JP6096783B2 - 大気圧プラズマ法によるコーティング作製方法 - Google Patents
大気圧プラズマ法によるコーティング作製方法 Download PDFInfo
- Publication number
- JP6096783B2 JP6096783B2 JP2014533979A JP2014533979A JP6096783B2 JP 6096783 B2 JP6096783 B2 JP 6096783B2 JP 2014533979 A JP2014533979 A JP 2014533979A JP 2014533979 A JP2014533979 A JP 2014533979A JP 6096783 B2 JP6096783 B2 JP 6096783B2
- Authority
- JP
- Japan
- Prior art keywords
- ald
- substrate
- plasma
- layer
- atmospheric pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Chemical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1117242.6A GB201117242D0 (en) | 2011-10-06 | 2011-10-06 | Method and device for manufacturing a barrier layer on a flexible subtrate |
| GB1117242.6 | 2011-10-06 | ||
| PCT/GB2012/052378 WO2013050741A1 (en) | 2011-10-06 | 2012-09-26 | A method for producing a coating by atmospheric pressure plasma technology |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014534336A JP2014534336A (ja) | 2014-12-18 |
| JP2014534336A5 JP2014534336A5 (enExample) | 2015-11-12 |
| JP6096783B2 true JP6096783B2 (ja) | 2017-03-15 |
Family
ID=45035243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014533979A Expired - Fee Related JP6096783B2 (ja) | 2011-10-06 | 2012-09-26 | 大気圧プラズマ法によるコーティング作製方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20140242365A1 (enExample) |
| EP (1) | EP2764133B1 (enExample) |
| JP (1) | JP6096783B2 (enExample) |
| GB (1) | GB201117242D0 (enExample) |
| WO (1) | WO2013050741A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4095283A1 (en) * | 2021-05-25 | 2022-11-30 | Molecular Plasma Group SA | Method and system for coating filter media |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101665843B1 (ko) * | 2012-09-06 | 2016-10-12 | 가부시끼가이샤 구레하 | 비수 전해질 2차 전지 음극용 탄소질 재료 및 이의 제조 방법 |
| EP2935648B1 (en) * | 2012-12-21 | 2019-08-28 | AGC Inc. | Pair of electrodes for dbd plasma process |
| KR102244070B1 (ko) * | 2014-01-07 | 2021-04-26 | 삼성디스플레이 주식회사 | 기상 증착 장치, 기상 증착 방법 및 유기 발광 표시 장치 제조 방법 |
| JP2015166170A (ja) * | 2014-03-04 | 2015-09-24 | 東洋製罐グループホールディングス株式会社 | ガスバリア性積層体 |
| JP2015178231A (ja) * | 2014-03-19 | 2015-10-08 | 東洋製罐グループホールディングス株式会社 | ガスバリア性積層構造体 |
| EP3115197A4 (en) * | 2014-03-04 | 2017-10-25 | Toyo Seikan Group Holdings, Ltd. | Gas barrier laminate |
| CN106661727B (zh) * | 2014-07-29 | 2020-05-05 | 凸版印刷株式会社 | 层叠体及其制造方法、以及阻气膜及其制造方法 |
| DE102015115329A1 (de) * | 2015-09-11 | 2017-03-16 | Hanwha Q Cells Gmbh | Verfahren zur plasmaunterstützten Abscheidung von Aluminiumoxiddünnschichten auf Halbleiterwafern für die Herstellung von Wafersolarzellen und Inline-PECVD-Anlage |
| CN107254675B (zh) * | 2017-06-07 | 2019-07-09 | 华中科技大学 | 一种纳米颗粒空间原子层沉积连续包覆装置及方法 |
| CN113302334A (zh) * | 2019-01-25 | 2021-08-24 | 应用材料公司 | 形成湿气和氧气阻挡涂层的方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8427943D0 (en) * | 1984-11-05 | 1984-12-12 | Alcan Int Ltd | Anodic aluminium oxide film |
| US6391785B1 (en) | 1999-08-24 | 2002-05-21 | Interuniversitair Microelektronica Centrum (Imec) | Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| US7098131B2 (en) | 2001-07-19 | 2006-08-29 | Samsung Electronics Co., Ltd. | Methods for forming atomic layers and thin films including tantalum nitride and devices including the same |
| US7045010B2 (en) * | 2001-09-06 | 2006-05-16 | Alcatel | Applicator for high-speed gel buffering of flextube optical fiber bundles |
| US6756318B2 (en) | 2001-09-10 | 2004-06-29 | Tegal Corporation | Nanolayer thick film processing system and method |
