TWI223371B - Chuck rotating and chuck roller apparatuses - Google Patents

Abstract

A chuck rotating and chuck roller apparatus for carrying a wafer. The chuck rotating apparatus includes a rotating base, a chuck pedestal and a plurality of chuck pins. The chuck pedestal is fixed to the rotating base and has a plurality of chuck arms extending from the center thereof. The chuck pins are disposed on the chuck arms, respectively. Each chuck pin has a chuck portion having a retarding surface and a supporting surface. The retarding surface is formed with a protrusion. When the wafer is positioned on the chuck pins, the edge of the wafer touches the retarding surface of each chuck pin and is located between the supporting surface and the protrusion.

Description

1223371 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a clamping step so that the wafer does not _ f during rotation, and particularly to a clamping device that can be separated from the clamping pin. Previous technology # ί Generally, after semiconductor manufacturing is performed by BMP (cmp), it is necessary to make cleaning clothes and 1 will be transported to a DNS AS- after 2 = The DNS AS-20 00 equipment is mainly composed of a scrUbbing chamber (DBC), an upper scrubbing chamber (hsc? Bing chamber, TBC), and a drying chamber (㈣ task chamber (DTC)). 'In the upper scrubbing chamber (TBC), the wafer is placed on the top of the wafer to clean it. When a wafer (not shown) is placed in the clamp via a robotic arm (not shown) After holding the pin 11, the three clamping arms 12 will be pushed outward in the direction shown by the arrow A, so that the circle is more positioned on the clamping pin U. Then, the rotating seat 13 will Begin to rotate in the counter-f direction, so that the clamping seat 丨 4 rotates together. Then, referring to FIG. 1B, the upper brushing arm 2 will be moved above the wafer clamping device 1 and the wafer W, and scrubbed. Part 2 丨 Wipe the wafer W back and forth or rotate. However, please refer to Figure 1A and Figure 1C. I 2 is connected to the arm retainer 14, and they must have a loss of holding a gap between the pin and the clamping pin holder Shushu Shu 5, holding the pin or the loss can not Shushu Shu 2 by pushing the clamp arm

1223371 V. Description of the invention (2) ---- And rotation and positioning. When the rotating seat 13 is rotated at a high speed (1500 to 2500 rpm), the clamping arm 12 will be pushed further outward due to the centrifugal force, so that the clamping on the clamping pin fixing seat 15 The pin 丨 丨 is tilted due to the pushing of the clamping arm 12. Please refer to FIG. 1D and FIG. 1E. Due to the outer shape of the clamping portion 16 above the clamping pin u, when the clamping pin 丨 丨 is tilted, the wafer evaluation will loosen to the clamping pin 1 1 ( Or the holding part 16) is flying out of the wafer holding device i, and thus 10% of the wafer w is damaged. At the same time, since the general clamping pins u are made of plastic ’, after a long period of use, the wafer? The contact portion B with the clamping section worker 6 will be worn, so even if the clamping pin 丨 丨 is not tilted, the wafer w will easily loosen to the clamping pin 丨 丨 (or the clamping section 丨 6). ^ In the drying chamber (DTC), the wafer is also placed on another wafer holding device. After being held by the holding pin, the wafer is then dried. Similarly, in the drying chamber (DTC), the clamping pin may have the problems described above in the upper brushing chamber (BC). On the other hand, referring to FIG. 2A and FIG. 2B, in the double-sided brushing chamber (DBC), the wafer W is placed in a roller holding device 3 to perform cleaning operations. After the wafer W is input into the roller clamping device 3 through a robot arm (not shown), the two clamping roller seats 32 and 33 will be opposed to each other and the edge of the wafer w may be located on the plurality of clamping rollers 31 at the same time. in. Next, each of the I holding rollers 31 will rotate in a counterclockwise direction, so that the wafer% rotates in a clockwise direction, as shown in FIG. 2C and FIG. 2D. Then, the upper brushing part 34 and the lower brushing part 35 of the roller holding device 3 will contact the upper and lower surfaces of the wafer 3 facing each other, and also the upper and lower surfaces of the wafer w will be brushed simultaneously in a rotating manner.

1223371

In the pipeline, a sensor for controlling the flow of the fluid is also located in the fluid pipeline for detecting the state of the fluid. The output device is used for output signals. The controller can selectively apply an on / off control signal and an output control signal to the valve and output device, and detect the position of the wafer based on the measurement signal from the sensor.

