JP2019129165A5 - - Google Patents

Download PDF

Info

Publication number
JP2019129165A5
JP2019129165A5 JP2018007730A JP2018007730A JP2019129165A5 JP 2019129165 A5 JP2019129165 A5 JP 2019129165A5 JP 2018007730 A JP2018007730 A JP 2018007730A JP 2018007730 A JP2018007730 A JP 2018007730A JP 2019129165 A5 JP2019129165 A5 JP 2019129165A5
Authority
JP
Japan
Prior art keywords
substrate
holding
bonding
information
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018007730A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019129165A (ja
JP7234494B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018007730A priority Critical patent/JP7234494B2/ja
Priority claimed from JP2018007730A external-priority patent/JP7234494B2/ja
Publication of JP2019129165A publication Critical patent/JP2019129165A/ja
Publication of JP2019129165A5 publication Critical patent/JP2019129165A5/ja
Application granted granted Critical
Publication of JP7234494B2 publication Critical patent/JP7234494B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018007730A 2018-01-19 2018-01-19 接合装置および接合方法 Active JP7234494B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018007730A JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018007730A JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Publications (3)

Publication Number Publication Date
JP2019129165A JP2019129165A (ja) 2019-08-01
JP2019129165A5 true JP2019129165A5 (enExample) 2020-08-20
JP7234494B2 JP7234494B2 (ja) 2023-03-08

Family

ID=67472320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018007730A Active JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Country Status (1)

Country Link
JP (1) JP7234494B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021015028A1 (ja) * 2019-07-25 2021-01-28 東京エレクトロン株式会社 接合装置、および接合方法
JP7471862B2 (ja) * 2020-02-27 2024-04-22 キオクシア株式会社 貼合装置および貼合方法
JP7488062B2 (ja) * 2020-03-02 2024-05-21 東京エレクトロン株式会社 接合装置、接合システム、接合方法および記憶媒体
US11335607B2 (en) * 2020-07-09 2022-05-17 Tokyo Electron Limited Apparatus and methods for wafer to wafer bonding

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564982B (zh) * 2011-04-26 2017-01-01 尼康股份有限公司 A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate
JP6412804B2 (ja) * 2015-01-16 2018-10-24 東京エレクトロン株式会社 接合方法および接合システム
JP6640546B2 (ja) * 2015-12-18 2020-02-05 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP6685154B2 (ja) * 2016-03-14 2020-04-22 東京エレクトロン株式会社 接合装置および接合方法
KR102537289B1 (ko) * 2016-07-12 2023-05-30 가부시키가이샤 니콘 적층 기판 제조 방법, 적층 기판 제조 장치, 적층 기판 제조 시스템, 및 기판 처리 장치

Similar Documents

Publication Publication Date Title
JP2019129165A5 (enExample)
US20180107047A1 (en) Adhesive Tape, Fabricating Method Thereof, and Display Device
CN103201201B (zh) 薄板状工件的粘附保持方法和薄板状工件的粘附保持装置以及制造系统
JP2010153490A5 (enExample)
TW201633446A (zh) 間離裝置及間離方法
TW201104789A (en) Device and method for separating a substrate from a carrier substrate
CN105683614A (zh) 减振材料及减振材料的安装方法
TW201921551A (zh) 薄型化板狀構件之製造方法及製造裝置
JP2017002235A5 (enExample)
JP2007046053A5 (enExample)
CN113920875B (zh) 贴合治具
TWI583555B (zh) Sheet Adhesive Device and Paste Method
JP3196099U (ja) 離間装置
TW201934457A (zh) 真空吸附方法及真空吸附裝置
CN104425334A (zh) 半导体装置的制造方法以及半导体制造装置
JP5741994B2 (ja) 基板合着装置及び基板合着方法
JPWO2014162336A1 (ja) 加飾レンズの製造方法
JP2013208827A (ja) 貼合方法および装置
JP5852864B2 (ja) ワーク保持体、ワーク設置装置およびワーク設置方法
TWM355236U (en) Carrier platform structure for vacuum suction apparatus
JP2007025639A5 (enExample)
JP5123406B2 (ja) 貼合装置及び貼合方法
TW200720018A (en) Substrate polishing apparatus and substrate polishing method
KR102820770B1 (ko) 수분 반응형 고분자 필름을 포함하는 전자소자 전사 장치 및 이를 이용한 전자소자 전사 방법
JP2019184751A (ja) 貼合デバイスの製造装置及び貼合デバイスの製造方法