JP2017538102A5 - - Google Patents
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- Publication number
- JP2017538102A5 JP2017538102A5 JP2017518136A JP2017518136A JP2017538102A5 JP 2017538102 A5 JP2017538102 A5 JP 2017538102A5 JP 2017518136 A JP2017518136 A JP 2017518136A JP 2017518136 A JP2017518136 A JP 2017518136A JP 2017538102 A5 JP2017538102 A5 JP 2017538102A5
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- optical
- branches
- intersection
- beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 5
- 238000000034 method Methods 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1459170A FR3026484B1 (fr) | 2014-09-29 | 2014-09-29 | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
| FR1459170 | 2014-09-29 | ||
| PCT/EP2015/072368 WO2016050738A1 (fr) | 2014-09-29 | 2015-09-29 | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017538102A JP2017538102A (ja) | 2017-12-21 |
| JP2017538102A5 true JP2017538102A5 (enExample) | 2018-09-06 |
| JP6530062B2 JP6530062B2 (ja) | 2019-06-12 |
Family
ID=51866249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017518136A Active JP6530062B2 (ja) | 2014-09-29 | 2015-09-29 | 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10260868B2 (enExample) |
| EP (1) | EP3201610B1 (enExample) |
| JP (1) | JP6530062B2 (enExample) |
| KR (1) | KR20170066375A (enExample) |
| CN (1) | CN106716112B (enExample) |
| FR (1) | FR3026484B1 (enExample) |
| SG (1) | SG11201702300PA (enExample) |
| WO (1) | WO2016050738A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160343140A1 (en) * | 2015-05-24 | 2016-11-24 | Pointivo, Inc. | Surveying and measurement methods and devices |
| FR3049710B1 (fr) * | 2016-03-31 | 2020-06-19 | Unity Semiconductor | Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique |
| FR3076618B1 (fr) * | 2018-01-05 | 2023-11-24 | Unity Semiconductor | Procede et systeme d'inspection optique d'un substrat |
| CN109543720B (zh) * | 2018-10-30 | 2023-10-27 | 东华大学 | 一种基于对抗生成网络的晶圆图缺陷模式识别方法 |
| EP4202423B1 (en) * | 2021-12-23 | 2025-09-24 | Unity Semiconductor | A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate |
| KR20230175045A (ko) | 2022-06-22 | 2023-12-29 | 삼성전자주식회사 | 캔틸레버 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4030830A (en) * | 1976-01-05 | 1977-06-21 | Atlantic Research Corporation | Process and apparatus for sensing defects on a smooth surface |
| JP2711140B2 (ja) * | 1989-06-08 | 1998-02-10 | 三菱電機株式会社 | 徴細粒子測定装置 |
| JPH07123105B2 (ja) * | 1989-12-27 | 1995-12-25 | 松下電器産業株式会社 | 位置合わせ装置 |
| IL125964A (en) * | 1998-08-27 | 2003-10-31 | Tevet Process Control Technolo | Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate |
| KR100795286B1 (ko) * | 2000-03-24 | 2008-01-15 | 올림푸스 가부시키가이샤 | 결함검출장치 |
| AU2001295060A1 (en) * | 2000-09-20 | 2002-04-02 | Kla-Tencor-Inc. | Methods and systems for semiconductor fabrication processes |
| WO2002039099A2 (en) * | 2000-11-13 | 2002-05-16 | Koninklijke Philips Electronics N.V. | Measurement of surface defects |
| US7106454B2 (en) * | 2003-03-06 | 2006-09-12 | Zygo Corporation | Profiling complex surface structures using scanning interferometry |
| FR2927175B1 (fr) | 2008-02-05 | 2011-02-18 | Altatech Semiconductor | Dispositif d'inspection de plaquettes semi-conductrices |
| CN102171000A (zh) * | 2008-10-01 | 2011-08-31 | 彼特沃尔特斯有限公司 | 用于测量片状工件的厚度的方法 |
-
2014
- 2014-09-29 FR FR1459170A patent/FR3026484B1/fr active Active
-
2015
- 2015-09-29 SG SG11201702300PA patent/SG11201702300PA/en unknown
- 2015-09-29 KR KR1020177008603A patent/KR20170066375A/ko not_active Withdrawn
- 2015-09-29 JP JP2017518136A patent/JP6530062B2/ja active Active
- 2015-09-29 US US15/515,407 patent/US10260868B2/en active Active
- 2015-09-29 EP EP15774574.6A patent/EP3201610B1/fr active Active
- 2015-09-29 CN CN201580052315.3A patent/CN106716112B/zh active Active
- 2015-09-29 WO PCT/EP2015/072368 patent/WO2016050738A1/fr not_active Ceased
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