In U.S. Patent Application No. 2000/0 1 3 59 6 8 people No. 1, there is provided a system called 'Maruchi holding system'. The wafer holding system includes a base, a plurality of air holes, and a plurality of grooves. . The base has an upper surface for supporting a half-guide wafer. The plurality of air holes are penetrated through the base and have a plurality of grooves through which gas can flow. The grooves are located on the upper surface of the base and connected to the plurality of air holes. This case is mainly applied to a wafer holder in a plasma processing chamber.

In U.S. Patent Application No. 2 02/0 0 6 647 5A1, a wafer clamping device is disclosed. The wafer clamping device mainly includes a plurality of moving clamp arms, a plurality of fixed supporting structures, and each The center of mass of a movable clamp arm. Each movable clamping arm is spaced apart from its pivot point by a distance. Therefore, when the clamping device is not activated, the plurality of movable clamping arms will rotate to loosen their clamps on the wafer. When the holding device is started, the plurality of movable clamping arms will rotate to clamp the wafer, thus achieving the purpose of wafer clamping. However, the structure of such a wafer holding device is too complicated, which will cause great inconvenience to operation and maintenance. Staying in U.S. Patent No. 6,095, 889, it is disclosed that a wafer misalignment roller 'is used in a double-sided brushing chamber (time C). When the double-side brushing operation is performed, the roller will rotate to drive the wafer

1223371

V. Description of invention (5) Rotation. The roller and the wafer will drive the wafer to rotate due to the friction between the outer edges and the wafer. At the same time, because a ^ is in the groove of the outer edge of the wheel, when the wafer is placed on the roller edge, it is likely to be on the roller, and this case is one of the two sides of the wafer. The detection device is used to detect whether the wafer is indeed clamped. When the upper and lower cleaning brushes are close to each other and brushed, the following: = Medium ', T will crush the wafer. SUMMARY OF THE INVENTION The present invention basically adopts the problems described in detail below. According to the above purpose, it further includes at least a seat and is connected to the clamping seat to push the misplacement pin to rotate the clamping pin. According to the above purpose, each support arm further has a clamping pin for fixing. A mother pin and a pin are positioned on the pin fixing seat. According to the above purpose, the clamping pins are made of plastic. It is an object of the present invention to provide a Japanese yen and include a rotating seat, and a plurality of clamping pins outward from the center, each of which is disposed on the holding pin and has a inflammation holding portion, and the holding surface is to be resisted. When the mask has a protruding portion, the edge of the wafer is topped and is located on the bearing surface and the protruding feature in order to solve the confession: a kind of misplacement, suitable for carrying a misplacement seat, fixed to A plurality of support arms extended by the rotating base I; and a plurality of support arms above the f, wherein each clamping portion has an abutment surface and a bearing, and when the wafer is positioned on the clamping pins contacting each clamping pin The resistance surface is between the parts. A clamping arm is disposed on the clamping core and the clamping pin, and is used at an angle.

1223371 V. Description of Invention (6)

Another object of the present invention is to provide a wafer and include a clamping portion;-on; and a resisting surface formed on the cutting surface, wherein when the resisting mask has the clamping pin According to the above purpose, the clamping pin is another object of the present invention to provide for carrying and brushing a wafer, and includes a holding roller provided on the The height of the portion of the first roller base, a second portion, and a first annular groove are located at the height of the first portion, the second portion, and the second portion; a second roller base Relative to the first holding roller, a portion, a fourth portion, and a second annular groove provided on the second roller base are located in the third portion, the fourth blade, and the fourth portion. The height is great. When the wafer is positioned on the roller holder and the roller holder is opposite to each other, an annular groove and the second annular groove according to the above purpose, further including an upper one of the upper one. The scrubbing section is located below the wafer. The scrubbing section is located below the wafer. The surface of the seed-holding-holding protruding system is made of plastic, and the groove part is rolled on the first part, and the groove part is on the device, so that the upper part and the lower part are brushed and formed on the surface. And a vertical portion when the wafer touches between the clamping pins. Made of glue. 'Ling wheel misplacement device Ling wheel seat; a ya and has a first, where the first = and the first-ring groove wheel seat; and a and has a first, where the first = and the When it is above the first annular groove, the edge clamping portion of the first wafer is straight to the position where it is positioned, and the thickness of the second wafer is three, two, and the third. The thickness of the part is a roller on the surface of the first part and the lower scrub part, and the

