JP2011509344A5 - - Google Patents

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Publication number
JP2011509344A5
JP2011509344A5 JP2010539924A JP2010539924A JP2011509344A5 JP 2011509344 A5 JP2011509344 A5 JP 2011509344A5 JP 2010539924 A JP2010539924 A JP 2010539924A JP 2010539924 A JP2010539924 A JP 2010539924A JP 2011509344 A5 JP2011509344 A5 JP 2011509344A5
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JP
Japan
Prior art keywords
solution
oxide surface
electronic device
binder
catalyst
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JP2010539924A
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English (en)
Japanese (ja)
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JP2011509344A (ja
JP5982092B2 (ja
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Priority claimed from US12/334,460 external-priority patent/US20090162681A1/en
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Publication of JP2011509344A publication Critical patent/JP2011509344A/ja
Publication of JP2011509344A5 publication Critical patent/JP2011509344A5/ja
Application granted granted Critical
Publication of JP5982092B2 publication Critical patent/JP5982092B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010539924A 2007-12-21 2008-12-20 誘電体層の無電解メッキ用活性化溶液 Expired - Fee Related JP5982092B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US1643907P 2007-12-21 2007-12-21
US61/016,439 2007-12-21
US12/334,460 2008-12-13
US12/334,460 US20090162681A1 (en) 2007-12-21 2008-12-13 Activation solution for electroless plating on dielectric layers
PCT/US2008/087877 WO2009086230A2 (en) 2007-12-21 2008-12-20 Activation solution for electroless plating on dielectric layers

Publications (3)

Publication Number Publication Date
JP2011509344A JP2011509344A (ja) 2011-03-24
JP2011509344A5 true JP2011509344A5 (enExample) 2012-02-02
JP5982092B2 JP5982092B2 (ja) 2016-08-31

Family

ID=40789021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010539924A Expired - Fee Related JP5982092B2 (ja) 2007-12-21 2008-12-20 誘電体層の無電解メッキ用活性化溶液

Country Status (6)

Country Link
US (1) US20090162681A1 (enExample)
JP (1) JP5982092B2 (enExample)
KR (1) KR20100105722A (enExample)
CN (2) CN105671524B (enExample)
TW (1) TWI494164B (enExample)
WO (1) WO2009086230A2 (enExample)

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FR2950633B1 (fr) * 2009-09-30 2011-11-25 Alchimer Solution et procede d'activation de la surface oxydee d'un substrat semi-conducteur.
US8895441B2 (en) * 2012-02-24 2014-11-25 Lam Research Corporation Methods and materials for anchoring gapfill metals
TWI672737B (zh) * 2013-12-27 2019-09-21 美商蘭姆研究公司 允許低電阻率鎢特徵物填充之鎢成核程序
JP2019057572A (ja) 2017-09-20 2019-04-11 東芝メモリ株式会社 金属配線の形成方法
TWI672175B (zh) 2017-10-20 2019-09-21 國立清華大學 自吸附觸媒組成物、自吸附觸媒組成物的製造方法以及無電鍍基板的製造方法
CN109692707A (zh) * 2017-10-23 2019-04-30 卫子健 自吸附催化剂组成物及其制造方法、及无电镀基板的制造方法
CN108486552B (zh) * 2018-05-14 2020-07-17 合肥学院 一种聚合物基材表面高品质化学镀层的制备方法
CN113424300B (zh) 2018-12-14 2025-05-09 朗姆研究公司 在3d nand结构上的原子层沉积
WO2020210260A1 (en) 2019-04-11 2020-10-15 Lam Research Corporation High step coverage tungsten deposition
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CN116081627B (zh) * 2023-02-15 2024-06-25 盐城工学院 一种多孔SiOx@C复合材料的原位液相制备方法

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