KR102352424B1 - 소자, 특히 광학 소자의 웨이퍼 수준 제조 - Google Patents

소자, 특히 광학 소자의 웨이퍼 수준 제조 Download PDF

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KR102352424B1
KR102352424B1 KR1020167035043A KR20167035043A KR102352424B1 KR 102352424 B1 KR102352424 B1 KR 102352424B1 KR 1020167035043 A KR1020167035043 A KR 1020167035043A KR 20167035043 A KR20167035043 A KR 20167035043A KR 102352424 B1 KR102352424 B1 KR 102352424B1
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South Korea
Prior art keywords
substrate
members
curable material
wafer
barrier
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KR1020167035043A
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English (en)
Korean (ko)
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KR20170029422A (ko
Inventor
알렉산더 비에취
미헬 바르게
Original Assignee
에이엠에스 센서스 싱가포르 피티이. 리미티드.
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Publication of KR20170029422A publication Critical patent/KR20170029422A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/752—Measuring equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
KR1020167035043A 2014-05-16 2015-05-14 소자, 특히 광학 소자의 웨이퍼 수준 제조 Active KR102352424B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461994358P 2014-05-16 2014-05-16
US61/994,358 2014-05-16
PCT/SG2015/050113 WO2015174930A1 (en) 2014-05-16 2015-05-14 Wafer-level maufacture of devices, in particular of optical devices

Publications (2)

Publication Number Publication Date
KR20170029422A KR20170029422A (ko) 2017-03-15
KR102352424B1 true KR102352424B1 (ko) 2022-01-17

Family

ID=54480324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167035043A Active KR102352424B1 (ko) 2014-05-16 2015-05-14 소자, 특히 광학 소자의 웨이퍼 수준 제조

Country Status (8)

Country Link
US (1) US10682824B2 (enExample)
EP (1) EP3142859B1 (enExample)
JP (2) JP2017526977A (enExample)
KR (1) KR102352424B1 (enExample)
CN (1) CN106573460B (enExample)
SG (2) SG11201609001TA (enExample)
TW (1) TWI710455B (enExample)
WO (1) WO2015174930A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016689B1 (en) * 2016-04-28 2017-11-20 Anteryon Wafer Optics B V Replication tool
US10867955B2 (en) * 2018-09-27 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure having adhesive layer surrounded dam structure
CN109116680A (zh) * 2018-09-27 2019-01-01 京东方科技集团股份有限公司 压印模板及其制作方法
DE112020001167B4 (de) * 2019-03-12 2025-05-15 Focuslight Singapore Pte. Ltd. Yard Control Merkmale
US20220227081A1 (en) * 2019-05-30 2022-07-21 Ams Sensors Singapore Pte. Ltd. Method of replicating optical elements and replicated optical elements
GB2594998A (en) * 2020-05-15 2021-11-17 Ams Sensors Asia Pte Ltd Wafer level chip scale packaging
CN115097553B (zh) * 2022-06-24 2023-10-31 京东方科技集团股份有限公司 微透镜阵列基板及其制备方法、显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193082A1 (en) * 2002-04-10 2003-10-16 Siliconware Precision Industries Co., Ltd. Substrate with dam bar structure
US20080054506A1 (en) * 2006-03-20 2008-03-06 Heptagon Oy Manufacturing Optical Elements
US20130273238A1 (en) * 2012-04-16 2013-10-17 Peter S. Andrews Inverted Curing of Liquid Optoelectronic Lenses

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JP4963148B2 (ja) * 2001-09-18 2012-06-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP1443344A1 (en) * 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
US20040241323A1 (en) * 2003-05-29 2004-12-02 3M Innovative Properties Company Method for applying adhesive to a substrate
JP4362380B2 (ja) * 2004-01-13 2009-11-11 フジノン株式会社 光学素子の成形方法及び組み合わせ光学素子
US20070216046A1 (en) 2006-03-20 2007-09-20 Heptagon Oy Manufacturing miniature structured elements with tool incorporating spacer elements
US20080113160A1 (en) 2006-11-14 2008-05-15 Glimmerglass Networks, Inc. Method And Apparatus For Localized Bonding
JP4507126B2 (ja) * 2007-10-29 2010-07-21 ソニー株式会社 偏光板の製造方法
US20090159200A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
JP2009204752A (ja) 2008-02-26 2009-09-10 Sanyo Electric Co Ltd 複合レンズ
JP2010052086A (ja) 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd 半導体装置及びその製造方法
JP5047243B2 (ja) * 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
CN102458807B (zh) 2009-06-12 2014-10-22 柯尼卡美能达精密光学株式会社 晶片透镜的制造方法，中间模具、光学部件、成型模具以及成型模具的制造方法
WO2013179765A1 (ja) 2012-05-30 2013-12-05 オリンパス株式会社 撮像装置の製造方法および半導体装置の製造方法
CN107479119A (zh) 2012-09-11 2017-12-15 新加坡恒立私人有限公司 截断型镜片、截断型镜片对及相应装置的制造
JPWO2014092148A1 (ja) 2012-12-15 2017-01-12 コニカミノルタ株式会社 レンズアレイ構造体の製造方法及びレンズアレイ構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030193082A1 (en) * 2002-04-10 2003-10-16 Siliconware Precision Industries Co., Ltd. Substrate with dam bar structure
US20080054506A1 (en) * 2006-03-20 2008-03-06 Heptagon Oy Manufacturing Optical Elements
US20130273238A1 (en) * 2012-04-16 2013-10-17 Peter S. Andrews Inverted Curing of Liquid Optoelectronic Lenses

Also Published As

Publication number Publication date
SG10201810219TA (en) 2018-12-28
CN106573460A (zh) 2017-04-19
CN106573460B (zh) 2019-11-29
EP3142859B1 (en) 2019-07-10
SG11201609001TA (en) 2016-11-29
US20170087784A1 (en) 2017-03-30
EP3142859A1 (en) 2017-03-22
WO2015174930A1 (en) 2015-11-19
TW201605608A (zh) 2016-02-16
KR20170029422A (ko) 2017-03-15
EP3142859A4 (en) 2018-01-24
JP6987907B2 (ja) 2022-01-05
US10682824B2 (en) 2020-06-16
JP2020106856A (ja) 2020-07-09
TWI710455B (zh) 2020-11-21
JP2017526977A (ja) 2017-09-14

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