JP6530062B2 - 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム - Google Patents

電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム Download PDF

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JP6530062B2
JP6530062B2 JP2017518136A JP2017518136A JP6530062B2 JP 6530062 B2 JP6530062 B2 JP 6530062B2 JP 2017518136 A JP2017518136 A JP 2017518136A JP 2017518136 A JP2017518136 A JP 2017518136A JP 6530062 B2 JP6530062 B2 JP 6530062B2
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wafer
measurement volume
light
defect
inter
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Japanese (ja)
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JP2017538102A (ja
JP2017538102A5 (enExample
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ドゥ ゲヴィニー マイユール デュラン
ドゥ ゲヴィニー マイユール デュラン
フィリップ ガスタルド
フィリップ ガスタルド
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Unity Semiconductor SAS
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Unity Semiconductor SAS
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02034—Interferometers characterised by particularly shaped beams or wavefronts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
    • G01M11/33—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face
    • G01M11/331—Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face by using interferometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H10P74/203—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2017518136A 2014-09-29 2015-09-29 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム Active JP6530062B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1459170A FR3026484B1 (fr) 2014-09-29 2014-09-29 Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique
FR1459170 2014-09-29
PCT/EP2015/072368 WO2016050738A1 (fr) 2014-09-29 2015-09-29 Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique

Publications (3)

Publication Number Publication Date
JP2017538102A JP2017538102A (ja) 2017-12-21
JP2017538102A5 JP2017538102A5 (enExample) 2018-09-06
JP6530062B2 true JP6530062B2 (ja) 2019-06-12

Family

ID=51866249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017518136A Active JP6530062B2 (ja) 2014-09-29 2015-09-29 電子工学、光学または光電子工学用の透明ウェハを検査する方法およびシステム

Country Status (8)

Country Link
US (1) US10260868B2 (enExample)
EP (1) EP3201610B1 (enExample)
JP (1) JP6530062B2 (enExample)
KR (1) KR20170066375A (enExample)
CN (1) CN106716112B (enExample)
FR (1) FR3026484B1 (enExample)
SG (1) SG11201702300PA (enExample)
WO (1) WO2016050738A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160343140A1 (en) * 2015-05-24 2016-11-24 Pointivo, Inc. Surveying and measurement methods and devices
FR3049710B1 (fr) * 2016-03-31 2020-06-19 Unity Semiconductor Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique
FR3076618B1 (fr) * 2018-01-05 2023-11-24 Unity Semiconductor Procede et systeme d'inspection optique d'un substrat
CN109543720B (zh) * 2018-10-30 2023-10-27 东华大学 一种基于对抗生成网络的晶圆图缺陷模式识别方法
EP4202423B1 (en) 2021-12-23 2025-09-24 Unity Semiconductor A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate
KR20230175045A (ko) 2022-06-22 2023-12-29 삼성전자주식회사 캔틸레버

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
JP2711140B2 (ja) * 1989-06-08 1998-02-10 三菱電機株式会社 徴細粒子測定装置
JPH07123105B2 (ja) * 1989-12-27 1995-12-25 松下電器産業株式会社 位置合わせ装置
IL125964A (en) * 1998-08-27 2003-10-31 Tevet Process Control Technolo Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
JP4671573B2 (ja) * 2000-03-24 2011-04-20 オリンパス株式会社 基板搬送装置及び外観検査装置
US6950196B2 (en) * 2000-09-20 2005-09-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen
US20020191179A1 (en) 2000-11-13 2002-12-19 Tukker Teunis Willem Measurement of surface defects
US7106454B2 (en) * 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
FR2927175B1 (fr) * 2008-02-05 2011-02-18 Altatech Semiconductor Dispositif d'inspection de plaquettes semi-conductrices
WO2010037452A1 (de) * 2008-10-01 2010-04-08 Peter Wolters Gmbh Verfahren zum messen der dicke eines scheibenförmigen werkstücks

Also Published As

Publication number Publication date
FR3026484B1 (fr) 2018-06-15
JP2017538102A (ja) 2017-12-21
CN106716112B (zh) 2019-08-06
SG11201702300PA (en) 2017-04-27
US10260868B2 (en) 2019-04-16
EP3201610A1 (fr) 2017-08-09
FR3026484A1 (fr) 2016-04-01
WO2016050738A1 (fr) 2016-04-07
CN106716112A (zh) 2017-05-24
US20180231370A1 (en) 2018-08-16
EP3201610B1 (fr) 2018-11-07
KR20170066375A (ko) 2017-06-14

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