JP2017538102A5 - - Google Patents

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Publication number
JP2017538102A5
JP2017538102A5 JP2017518136A JP2017518136A JP2017538102A5 JP 2017538102 A5 JP2017538102 A5 JP 2017538102A5 JP 2017518136 A JP2017518136 A JP 2017518136A JP 2017518136 A JP2017518136 A JP 2017518136A JP 2017538102 A5 JP2017538102 A5 JP 2017538102A5
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JP
Japan
Prior art keywords
optical waveguide
optical
branches
intersection
beams
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JP2017518136A
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English (en)
Japanese (ja)
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JP2017538102A (ja
JP6530062B2 (ja
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Priority claimed from FR1459170A external-priority patent/FR3026484B1/fr
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Publication of JP2017538102A5 publication Critical patent/JP2017538102A5/ja
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Publication of JP6530062B2 publication Critical patent/JP6530062B2/ja
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JP2017518136A 2014-09-29 2015-09-29 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム Active JP6530062B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1459170 2014-09-29
FR1459170A FR3026484B1 (fr) 2014-09-29 2014-09-29 Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique
PCT/EP2015/072368 WO2016050738A1 (fr) 2014-09-29 2015-09-29 Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique

Publications (3)

Publication Number Publication Date
JP2017538102A JP2017538102A (ja) 2017-12-21
JP2017538102A5 true JP2017538102A5 (enExample) 2018-09-06
JP6530062B2 JP6530062B2 (ja) 2019-06-12

Family

ID=51866249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017518136A Active JP6530062B2 (ja) 2014-09-29 2015-09-29 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム

Country Status (8)

Country Link
US (1) US10260868B2 (enExample)
EP (1) EP3201610B1 (enExample)
JP (1) JP6530062B2 (enExample)
KR (1) KR20170066375A (enExample)
CN (1) CN106716112B (enExample)
FR (1) FR3026484B1 (enExample)
SG (1) SG11201702300PA (enExample)
WO (1) WO2016050738A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160343140A1 (en) * 2015-05-24 2016-11-24 Pointivo, Inc. Surveying and measurement methods and devices
FR3049710B1 (fr) * 2016-03-31 2020-06-19 Unity Semiconductor Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique
FR3076618B1 (fr) * 2018-01-05 2023-11-24 Unity Semiconductor Procede et systeme d'inspection optique d'un substrat
CN109543720B (zh) * 2018-10-30 2023-10-27 东华大学 一种基于对抗生成网络的晶圆图缺陷模式识别方法
EP4202423B1 (en) 2021-12-23 2025-09-24 Unity Semiconductor A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate
KR20230175045A (ko) 2022-06-22 2023-12-29 삼성전자주식회사 캔틸레버

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
JP2711140B2 (ja) * 1989-06-08 1998-02-10 三菱電機株式会社 徴細粒子測定装置
JPH07123105B2 (ja) * 1989-12-27 1995-12-25 松下電器産業株式会社 位置合わせ装置
IL125964A (en) * 1998-08-27 2003-10-31 Tevet Process Control Technolo Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
CN1264010C (zh) * 2000-03-24 2006-07-12 奥林巴斯光学工业株式会社 缺陷检测装置
WO2002025708A2 (en) * 2000-09-20 2002-03-28 Kla-Tencor-Inc. Methods and systems for semiconductor fabrication processes
JP2004513364A (ja) * 2000-11-13 2004-04-30 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 表面欠陥の測定
US7106454B2 (en) * 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
FR2927175B1 (fr) * 2008-02-05 2011-02-18 Altatech Semiconductor Dispositif d'inspection de plaquettes semi-conductrices
KR101311320B1 (ko) * 2008-10-01 2013-09-25 페터 볼터스 게엠베하 원반형 작업물의 두께를 계측하는 방법

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