〇5〇3-9495twf (nl); TSMC2002-1151; 1150; Hawdong.ptd

1223371 V. Description of the invention (12) Although the present invention has been disclosed in the preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may depart from the spirit and scope of the present invention. With some changes and modifications, the scope of protection of the present invention shall be determined by the scope of the appended patent application. Alone

0503 -94951 wf (η1); TSMC2002-1151; 1150; Hawdong.ptd Page 161223371 Brief description of the diagram 1 A system 1 B system 1 C system intention, 1 D system 1 E Figure 2A, 2B, 2C, 2C, 2D, 2E, 2F, 3A, 3B, 3D, and 3D. Figure 4A, Figure 4B, Figure 4C, and Figure 4D. The top view of the wheel shows a conventional wafer holding device. It shows the condition of cleaning a wafer by an upper scrub arm. It shows that a wafer is located in a The side view on the conventional clamping pin shows the conventional clamping pin according to FIG. 1C; the partial top view according to FIG. 1C is shown; the three-dimensional schematic diagram of a conventional roller clamping device is displayed; A side view schematic diagram of A; showing a wafer correctly located in a conventional clamping roller; side view schematic diagram according to FIG. 2C; showing a wafer not correctly positioned in the conventional clamping roller diagram; Fig. 2E is a schematic side view showing the holding device of the present invention; showing a wafer at The side view on the clamping lock of the present invention shows a partial top view according to FIG. 3B; the clamping pin of the present invention is shown; the three-dimensional schematic view of the roller clamping device of the present invention is shown; the side according to FIG. 4A is shown A schematic view; showing the clamping roller of the present invention; showing the intention of a wafer being positioned on the clamping roller of the present invention without a plate; and

0503-94951wf (η 1); TSMC2002 -1151; 1150; Hawdong. Ptd Page 17 1223371 Brief description of the drawing Figure 4E shows the symbol description of the side view according to Figure 4D 1 ~ Wafer holding device 3 ~ Roller Clamping device 1 2 ~ Clamping arm 1 4 ~ Clamping seat 1 6 ~ Clamping section 3 1 ~ Clamping roller 3 4 ~ Upper brushing section 3 6 ~ Clamping positioning detection device 1 0 0 ~ Clamping device 1 2 0 ~ Clamping seat 1 3 1 ~ Clamping section 1 3 3 ~ Loading surface 1 4 0 ~ Support arm 1 5 0 ~ Clamping arm 3 1 0 ~ First roller seat 3 3 0 ~ Upper brushing section 3 5 0 ~ Upper brushing arm 3 7 0 ~ Clamping positioning detection device 3 7 2 ~ Light blocking target 3 8 1 ~ First part 3 8 3 ~ Ring groove 2 ~ Upper brushing arm 1 1 ~ Clamping pin 1 3 ~ Rotary seat 1 5 ~ Clamping pin fixing seat 2 Brushing section 32, 33 ~ Lesser roller seat 3 5 ~ Lower brushing section 3 7 ~ Recessed section 1 1 0 ~ Rotary seat 130 ~ Clamping pin 1 3 2 ~ Abutment surface 1 3 4 ~ Protruding part 1 4 1 ~ Clamping pin holder 3 0 0 ~ Roller clamping device 3 2 0 ~ Second roller seat 3 4 0 ~ Lower brushing section 3 6 0 ~ Lower brushing arm 3 71 ~ Light shield Break sensor 3 8 0 ~ clamping roller 3 8 2 ~ second Part B, B ′ ~ contact area%

0503 -94951wf (η 1); TSMC2002 -1151; 1150; Hawdong. Ptd page 18 1223371 Schematic description of d ~ diameter W ~ wafer

0503-94951wf (η 1); TSMC2002 -1151; 1150; Hawdong. P td page 19

Claims (1)

