JP7234494B2 - 接合装置および接合方法 - Google Patents

接合装置および接合方法 Download PDF

Info

Publication number
JP7234494B2
JP7234494B2 JP2018007730A JP2018007730A JP7234494B2 JP 7234494 B2 JP7234494 B2 JP 7234494B2 JP 2018007730 A JP2018007730 A JP 2018007730A JP 2018007730 A JP2018007730 A JP 2018007730A JP 7234494 B2 JP7234494 B2 JP 7234494B2
Authority
JP
Japan
Prior art keywords
substrate
substrates
bonding
holding
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018007730A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019129165A (ja
JP2019129165A5 (enExample
Inventor
敦 釜下
功 菅谷
創 三ッ石
稔 福田
真生 角田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2018007730A priority Critical patent/JP7234494B2/ja
Publication of JP2019129165A publication Critical patent/JP2019129165A/ja
Publication of JP2019129165A5 publication Critical patent/JP2019129165A5/ja
Application granted granted Critical
Publication of JP7234494B2 publication Critical patent/JP7234494B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2018007730A 2018-01-19 2018-01-19 接合装置および接合方法 Active JP7234494B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018007730A JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018007730A JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Publications (3)

Publication Number Publication Date
JP2019129165A JP2019129165A (ja) 2019-08-01
JP2019129165A5 JP2019129165A5 (enExample) 2020-08-20
JP7234494B2 true JP7234494B2 (ja) 2023-03-08

Family

ID=67472320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018007730A Active JP7234494B2 (ja) 2018-01-19 2018-01-19 接合装置および接合方法

Country Status (1)

Country Link
JP (1) JP7234494B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021015028A1 (ja) * 2019-07-25 2021-01-28 東京エレクトロン株式会社 接合装置、および接合方法
JP7471862B2 (ja) * 2020-02-27 2024-04-22 キオクシア株式会社 貼合装置および貼合方法
JP7488062B2 (ja) * 2020-03-02 2024-05-21 東京エレクトロン株式会社 接合装置、接合システム、接合方法および記憶媒体
US11335607B2 (en) * 2020-07-09 2022-05-17 Tokyo Electron Limited Apparatus and methods for wafer to wafer bonding

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134419A (ja) 2015-01-16 2016-07-25 東京エレクトロン株式会社 接合方法および接合システム
JP2017112322A (ja) 2015-12-18 2017-06-22 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP2017168474A (ja) 2016-03-14 2017-09-21 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
WO2018012300A1 (ja) 2016-07-12 2018-01-18 株式会社ニコン 積層基板製造方法、積層基板製造装置、積層基板製造システム、および基板処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564982B (zh) * 2011-04-26 2017-01-01 尼康股份有限公司 A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134419A (ja) 2015-01-16 2016-07-25 東京エレクトロン株式会社 接合方法および接合システム
JP2017112322A (ja) 2015-12-18 2017-06-22 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP2017168474A (ja) 2016-03-14 2017-09-21 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
WO2018012300A1 (ja) 2016-07-12 2018-01-18 株式会社ニコン 積層基板製造方法、積層基板製造装置、積層基板製造システム、および基板処理装置

Also Published As

Publication number Publication date
JP2019129165A (ja) 2019-08-01

Similar Documents

Publication Publication Date Title
JP7708169B2 (ja) 基板選択方法、積層基板製造方法、基板選択装置、および積層基板製造システム
JP6579262B2 (ja) 基板貼り合わせ装置および基板貼り合わせ方法
JP7127286B2 (ja) 積層装置、活性化装置、制御装置、積層体の製造装置、および積層体の製造方法
JP7234494B2 (ja) 接合装置および接合方法
JP7147863B2 (ja) 基板貼り合わせ装置および基板貼り合わせ方法
US20200091015A1 (en) Substrate bonding method, multilayer substrate manufacturing method, multilayer substrate manufacturing apparatus, and multilayer substrate manufacturing system
JP6569802B2 (ja) 基板貼り合わせ装置および基板貼り合わせ方法
TWI845489B (zh) 積層基板之製造方法及製造裝置
WO2017217431A1 (ja) 積層装置および積層方法
US12447728B2 (en) Bonding method and bonding device
KR20170114933A (ko) 처리 장치 및 물품의 제조 방법
JP2022062290A (ja) 積層体形成装置および積層体形成方法
KR102370325B1 (ko) 위치 맞춤 방법 및 위치 맞춤 장치
CN114127907B (zh) 接合装置和接合方法
WO2023153317A1 (ja) 基板補正装置、基板積層装置、基板処理システム、基板補正方法、基板処理方法、および半導体装置の製造方法
US12506111B2 (en) Alignment method and alignment apparatus
TWI906924B (zh) 基板選擇方法、基板選擇裝置、積層基板製造方法、及積層基板製造系統

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200701

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200701

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210420

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210422

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210614

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220628

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220930

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230124

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230206

R150 Certificate of patent or registration of utility model

Ref document number: 7234494

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360