JP2013188968A5 - - Google Patents

Download PDF

Info

Publication number
JP2013188968A5
JP2013188968A5 JP2012057638A JP2012057638A JP2013188968A5 JP 2013188968 A5 JP2013188968 A5 JP 2013188968A5 JP 2012057638 A JP2012057638 A JP 2012057638A JP 2012057638 A JP2012057638 A JP 2012057638A JP 2013188968 A5 JP2013188968 A5 JP 2013188968A5
Authority
JP
Japan
Prior art keywords
silicon substrate
substrate
oxide film
laminated
sequentially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012057638A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013188968A (ja
JP5645863B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012057638A priority Critical patent/JP5645863B2/ja
Priority claimed from JP2012057638A external-priority patent/JP5645863B2/ja
Priority to US13/802,603 priority patent/US8685763B2/en
Priority to CN201310080906.4A priority patent/CN103302987B/zh
Publication of JP2013188968A publication Critical patent/JP2013188968A/ja
Publication of JP2013188968A5 publication Critical patent/JP2013188968A5/ja
Application granted granted Critical
Publication of JP5645863B2 publication Critical patent/JP5645863B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012057638A 2012-03-14 2012-03-14 ノズルプレートの製造方法 Expired - Fee Related JP5645863B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012057638A JP5645863B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法
US13/802,603 US8685763B2 (en) 2012-03-14 2013-03-13 Method of manufacturing nozzle plate
CN201310080906.4A CN103302987B (zh) 2012-03-14 2013-03-14 制造喷嘴板的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012057638A JP5645863B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法

Publications (3)

Publication Number Publication Date
JP2013188968A JP2013188968A (ja) 2013-09-26
JP2013188968A5 true JP2013188968A5 (enExample) 2013-11-07
JP5645863B2 JP5645863B2 (ja) 2014-12-24

Family

ID=49128895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012057638A Expired - Fee Related JP5645863B2 (ja) 2012-03-14 2012-03-14 ノズルプレートの製造方法

Country Status (3)

Country Link
US (1) US8685763B2 (enExample)
JP (1) JP5645863B2 (enExample)
CN (1) CN103302987B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013103392A (ja) 2011-11-14 2013-05-30 Seiko Epson Corp 液体噴射装置
CN103998246B (zh) * 2011-12-21 2016-12-14 惠普发展公司，有限责任合伙企业 流体分配器
US10189704B2 (en) * 2013-06-15 2019-01-29 Brookhaven Science Associates, Llc Formation of superhydrophobic surfaces
JP6333016B2 (ja) * 2014-03-28 2018-05-30 キヤノン株式会社 液体吐出ヘッドの製造方法
US10744765B2 (en) 2016-09-12 2020-08-18 Konica Minolta, Inc. Liquid droplet ejection head and liquid droplet ejection apparatus
CN106541706B (zh) * 2016-09-30 2019-04-16 西安交通大学 一种直通式压电喷墨打印头及其制造方法
US11179935B2 (en) * 2019-02-19 2021-11-23 Canon Kabushiki Kaisha Liquid ejection head, liquid ejection module, and method of manufacturing liquid ejection head
JPWO2022054153A1 (enExample) 2020-09-09 2022-03-17
WO2022208701A1 (ja) * 2021-03-31 2022-10-06 コニカミノルタ株式会社 ノズルプレートの製造方法、ノズルプレート及び流体吐出ヘッド
JP7820694B2 (ja) * 2022-01-19 2026-02-26 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
US5589083A (en) 1993-12-11 1996-12-31 Electronics And Telecommunications Research Institute Method of manufacturing microstructure by the anisotropic etching and bonding of substrates
JPH09216360A (ja) * 1996-02-15 1997-08-19 Seiko Epson Corp インクジェットヘッド及びその製造方法
US7347532B2 (en) * 2004-08-05 2008-03-25 Fujifilm Dimatix, Inc. Print head nozzle formation
JP2008049673A (ja) * 2006-08-28 2008-03-06 Fujifilm Corp ノズル板の製造方法および液体吐出ヘッドの製造方法
JP4832325B2 (ja) * 2007-02-02 2011-12-07 富士フイルム株式会社 ノズルプレートおよび画像形成装置
US8197029B2 (en) * 2008-12-30 2012-06-12 Fujifilm Corporation Forming nozzles

Similar Documents

Publication Publication Date Title
JP2013188968A5 (enExample)
JP2013038399A5 (ja) 半導体装置
WO2013134592A3 (en) Atomic layer deposition strengthening members and method of manufacture
JP2014531900A5 (enExample)
WO2015013631A3 (en) Electrochromic films and related methods thereof
EP4283676A3 (en) Precision resistor for non-planar semiconductor device architecture
SG11201505056WA (en) Substrate for mask blank, substrate with multilayer reflective film, reflective mask blank, reflective mask, method of manufacturing for substrate for mask blank, method of manufacturing for substrate with multilayer reflective film, and method of manufacturing semiconductor device
JP2010242187A5 (enExample)
JP2013153140A5 (ja) 半導体装置の作製方法
WO2012129210A3 (en) Functional insert with power layer
JP2011216780A5 (enExample)
EP2407575A4 (en) CLEAR CONDUCTIVE TRANSPARENT TRANSPARENT CONDUCTIVE FILM AND LAMINATE, METHODS OF MAKING SAME, AND SILICON THIN FILM SOLAR CELL
WO2014070534A3 (en) Integrated bondline spacers
EP2676991A4 (en) SUBSTRATE FILM AND METHOD FOR THE PRODUCTION THEREOF
JP2014237545A5 (enExample)
EP2698399A4 (en) RESIN COMPOSITION, MULTILAYER FILM AND PHOTOVOLTAIC MODULE THEREWITH
JP2014107448A5 (enExample)
JP2010532504A5 (enExample)
WO2012099794A3 (en) Optical film stack
BRPI0809525A2 (pt) Laminador de substrato de credencial, e, método para laminar um substrato de credencial
JP2012015496A5 (enExample)
JP2015025200A5 (ja) 酸化物半導体膜
WO2016100303A3 (en) Photolithography based fabrication of 3d structures
JP2010287883A5 (ja) 基板及び基板の作製方法
JP2015115404A5 (enExample)