WO2012123443A3 - Dockingvorrichtung, dockingverfahren - Google Patents

Dockingvorrichtung, dockingverfahren Download PDF

Info

Publication number
WO2012123443A3
WO2012123443A3 PCT/EP2012/054361 EP2012054361W WO2012123443A3 WO 2012123443 A3 WO2012123443 A3 WO 2012123443A3 EP 2012054361 W EP2012054361 W EP 2012054361W WO 2012123443 A3 WO2012123443 A3 WO 2012123443A3
Authority
WO
WIPO (PCT)
Prior art keywords
docking
handler
probe
coupling
handling
Prior art date
Application number
PCT/EP2012/054361
Other languages
English (en)
French (fr)
Other versions
WO2012123443A2 (de
Inventor
Werner Huber
Yusman SUGIANTO
Cheng Khoon Clement SNG
Original Assignee
Esmo Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esmo Ag filed Critical Esmo Ag
Priority to SG2013069620A priority Critical patent/SG193487A1/en
Priority to US14/005,054 priority patent/US20140043053A1/en
Publication of WO2012123443A2 publication Critical patent/WO2012123443A2/de
Publication of WO2012123443A3 publication Critical patent/WO2012123443A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Eine Dockingvorrichtung (10) zur Verbindung eines Halbleiter-Testkopfs (2) mit einem Halbleiter-Handler (1) hat je eine testkopfseitige und eine handlerseitige Verbindungsvorrichtung (11, 12), eine Handhabungsvorrichtung (31 - 35) zum Handhaben einer Kontaktierungsvorrichtung (23) und eine Koppelvorrichtung (13 - 16) zum Koppeln der Verbindungsvorrichtungen (11, 12). Die Koppelvorrichtung (13 - 16) weist eine erste Verschiebeeinrichtung auf, die das translatorische und geführte Verschieben der testkopfseitigen Verbindungsvorrichtung (12) relativ zur handlerseitigen Verbindungsvorrichtung (11) aufeinander zu und voneinander weg erlaubt.
PCT/EP2012/054361 2011-03-16 2012-03-13 Dockingvorrichtung, dockingverfahren WO2012123443A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG2013069620A SG193487A1 (en) 2011-03-16 2012-03-13 Docking device, docking method
US14/005,054 US20140043053A1 (en) 2011-03-16 2012-03-13 Docking device, docking method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011014148.0 2011-03-16
DE102011014148.0A DE102011014148B4 (de) 2011-03-16 2011-03-16 Dockingvorrichtung

Publications (2)

Publication Number Publication Date
WO2012123443A2 WO2012123443A2 (de) 2012-09-20
WO2012123443A3 true WO2012123443A3 (de) 2012-11-22

Family

ID=45926534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/054361 WO2012123443A2 (de) 2011-03-16 2012-03-13 Dockingvorrichtung, dockingverfahren

Country Status (5)

Country Link
US (1) US20140043053A1 (de)
DE (1) DE102011014148B4 (de)
MY (1) MY180308A (de)
SG (1) SG193487A1 (de)
WO (1) WO2012123443A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205104519U (zh) 2013-03-11 2016-03-23 苹果公司 便携式电子设备
ITTO20130324A1 (it) * 2013-04-22 2014-10-23 St Microelectronics Srl Dispositivo vibrante per il posizionamento di un pezzo miniaturizzato in una sede di test, e metodo di posizionamento
US10164688B2 (en) 2014-04-30 2018-12-25 Apple Inc. Actuator assisted alignment of connectible devices
DE102019119134A1 (de) * 2019-07-15 2021-01-21 Turbodynamics Gmbh Testvorrichtung
US11334164B2 (en) 2019-07-22 2022-05-17 Apple Inc. Portable electronic device having a haptic device with a moving battery element
DE102019007618A1 (de) * 2019-10-31 2021-05-06 Yamaichi Electronics Deutschland Gmbh Verbindungssystem, Verfahren und Verwendung eines Verbindungssystems
KR102501995B1 (ko) 2019-12-18 2023-02-20 주식회사 아도반테스토 하나 이상의 피시험 장치를 테스트하기 위한 자동식 테스트 장비 및 자동식 테스트 장비의 작동 방법
JP7217293B2 (ja) 2019-12-18 2023-02-02 株式会社アドバンテスト １または複数の被テストデバイスをテストするための自動テスト装置、および、自動テスト装置を操作するための方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420885B1 (en) * 2000-02-10 2002-07-16 Xilinx, Inc. System and apparatus for low-temperature semiconductor device testing
WO2003008984A2 (en) * 2001-07-16 2003-01-30 Intest Ip Corp. Test head docking system and method
DE102004031426A1 (de) * 2004-06-29 2006-01-26 Esmo Ag Dockingantrieb, Verriegelungselement, Dockingsystem
EP1495339B1 (de) * 2002-04-16 2007-10-31 Teradyne, Inc. Halbleiterprüfsystem mit leicht wechselbarer schnittstelleneinheit
US20090102457A1 (en) * 2007-10-19 2009-04-23 Teradyne, Inc. Automated Test Equipment Interface

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923180A (en) * 1997-02-04 1999-07-13 Hewlett-Packard Company Compliant wafer prober docking adapter
US6732606B1 (en) * 2000-06-30 2004-05-11 Eaton Corporation Polished gear surfaces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420885B1 (en) * 2000-02-10 2002-07-16 Xilinx, Inc. System and apparatus for low-temperature semiconductor device testing
WO2003008984A2 (en) * 2001-07-16 2003-01-30 Intest Ip Corp. Test head docking system and method
EP1495339B1 (de) * 2002-04-16 2007-10-31 Teradyne, Inc. Halbleiterprüfsystem mit leicht wechselbarer schnittstelleneinheit
DE102004031426A1 (de) * 2004-06-29 2006-01-26 Esmo Ag Dockingantrieb, Verriegelungselement, Dockingsystem
US20090102457A1 (en) * 2007-10-19 2009-04-23 Teradyne, Inc. Automated Test Equipment Interface

Also Published As

Publication number Publication date
US20140043053A1 (en) 2014-02-13
MY180308A (en) 2020-11-28
SG193487A1 (en) 2013-10-30
DE102011014148B4 (de) 2016-06-09
DE102011014148A1 (de) 2012-09-20
WO2012123443A2 (de) 2012-09-20

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