| EP1351321B1 (en) * | 2002-04-01 | 2013-12-25 | Konica Corporation | Support and organic electroluminescence element comprising the support |
| US6774569B2 (en) | 2002-07-11 | 2004-08-10 | Fuji Photo Film B.V. | Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions |
| US7288204B2 (en) | 2002-07-19 | 2007-10-30 | Fuji Photo Film B.V. | Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG) |
| EP1403902A1 (en) | 2002-09-30 | 2004-03-31 | Fuji Photo Film B.V. | Method and arrangement for generating an atmospheric pressure glow discharge plasma (APG) |
| DE602004003697T2 (de) | 2004-08-13 | 2007-10-04 | Fuji Film Manufacturing Europe B.V. | Verfahren und Vorrichtung zur Steuerung eines Glühentladungsplasmas unter atmosphärischem Druck |
| JP5543203B2 (ja) * | 2006-06-16 | 2014-07-09 | フジフィルム マニュファクチャリング ユーロプ ビー.ブイ. | 大気圧グロー放電プラズマを使用した原子層堆積の方法及び装置 |
| ES2543593T3 (es) * | 2007-04-04 | 2015-08-20 | Tetra Laval Holdings & Finance S.A. | Laminado de envasado, método para fabricar el laminado de envasado y recipiente de envasado producido a partir del mismo |
| US20080303744A1 (en) * | 2007-06-11 | 2008-12-11 | Tokyo Electron Limited | Plasma processing system, antenna, and use of plasma processing system |
| JP2010535291A (ja) * | 2007-07-30 | 2010-11-18 | ダウ グローバル テクノロジーズ インコーポレイティド | 大気圧プラズマ化学蒸着方法 |
| EP2188413B1 (en) | 2007-09-07 | 2018-07-11 | Fujifilm Manufacturing Europe B.V. | Method for atomic layer deposition using an atmospheric pressure glow discharge plasma |
| EP2203257A2 (en) * | 2007-10-15 | 2010-07-07 | Dow Global Technologies Inc. | Process for plasma coating a polypropylene object |
| TWI388078B (zh) * | 2008-01-30 | 2013-03-01 | 歐斯朗奧托半導體股份有限公司 | 電子組件之製造方法及電子組件 |
| WO2009104957A1 (en) | 2008-02-21 | 2009-08-27 | Fujifilm Manufacturing Europe B.V. | Plasma treatment apparatus and method for treatment of a substrate with atmospheric pressure glow discharge electrode configuration |
| US20090311496A1 (en) * | 2008-06-17 | 2009-12-17 | Ford Global Technologies, Llc | Intermediate Coating Compositions and Methods of Using the Same |
| US20100132762A1 (en) * | 2008-12-02 | 2010-06-03 | Georgia Tech Research Corporation | Environmental barrier coating for organic semiconductor devices and methods thereof |
| KR101040175B1 (ko) * | 2008-12-11 | 2011-06-16 | 한국전자통신연구원 | 연성 기판 및 그의 제조 방법 |
| EP2226832A1 (en) | 2009-03-06 | 2010-09-08 | FUJIFILM Manufacturing Europe B.V. | Substrate plasma treatment using side tabs |
| JP5912228B2 (ja) * | 2010-05-17 | 2016-04-27 | 凸版印刷株式会社 | ガスバリア性積層体の製造方法 |
-
2011
- 2011-10-06 GB GBGB1117242.6A patent/GB201117242D0/en not_active Ceased
-
2012
- 2012-09-26 US US14/349,472 patent/US20140242365A1/en not_active Abandoned
- 2012-09-26 WO PCT/GB2012/052378 patent/WO2013050741A1/en not_active Ceased
- 2012-09-26 EP EP12770196.9A patent/EP2764133B1/en active Active
- 2012-09-26 JP JP2014533979A patent/JP6096783B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4095283A1 (en) * | 2021-05-25 | 2022-11-30 | Molecular Plasma Group SA | Method and system for coating filter media |
| WO2022248610A1 (en) * | 2021-05-25 | 2022-12-01 | Molecular Plasma Group Sa | Method and system for coating filter media |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2764133A1 (en) | 2014-08-13 |
| EP2764133B1 (en) | 2019-12-18 |
| GB201117242D0 (en) | 2011-11-16 |
| JP2014534336A (ja) | 2014-12-18 |
| US20140242365A1 (en) | 2014-08-28 |
| WO2013050741A1 (en) | 2013-04-11 |
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