JP2017526977A5 - - Google Patents
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- JP2017526977A5 JP2017526977A5 JP2017512630A JP2017512630A JP2017526977A5 JP 2017526977 A5 JP2017526977 A5 JP 2017526977A5 JP 2017512630 A JP2017512630 A JP 2017512630A JP 2017512630 A JP2017512630 A JP 2017512630A JP 2017526977 A5 JP2017526977 A5 JP 2017526977A5
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- JP
- Japan
- Prior art keywords
- substrate
- curable material
- amount
- elements
- curable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 28
- 230000010076 replication Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004049 embossing Methods 0.000 claims description 3
- 230000009969 flowable effect Effects 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 8
- 230000003287 optical effect Effects 0.000 claims 2
- 238000004587 chromatography analysis Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 230000003362 replicative effect Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020030681A JP6987907B2 (ja) | 2014-05-16 | 2020-02-26 | 装置の、特に光学装置のウェーハレベル方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461994358P | 2014-05-16 | 2014-05-16 | |
| US61/994,358 | 2014-05-16 | ||
| PCT/SG2015/050113 WO2015174930A1 (en) | 2014-05-16 | 2015-05-14 | Wafer-level maufacture of devices, in particular of optical devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020030681A Division JP6987907B2 (ja) | 2014-05-16 | 2020-02-26 | 装置の、特に光学装置のウェーハレベル方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017526977A JP2017526977A (ja) | 2017-09-14 |
| JP2017526977A5 true JP2017526977A5 (enExample) | 2018-06-21 |
Family
ID=54480324
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017512630A Pending JP2017526977A (ja) | 2014-05-16 | 2015-05-14 | 装置の、特に光学装置のウェーハレベル製造 |
| JP2020030681A Active JP6987907B2 (ja) | 2014-05-16 | 2020-02-26 | 装置の、特に光学装置のウェーハレベル方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020030681A Active JP6987907B2 (ja) | 2014-05-16 | 2020-02-26 | 装置の、特に光学装置のウェーハレベル方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10682824B2 (enExample) |
| EP (1) | EP3142859B1 (enExample) |
| JP (2) | JP2017526977A (enExample) |
| KR (1) | KR102352424B1 (enExample) |
| CN (1) | CN106573460B (enExample) |
| SG (2) | SG11201609001TA (enExample) |
| TW (1) | TWI710455B (enExample) |
| WO (1) | WO2015174930A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2016689B1 (en) * | 2016-04-28 | 2017-11-20 | Anteryon Wafer Optics B V | Replication tool |
| US10867955B2 (en) * | 2018-09-27 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure having adhesive layer surrounded dam structure |
| CN109116680A (zh) * | 2018-09-27 | 2019-01-01 | 京东方科技集团股份有限公司 | 压印模板及其制作方法 |
| DE112020001167B4 (de) * | 2019-03-12 | 2025-05-15 | Focuslight Singapore Pte. Ltd. | Yard Control Merkmale |
| US20220227081A1 (en) * | 2019-05-30 | 2022-07-21 | Ams Sensors Singapore Pte. Ltd. | Method of replicating optical elements and replicated optical elements |
| GB2594998A (en) * | 2020-05-15 | 2021-11-17 | Ams Sensors Asia Pte Ltd | Wafer level chip scale packaging |
| CN115097553B (zh) * | 2022-06-24 | 2023-10-31 | 京东方科技集团股份有限公司 | 微透镜阵列基板及其制备方法、显示装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4963148B2 (ja) * | 2001-09-18 | 2012-06-27 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TW544894B (en) * | 2002-04-10 | 2003-08-01 | Siliconware Precision Industries Co Ltd | Chip carrier with dam bar |
| EP1443344A1 (en) * | 2003-01-29 | 2004-08-04 | Heptagon Oy | Manufacturing micro-structured elements |
| US20040241323A1 (en) * | 2003-05-29 | 2004-12-02 | 3M Innovative Properties Company | Method for applying adhesive to a substrate |
| JP4362380B2 (ja) * | 2004-01-13 | 2009-11-11 | フジノン株式会社 | 光学素子の成形方法及び組み合わせ光学素子 |
| US20070216046A1 (en) | 2006-03-20 | 2007-09-20 | Heptagon Oy | Manufacturing miniature structured elements with tool incorporating spacer elements |
| US20070216048A1 (en) | 2006-03-20 | 2007-09-20 | Heptagon Oy | Manufacturing optical elements |
| US20080113160A1 (en) | 2006-11-14 | 2008-05-15 | Glimmerglass Networks, Inc. | Method And Apparatus For Localized Bonding |
| JP4507126B2 (ja) * | 2007-10-29 | 2010-07-21 | ソニー株式会社 | 偏光板の製造方法 |
| US20090159200A1 (en) | 2007-12-19 | 2009-06-25 | Heptagon Oy | Spacer element and method for manufacturing a spacer element |
| JP2009204752A (ja) | 2008-02-26 | 2009-09-10 | Sanyo Electric Co Ltd | 複合レンズ |
| JP2010052086A (ja) | 2008-08-28 | 2010-03-11 | Oki Semiconductor Co Ltd | 半導体装置及びその製造方法 |
| JP5047243B2 (ja) * | 2008-09-26 | 2012-10-10 | シャープ株式会社 | 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
| CN102458807B (zh) | 2009-06-12 | 2014-10-22 | 柯尼卡美能达精密光学株式会社 | 晶片透镜的制造方法，中间模具、光学部件、成型模具以及成型模具的制造方法 |
| US20130273238A1 (en) | 2012-04-16 | 2013-10-17 | Peter S. Andrews | Inverted Curing of Liquid Optoelectronic Lenses |
| WO2013179765A1 (ja) | 2012-05-30 | 2013-12-05 | オリンパス株式会社 | 撮像装置の製造方法および半導体装置の製造方法 |
| CN107479119A (zh) | 2012-09-11 | 2017-12-15 | 新加坡恒立私人有限公司 | 截断型镜片、截断型镜片对及相应装置的制造 |
| JPWO2014092148A1 (ja) | 2012-12-15 | 2017-01-12 | コニカミノルタ株式会社 | レンズアレイ構造体の製造方法及びレンズアレイ構造体 |
-
2015
- 2015-05-14 CN CN201580025271.5A patent/CN106573460B/zh active Active
- 2015-05-14 WO PCT/SG2015/050113 patent/WO2015174930A1/en not_active Ceased
- 2015-05-14 JP JP2017512630A patent/JP2017526977A/ja active Pending
- 2015-05-14 KR KR1020167035043A patent/KR102352424B1/ko active Active
- 2015-05-14 US US15/310,838 patent/US10682824B2/en active Active
- 2015-05-14 EP EP15793119.7A patent/EP3142859B1/en active Active
- 2015-05-14 SG SG11201609001TA patent/SG11201609001TA/en unknown
- 2015-05-14 SG SG10201810219TA patent/SG10201810219TA/en unknown
- 2015-05-14 TW TW104115387A patent/TWI710455B/zh active
-
2020
- 2020-02-26 JP JP2020030681A patent/JP6987907B2/ja active Active
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