP2014535817 A JP 2014535817A JP 2014534340 A5 JP2014534340 A5 JP 2014534340A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- contacting
- laser direct
- activator solution
- direct structuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 21
- 238000000034 method Methods 0.000 claims 18
- 239000012190 activator Substances 0.000 claims 11
- 239000000243 solution Substances 0.000 claims 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 8
- 239000010949 copper Substances 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 7
- 239000003513 alkali Substances 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 4
- 238000007772 electroless plating Methods 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000012266 salt solution Substances 0.000 claims 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 claims 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims 1
- 239000012448 Lithium borohydride Substances 0.000 claims 1
- 101150003085 Pdcl gene Proteins 0.000 claims 1
- 239000004954 Polyphthalamide Substances 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims 1
- 230000003213 activating effect Effects 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- GMKDNCQTOAHUQG-UHFFFAOYSA-L dilithium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Li+].[Li+].[O-]S([O-])(=O)=S GMKDNCQTOAHUQG-UHFFFAOYSA-L 0.000 claims 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 claims 1
- 229940075933 dithionate Drugs 0.000 claims 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims 1
- 150000002902 organometallic compounds Chemical class 0.000 claims 1
- 229920006375 polyphtalamide Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 1
- 229960001755 resorcinol Drugs 0.000 claims 1
- 239000012279 sodium borohydride Substances 0.000 claims 1
- 229910000033 sodium borohydride Inorganic materials 0.000 claims 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims 1
- 235000010265 sodium sulphite Nutrition 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11184516.0 | 2011-10-10 | ||
| EP20110184516 EP2581469B1 (en) | 2011-10-10 | 2011-10-10 | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| PCT/US2012/059547 WO2013055786A1 (en) | 2011-10-10 | 2012-10-10 | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014534340A JP2014534340A (ja) | 2014-12-18 |
| JP2014534340A5 true JP2014534340A5 (enExample) | 2015-11-26 |
| JP6216717B2 JP6216717B2 (ja) | 2017-10-18 |
Family
ID=47040837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014535817A Active JP6216717B2 (ja) | 2011-10-10 | 2012-10-10 | レーザー・ダイレクト・ストラクチャリング基板上に銅を無電解堆積するための活性剤水溶液およびその方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9538665B2 (enExample) |
| EP (1) | EP2581469B1 (enExample) |
| JP (1) | JP6216717B2 (enExample) |
| KR (1) | KR102054351B1 (enExample) |
| CN (1) | CN104040025B (enExample) |
| WO (1) | WO2013055786A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013181781A1 (en) * | 2012-06-04 | 2013-12-12 | Nokia Corporation | An apparatus comprising conductive portions and a method of making the apparatus |
| CA2918939C (en) * | 2013-07-24 | 2021-10-26 | National Research Council Of Canada | Process for depositing metal on a substrate |
| CN105473930B (zh) | 2013-08-23 | 2019-03-19 | 莫列斯有限公司 | Led模块 |
| TWI561132B (en) * | 2013-11-01 | 2016-12-01 | Ind Tech Res Inst | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
| EP3108035B1 (en) * | 2014-01-27 | 2019-10-16 | BYD Company Limited | Method for metalizing polymer substrate |
| DE102014206558B4 (de) | 2014-04-04 | 2025-11-20 | Robert Bosch Gmbh | Verfahren zum Herstellen eines MID-Schaltungsträgers und MID-Schaltungsträger |
| DE102014114987A1 (de) | 2014-10-15 | 2016-04-21 | Lpkf Laser & Electronics Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein mit diesem Verfahren hergestelltes Trägermaterial |
| DE102015106079B3 (de) * | 2015-04-21 | 2016-07-28 | Lpkf Laser & Electronics Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein hierfür geeignetes nichtleitendes Trägermaterial |
| CN109072438B (zh) * | 2016-05-04 | 2021-08-13 | 德国艾托特克公司 | 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法 |
| CN109735830A (zh) * | 2019-02-19 | 2019-05-10 | 广东工业大学 | 一种活化液以及制备方法和碳纤维复合材料的制备方法 |
| CN111455358A (zh) * | 2020-06-01 | 2020-07-28 | 东莞市斯坦得电子材料有限公司 | 一种用于印制线路板的水平化学镀铜工艺 |
| CN114249944A (zh) * | 2021-12-27 | 2022-03-29 | 广东聚航新材料研究院有限公司 | 一种激光直接成型聚丙烯材料及其制备方法与应用 |
| CN115791834B (zh) * | 2023-01-04 | 2025-07-25 | 山东省路桥集团有限公司 | 焊缝检测用腐蚀凝胶、制备方法、腐蚀方法及焊缝表面裂纹检测方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
| US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
| WO1996020294A1 (en) * | 1994-12-27 | 1996-07-04 | Ibiden Co., Ltd. | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| EP0926262B1 (de) * | 1997-11-05 | 2003-03-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur selektiven Abscheidung einer Metallschicht |
| GB0025989D0 (en) * | 2000-10-24 | 2000-12-13 | Shipley Co Llc | Plating catalysts |
| DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
| DE102004005300A1 (de) | 2004-01-29 | 2005-09-08 | Atotech Deutschland Gmbh | Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens |
| DE102004017440A1 (de) | 2004-04-08 | 2005-11-03 | Enthone Inc., West Haven | Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen |
| ES2395736T3 (es) * | 2007-05-03 | 2013-02-14 | Atotech Deutschland Gmbh | Procedimiento para aplicar un revestimiento metálico a un substrato no conductor |
| JP2010080495A (ja) * | 2008-09-24 | 2010-04-08 | Hitachi Maxell Ltd | 配線パターンが形成されたプラスチック成形体の製造方法および配線パターンが形成されたプラスチック成形体 |
| US7998859B2 (en) * | 2008-09-25 | 2011-08-16 | Enthone Inc. | Surface preparation process for damascene copper deposition |
| JP2011001577A (ja) * | 2009-06-17 | 2011-01-06 | Hitachi Maxell Ltd | めっき膜を有するポリマー部材の製造方法 |
| DK2584066T3 (da) * | 2009-12-17 | 2014-07-14 | Byd Co Ltd | Overflademetalliseringsmetode, metode til fremstilling af plastgenstande og plastgenstand fremstillet heraf |
| US9435035B2 (en) * | 2010-01-15 | 2016-09-06 | Byd Company Limited | Metalized plastic articles and methods thereof |
| US8974869B2 (en) * | 2010-01-26 | 2015-03-10 | Robert Hamilton | Method for improving plating on non-conductive substrates |
| WO2012060776A1 (en) * | 2010-07-19 | 2012-05-10 | National University Of Singapore | Metal nanowires, nanomesh and a method of fabrication |
| CN102071411B (zh) * | 2010-08-19 | 2012-05-30 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
| KR101629342B1 (ko) * | 2010-10-25 | 2016-06-13 | 사빅 글로벌 테크놀러지스 비.브이. | 레이저 직접 성형 물질의 향상된 무전해 도금 막 성능 |
-
2011
- 2011-10-10 EP EP20110184516 patent/EP2581469B1/en active Active
-
2012
- 2012-10-10 KR KR1020147012709A patent/KR102054351B1/ko active Active
- 2012-10-10 US US14/350,971 patent/US9538665B2/en active Active
- 2012-10-10 JP JP2014535817A patent/JP6216717B2/ja active Active
- 2012-10-10 CN CN201280060646.8A patent/CN104040025B/zh active Active
- 2012-10-10 WO PCT/US2012/059547 patent/WO2013055786A1/en not_active Ceased
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