1223371 ^ M 9210 ^ VI. Patent application scope1. A clamping device, a rotating seat; a misplacement seat, fixed to a plurality of support arms and a plurality of clamping pins extending outward, each of which has a clamp When holding the bearing surface, the abutment surface has the holding pin above the wafer surface, and is located on the bearing surface 2 · If the patent application scope is less than one clamping arm, set at the center and the clamping pin, move one angle. Said bracket is suitable for carrying a wafer, covering the rotary base, and having a direction from the center; and is provided on the support arms, wherein, the clamping portion has an abutment surface; and one by one When the wafer is positioned on the edge of the clamp, the wafer abuts between the abutment of each clamping pin and the protrusion. The clamping device described in the first item further includes a clamping base connected to the clamping base and used to push the clamping pin to rotate the clamping pin. In the clamping device, each support arm further has a clamping pin fixing seat, and each clamping pin is positioned above the clamping pin fixing seat. "4. The clamping device as described in item 1 of the scope of patent application, wherein the clamping pins are made of plastic. / 5 · —A clamping pin suitable for carrying a wafer, including: a A clamping portion; a bearing surface formed on the clamping portion; and an abutment surface formed on the clamping portion and perpendicular to the bearing surface 'wherein' the abutting mask has a protruding portion, When the wafer is positioned on the misfit pin, the edge of the wafer abuts against the resistance of the clamping pin 1223371 I No. 921f) FiS7Q 6. The scope of patent application, and it is located on the bearing surface. 6. If the scope of patent application, the holding pin is made of plastic. A roller clamping device includes: a first-roller seat; a first clamping roller, a part, a second groove is located in the part, and the J: _a means that there is a first the first ring and the Between the first and the protrusion. The clamping pin according to item 5, wherein the clamping is suitable for carrying and cleaning a wafer, and the package is arranged on the first roller base, and has a part and a first annular groove, wherein Between the first part and the second part, and the height of the two parts is greater than the thickness of the first groove, the first, the third, the second ring, and the thickness of the third groove. In the first 8. If a brush is placed on the surface of the wafer, two rollers, a misalignment part, and a groove part are formed. When this is in the first annular recess, please wash the upper part of the surface with the special part. A roller, a fourth series is located above the second roller groove and a range of the first wafer, and an annular recess is for the first roller base; and is not placed on the second roller base, and partly and A second annular groove between the third part and the fourth part: When the height of the four parts is greater than the second shape and is located on the roller clamping device, the seat is Close each other so that the wafer is in the second annular groove. Holding said roller means, the brushing portion, wherein the upper bit line i to the brushing portion and the lower portion scrubbing system is located below the wafer • The application of the roller in item 8 patentable scope clamping device, and more package 0503-94951wf 1 (η 1); TSMC2002-1151; 1150; Hawdong. P td page 21 6. The scope of patent application includes an it seat 1 washing arm 'connected to the upper brushing section. • σ applied for the scope of patent test No. 8, including-the lower brushing arm, connected to the lower brushing; roller clamping device, more 11. If the scope of patent application No. 7 second, third, including: clamp positioning detection The device is used for a two-roller clamping device, which is more accurately located in the first annular groove to determine whether the edge of the wafer is the same as that in the patent application scope. The left wheel clamping device: 3. As described in item U of the scope of patent application: No .: The clamping positioning detection device is provided in the second decaying wheel clamping device. The clamp positioning detection on the H seat is located in the Panmiao θ > • Among them, among the wheel clamp devices, the clamp blocks the target object: the roller clamp described in item 7 of the scope of profit , Set, its 1/1-miscarriage roller and the second cool roller system. The first holding roller system is made of synthetic resin, and the roller holding device described in item 7 of the first application / series is the rotation of the roller holding device] & Direction 18 · —A kind of clamping roller, including a first cylindrical portion; it has a light interrupting sensor and a light 0503-9495twfl (nl); TSMC2002.1151; 1150; Hawdong.ptd Section 22 Page 1223371 VI. Application ^ ----- ^^ —, shaped groove, formed under the first round one brother, two round gang Qiu ^ eight straight parts · The first mh MU column was bruised, formed in the Annulus, and the thickness of the groove. And the height of the 0-pillar part is greater than =, which is 80% of the shape of the clamping roller described in item 18 of the scope of the patent application, the * s clamping roller system is made of plastic to make. Among them, > 20. The misplacement roller as described in item 18 of the scope of patent application, wherein the clamping roller is made of synthetic resin. 0503-94951wf1 (η1); TSMC2002-1151; 1150; Hawdong.p t d