JP2014534336A5 - - Google Patents

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Publication number
JP2014534336A5
JP2014534336A5 JP2014533979A JP2014533979A JP2014534336A5 JP 2014534336 A5 JP2014534336 A5 JP 2014534336A5 JP 2014533979 A JP2014533979 A JP 2014533979A JP 2014533979 A JP2014533979 A JP 2014533979A JP 2014534336 A5 JP2014534336 A5 JP 2014534336A5
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JP
Japan
Prior art keywords
layer
ald
oxide layer
inorganic oxide
thickness
Prior art date
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Application number
JP2014533979A
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English (en)
Japanese (ja)
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JP2014534336A (ja
JP6096783B2 (ja
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Publication date
Priority claimed from GBGB1117242.6A external-priority patent/GB201117242D0/en
Application filed filed Critical
Publication of JP2014534336A publication Critical patent/JP2014534336A/ja
Publication of JP2014534336A5 publication Critical patent/JP2014534336A5/ja
Application granted granted Critical
Publication of JP6096783B2 publication Critical patent/JP6096783B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014533979A 2011-10-06 2012-09-26 大気圧プラズマ法によるコーティング作製方法 Expired - Fee Related JP6096783B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1117242.6A GB201117242D0 (en) 2011-10-06 2011-10-06 Method and device for manufacturing a barrier layer on a flexible subtrate
GB1117242.6 2011-10-06
PCT/GB2012/052378 WO2013050741A1 (en) 2011-10-06 2012-09-26 A method for producing a coating by atmospheric pressure plasma technology

Publications (3)

Publication Number Publication Date
JP2014534336A JP2014534336A (ja) 2014-12-18
JP2014534336A5 true JP2014534336A5 (enExample) 2015-11-12
JP6096783B2 JP6096783B2 (ja) 2017-03-15

Family

ID=45035243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014533979A Expired - Fee Related JP6096783B2 (ja) 2011-10-06 2012-09-26 大気圧プラズマ法によるコーティング作製方法

Country Status (5)

Country Link
US (1) US20140242365A1 (enExample)
EP (1) EP2764133B1 (enExample)
JP (1) JP6096783B2 (enExample)
GB (1) GB201117242D0 (enExample)
WO (1) WO2013050741A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665843B1 (ko) * 2012-09-06 2016-10-12 가부시끼가이샤 구레하 비수 전해질 2차 전지 음극용 탄소질 재료 및 이의 제조 방법
EP2935648B1 (en) * 2012-12-21 2019-08-28 AGC Inc. Pair of electrodes for dbd plasma process
KR102244070B1 (ko) * 2014-01-07 2021-04-26 삼성디스플레이 주식회사 기상 증착 장치, 기상 증착 방법 및 유기 발광 표시 장치 제조 방법
JP2015166170A (ja) * 2014-03-04 2015-09-24 東洋製罐グループホールディングス株式会社 ガスバリア性積層体
JP2015178231A (ja) * 2014-03-19 2015-10-08 東洋製罐グループホールディングス株式会社 ガスバリア性積層構造体
EP3115197A4 (en) * 2014-03-04 2017-10-25 Toyo Seikan Group Holdings, Ltd. Gas barrier laminate
CN106661727B (zh) * 2014-07-29 2020-05-05 凸版印刷株式会社 层叠体及其制造方法、以及阻气膜及其制造方法
DE102015115329A1 (de) * 2015-09-11 2017-03-16 Hanwha Q Cells Gmbh Verfahren zur plasmaunterstützten Abscheidung von Aluminiumoxiddünnschichten auf Halbleiterwafern für die Herstellung von Wafersolarzellen und Inline-PECVD-Anlage
CN107254675B (zh) * 2017-06-07 2019-07-09 华中科技大学 一种纳米颗粒空间原子层沉积连续包覆装置及方法
CN113302334A (zh) * 2019-01-25 2021-08-24 应用材料公司 形成湿气和氧气阻挡涂层的方法
EP4095283A1 (en) * 2021-05-25 2022-11-30 Molecular Plasma Group SA Method and system for coating filter media

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GB8427943D0 (en) * 1984-11-05 1984-12-12 Alcan Int Ltd Anodic aluminium oxide film
US6391785B1 (en) 1999-08-24 2002-05-21 Interuniversitair Microelektronica Centrum (Imec) Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
US7098131B2 (en) 2001-07-19 2006-08-29 Samsung Electronics Co., Ltd. Methods for forming atomic layers and thin films including tantalum nitride and devices including the same
US7045010B2 (en) * 2001-09-06 2006-05-16 Alcatel Applicator for high-speed gel buffering of flextube optical fiber bundles
US6756318B2 (en) 2001-09-10 2004-06-29 Tegal Corporation Nanolayer thick film processing system and method
EP1351321B1 (en) * 2002-04-01 2013-12-25 Konica Corporation Support and organic electroluminescence element comprising the support
US6774569B2 (en) 2002-07-11 2004-08-10 Fuji Photo Film B.V. Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions
US7288204B2 (en) 2002-07-19 2007-10-30 Fuji Photo Film B.V. Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG)
EP1403902A1 (en) 2002-09-30 2004-03-31 Fuji Photo Film B.V. Method and arrangement for generating an atmospheric pressure glow discharge plasma (APG)
DE602004003697T2 (de) 2004-08-13 2007-10-04 Fuji Film Manufacturing Europe B.V. Verfahren und Vorrichtung zur Steuerung eines Glühentladungsplasmas unter atmosphärischem Druck
JP5543203B2 (ja) * 2006-06-16 2014-07-09 フジフィルム マニュファクチャリング ユーロプ ビー．ブイ． 大気圧グロー放電プラズマを使用した原子層堆積の方法及び装置
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JP2010535291A (ja) * 2007-07-30 2010-11-18 ダウ グローバル テクノロジーズ インコーポレイティド 大気圧プラズマ化学蒸着方法
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US20090311496A1 (en) * 2008-06-17 2009-12-17 Ford Global Technologies, Llc Intermediate Coating Compositions and Methods of Using the Same
US20100132762A1 (en) * 2008-12-02 2010-06-03 Georgia Tech Research Corporation Environmental barrier coating for organic semiconductor devices and methods thereof
KR101040175B1 (ko) * 2008-12-11 2011-06-16 한국전자통신연구원 연성 기판 및 그의 제조 방법
EP2226832A1 (en) 2009-03-06 2010-09-08 FUJIFILM Manufacturing Europe B.V. Substrate plasma treatment using side tabs
JP5912228B2 (ja) * 2010-05-17 2016-04-27 凸版印刷株式会社 ガスバリア性積層体の製造方法

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