JP2014532992A5 - - Google Patents

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Publication number
JP2014532992A5
JP2014532992A5 JP2014539062A JP2014539062A JP2014532992A5 JP 2014532992 A5 JP2014532992 A5 JP 2014532992A5 JP 2014539062 A JP2014539062 A JP 2014539062A JP 2014539062 A JP2014539062 A JP 2014539062A JP 2014532992 A5 JP2014532992 A5 JP 2014532992A5
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JP
Japan
Prior art keywords
wafer
clamp
end surface
gripping member
arm
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JP2014539062A
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English (en)
Japanese (ja)
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JP6167108B2 (ja
JP2014532992A (ja
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Priority claimed from PCT/US2012/062194 external-priority patent/WO2013066758A1/en
Publication of JP2014532992A publication Critical patent/JP2014532992A/ja
Publication of JP2014532992A5 publication Critical patent/JP2014532992A5/ja
Application granted granted Critical
Publication of JP6167108B2 publication Critical patent/JP6167108B2/ja
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JP2014539062A 2011-10-31 2012-10-26 結合ウェハ構造体を劈開させるための固定装置及び劈開方法 Active JP6167108B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161553447P 2011-10-31 2011-10-31
US61/553,447 2011-10-31
PCT/US2012/062194 WO2013066758A1 (en) 2011-10-31 2012-10-26 Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving

Publications (3)

Publication Number Publication Date
JP2014532992A JP2014532992A (ja) 2014-12-08
JP2014532992A5 true JP2014532992A5 (enExample) 2015-12-03
JP6167108B2 JP6167108B2 (ja) 2017-07-19

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JP2014539062A Active JP6167108B2 (ja) 2011-10-31 2012-10-26 結合ウェハ構造体を劈開させるための固定装置及び劈開方法

Country Status (7)

Country Link
US (3) US9165802B2 (enExample)
EP (1) EP2774176B1 (enExample)
JP (1) JP6167108B2 (enExample)
KR (1) KR102061359B1 (enExample)
CN (1) CN104025277A (enExample)
TW (1) TWI622119B (enExample)
WO (1) WO2013066758A1 (enExample)

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KR102061359B1 (ko) * 2011-10-31 2019-12-31 글로벌웨이퍼스 씨오., 엘티디. 본딩된 웨이퍼 구조물 절개를 위한 클램핑 장치 및 절개 방법
WO2015113591A1 (de) * 2014-01-28 2015-08-06 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum lösen eines ersten substrats
CN104505363A (zh) * 2014-12-25 2015-04-08 苏州凯锝微电子有限公司 一种晶圆夹持装置
CN104701233B (zh) * 2015-03-10 2017-10-17 北京七星华创电子股份有限公司 一种盘状物夹持装置
JP6470414B2 (ja) * 2015-08-11 2019-02-13 東京応化工業株式会社 支持体分離装置及び支持体分離方法
US10272661B2 (en) 2017-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Pad removal device and method
KR102483443B1 (ko) * 2018-08-14 2023-01-04 삼성전자주식회사 기판 접합 장치 및 이를 구비하는 기판 접합 설비와 이를 이용한 기판의 접합방법
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
FR3093715B1 (fr) * 2019-03-15 2021-03-05 Soitec Silicon On Insulator Dispositif de maintien pour un ensemble à fracturer
FR3093858B1 (fr) * 2019-03-15 2021-03-05 Soitec Silicon On Insulator Procédé de transfert d’une couche utile sur un substrat support
CN110640324B (zh) * 2019-09-02 2022-06-10 中芯集成电路（宁波）有限公司 一种晶圆双面制作系统
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置
JP7471862B2 (ja) 2020-02-27 2024-04-22 キオクシア株式会社 貼合装置および貼合方法
JP7339905B2 (ja) 2020-03-13 2023-09-06 キオクシア株式会社 貼合装置および貼合方法
US20250180453A1 (en) * 2023-12-04 2025-06-05 Tokyo Electron Limited Torsional shear testing for semiconductor surface bonds

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